specially adapted for batch processes

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CPC
H01L2224/7598

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7598specially adapted for batch processes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for microelectronic assemblies having direct bonding
- Patent number 12,142,510
- Issue date Nov 12, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip transferring and device/module having gas guiding st...
- Patent number 12,106,981
- Issue date Oct 1, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,978,825
- Issue date May 7, 2024
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for transferring electronic device
- Patent number 11,973,054
- Issue date Apr 30, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method of fluidic assembly of microchips on a substrate
- Patent number 11,942,450
- Issue date Mar 26, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and film supply apparatus
- Patent number 11,848,219
- Issue date Dec 19, 2023
- Shinkawa Ltd.
- Yuichiro Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,848,301
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic device
- Patent number 11,843,085
- Issue date Dec 12, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for transfer of micro-devices
- Patent number 11,843,025
- Issue date Dec 12, 2023
- Applied Materials, Inc.
- Mingwei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter
- Patent number 11,837,523
- Issue date Dec 5, 2023
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head with large and small spray apertures
- Patent number 11,817,419
- Issue date Nov 14, 2023
- SHIBUYA CORPORATION
- Masato Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip bonding apparatus using VCSEL device
- Patent number 11,810,890
- Issue date Nov 7, 2023
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Mounting apparatus
- Patent number 11,769,749
- Issue date Sep 26, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,749,667
- Issue date Sep 5, 2023
- Kioxia Corporation
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat assisted flip chip bonding apparatus
- Patent number 11,682,650
- Issue date Jun 20, 2023
- National Pingtung University of Science and Technology
- Wei-Hua Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonder nozzle with vacuum relief features
- Patent number 11,652,080
- Issue date May 16, 2023
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING AND BONDING DEVICE
- Publication number 20240371664
- Publication date Nov 7, 2024
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS
- Publication number 20240258265
- Publication date Aug 1, 2024
- Mi Equipment Korea Co., Ltd
- Hyun Gu Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...
- Publication number 20240194633
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...
- Publication number 20240186280
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072230
- Publication date Feb 29, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING HEAD
- Publication number 20240063170
- Publication date Feb 22, 2024
- SHINKAWA LTD.
- Shinsuke FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DISPLAY PANEL, AND DETECTION AND BONDING AP...
- Publication number 20240047280
- Publication date Feb 8, 2024
- TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD.
- Kerui XI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047410
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HOLDER AND BONDING SYSTEM
- Publication number 20240014167
- Publication date Jan 11, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20230378121
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING
- Publication number 20230317676
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-PLANAR PEDESTAL FOR THERMAL COMPRESSION BONDING
- Publication number 20230317675
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVED WAFER STAGE
- Publication number 20230260954
- Publication date Aug 17, 2023
- NEXPERIA B.V.
- Joep Stokkermans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20230238351
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES
- Publication number 20230238352
- Publication date Jul 27, 2023
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE TRANSFER HEAD ASSEMBLY
- Publication number 20230120136
- Publication date Apr 20, 2023
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230076668
- Publication date Mar 9, 2023
- KIOXIA Corporation
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230011327
- Publication date Jan 12, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT ASSISTED FLIP CHIP BONDING APPARATUS
- Publication number 20220384383
- Publication date Dec 1, 2022
- National Pingtung University of Science and Technology
- Wei-Hua Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20220384412
- Publication date Dec 1, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20220367404
- Publication date Nov 17, 2022
- SHIBUYA CORPORATION
- Masato KITAGAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20220359455
- Publication date Nov 10, 2022
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COLLET
- Publication number 20220336281
- Publication date Oct 20, 2022
- Showa Denko Materials Co., Ltd.
- Tsuyoshi TAZAWA
- H01 - BASIC ELECTRIC ELEMENTS

specially adapted for batch processes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding of bridge to multiple semiconductor chips

Warpage control in the packaging of integrated circuits

Tools and systems for processing semiconductor devices, and methods...

Carrier for microelectronic assemblies having direct bonding

Method of chip transferring and device/module having gas guiding st...

Selective transfer of micro devices

Pressure sintering device and method for manufacturing an electroni...

Semiconductor manufacturing apparatus

LED with internally confined current injection area

Method for transferring electronic device

Device and method of fluidic assembly of microchips on a substrate

Low warpage curing methodology by inducing curvature

Mounting apparatus and film supply apparatus

Method of manufacturing a semiconductor package

Electronic device

Methods for transfer of micro-devices

Inverter

Bonding head with large and small spray apertures

Flip-chip bonding apparatus using VCSEL device

Light emitting diode display with redundancy scheme

Mounting apparatus

Semiconductor manufacturing apparatus

Bonding of bridge to multiple semiconductor chips

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Heat assisted flip chip bonding apparatus

Thermal compression bonder nozzle with vacuum relief features

Patents Applicationslast 30 patents

SELECTIVE TRANSFER OF MICRO DEVICES

CHIP TRANSFERRING AND BONDING DEVICE

BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...

ELECTRONIC DEVICE

MOUNTING HEAD

MANUFACTURING METHOD OF DISPLAY PANEL, AND DETECTION AND BONDING AP...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SUBSTRATE HOLDER AND BONDING SYSTEM

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

BONDING APPARATUS AND BONDING METHOD

BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING

NON-PLANAR PEDESTAL FOR THERMAL COMPRESSION BONDING

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

CURVED WAFER STAGE

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

MICRO DEVICE TRANSFER HEAD ASSEMBLY

METHOD FOR USING A BUFFER SHEET

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

HEAT ASSISTED FLIP CHIP BONDING APPARATUS

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

BONDING APPARATUS

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COLLET