Specific sequence of method steps

Industry

CPC
H01L2224/92

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/92Specific sequence of method steps

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 12,362,276
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated filter optical package
- Patent number 12,364,052
- Issue date Jul 15, 2025
- Texas Instruments Incorporated
- Steven Alfred Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,362,309
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
- Patent number 12,362,325
- Issue date Jul 15, 2025
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass carrier for die-up fan-out packaging and methods for making t...
- Patent number 12,354,996
- Issue date Jul 8, 2025
- Corning Incorporated
- Jin Su Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
- Patent number 12,347,802
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 12,347,731
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,347,749
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice integration into system substrate
- Patent number 12,349,527
- Issue date Jul 1, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate underfill formation for an integrated circuit ass...
- Patent number 12,341,121
- Issue date Jun 24, 2025
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,341,105
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device for improving internal quantum efficiency
- Patent number 12,334,485
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Jin Woo Choi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 12,334,406
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,334,425
- Issue date Jun 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 12,334,474
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode
- Patent number 12,334,481
- Issue date Jun 17, 2025
- PlayNitride Display Co., Ltd.
- Chi-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 12,327,807
- Issue date Jun 10, 2025
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 12,322,722
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device reflective bank structure
- Patent number 12,322,738
- Issue date Jun 3, 2025
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for package with interposers
- Patent number 12,322,670
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
- Patent number 12,293,972
- Issue date May 6, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT
- Publication number 20250239462
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- NAZILA DADVAND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250239561
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233107
- Publication date Jul 17, 2025
- Fuji Electric Co., Ltd.
- Ryotaro TSURUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250233111
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER
- Publication number 20250226365
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE DISPLAY PANEL WITH MICRO LENS ARRAY
- Publication number 20250226370
- Publication date Jul 10, 2025
- Jade Bird Display (Shanghai) Limited
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT FORMATION METHOD AND ELECTRICAL CIRCUIT FORMATIO...
- Publication number 20250226357
- Publication date Jul 10, 2025
- FUJI CORPORATION
- Ryo SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Shape-Memory Metallization
- Publication number 20250226338
- Publication date Jul 10, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE
- Publication number 20250219004
- Publication date Jul 3, 2025
- NITTO DENKO CORPORATION
- Masatoshi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250219010
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Methods Of Forming The Same
- Publication number 20250219024
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
- Publication number 20250210610
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
- Publication number 20250210608
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210576
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...
- Publication number 20250210451
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201678
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20250192095
- Publication date Jun 12, 2025
- TRON FUTURE TECH INC.
- KUAN-NENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER
- Publication number 20250183133
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chun Ping Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
- Publication number 20250183143
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183224
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- JIN-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20250183191
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250183140
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250174612
- Publication date May 29, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20250167007
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20250167180
- Publication date May 22, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250167159
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS

Specific sequence of method steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for laser drilling process for an integrated circuit package

Methods of packaging semiconductor devices and packaged semiconduct...

Semiconductor package having a semiconductor device bonded to a cir...

Integrated filter optical package

Package structure

Monolithic chip stacking using a die with double-sided interconnect...

Method for fabricating a chip package

Glass carrier for die-up fan-out packaging and methods for making t...

Die corner removal for underfill crack suppression in semiconductor...

Semiconductor components having conductive vias with aligned back s...

Semiconductor packages

Microdevice integration into system substrate

Through-substrate underfill formation for an integrated circuit ass...

Semiconductor device

Display device for improving internal quantum efficiency

Package with tilted interface between device die and encapsulating...

Electronic package and manufacturing method thereof

Forming recesses in molding compound of wafer to reduce stress

Micro light-emitting diode

High density substrate routing in package

Semiconductor device and manufacturing method thereof

Device and method for UBM/RDL routing

Power module semiconductor device and inverter equipment, and fabri...

Die attached leveling control by metal stopper bumps

Light emitting device reflective bank structure

Methods and apparatus for package with interposers

Package structure and manufacturing method thereof

Integrated circuit package and method of forming same

Semiconductor packages and methods of forming same

Semiconductor device and method of forming leadframe with clip bond...

Patents Applicationslast 30 patents

IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER

LIGHT-EMITTING DIODE DISPLAY PANEL WITH MICRO LENS ARRAY

ELECTRICAL CIRCUIT FORMATION METHOD AND ELECTRICAL CIRCUIT FORMATIO...

Power Semiconductor Devices Including Shape-Memory Metallization

CONNECTING STRUCTURE

SEMICONDUCTOR STRUCTURE

Semiconductor Packages And Methods Of Forming The Same

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP

INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER

METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Fan-Out Package Having a Main Die and a Dummy Die

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME