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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Patents Grants
last 30 patents
Information
Patent Grant
Method for laser drilling process for an integrated circuit package
Patent number
12,368,053
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Shen Cheng
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
Patent number
12,362,260
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
Patent number
12,362,276
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Feng-Cheng Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated filter optical package
Patent number
12,364,052
Issue date
Jul 15, 2025
Texas Instruments Incorporated
Steven Alfred Kummerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
12,362,309
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
Patent number
12,362,325
Issue date
Jul 15, 2025
Intel Corporation
Anup Pancholi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a chip package
Patent number
12,362,178
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Glass carrier for die-up fan-out packaging and methods for making t...
Patent number
12,354,996
Issue date
Jul 8, 2025
Corning Incorporated
Jin Su Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
Patent number
12,347,802
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
12,347,731
Issue date
Jul 1, 2025
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
12,347,749
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microdevice integration into system substrate
Patent number
12,349,527
Issue date
Jul 1, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-substrate underfill formation for an integrated circuit ass...
Patent number
12,341,121
Issue date
Jun 24, 2025
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,341,105
Issue date
Jun 24, 2025
Shinko Electric Industries Co., Ltd.
Kenichi Koi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device for improving internal quantum efficiency
Patent number
12,334,485
Issue date
Jun 17, 2025
Samsung Display Co., Ltd.
Jin Woo Choi
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Package with tilted interface between device die and encapsulating...
Patent number
12,334,406
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Yen Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and manufacturing method thereof
Patent number
12,334,425
Issue date
Jun 17, 2025
Siliconware Precision Industries Co., Ltd.
Ho-Chuan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming recesses in molding compound of wafer to reduce stress
Patent number
12,334,474
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro light-emitting diode
Patent number
12,334,481
Issue date
Jun 17, 2025
PlayNitride Display Co., Ltd.
Chi-Heng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density substrate routing in package
Patent number
12,327,807
Issue date
Jun 10, 2025
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,327,812
Issue date
Jun 10, 2025
Amkor Technology Singapore Holding Pte Ltd.
Yeong Beom Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for UBM/RDL routing
Patent number
12,322,727
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tsan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
12,322,683
Issue date
Jun 3, 2025
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die attached leveling control by metal stopper bumps
Patent number
12,322,722
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device reflective bank structure
Patent number
12,322,738
Issue date
Jun 3, 2025
Apple Inc.
Kapil V. Sakariya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for package with interposers
Patent number
12,322,670
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
12,315,831
Issue date
May 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method of forming same
Patent number
12,294,002
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
12,293,991
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
Patent number
12,293,972
Issue date
May 6, 2025
UTAC HEADQUARTERS PTE. LTD.
Natawat Kasikornrungroj
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT
Publication number
20250239462
Publication date
Jul 24, 2025
TEXAS INSTRUMENTS INCORPORATED
NAZILA DADVAND
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
Publication number
20250239561
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250233107
Publication date
Jul 17, 2025
Fuji Electric Co., Ltd.
Ryotaro TSURUOKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20250233115
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
Publication number
20250233111
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Shiuan Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250233119
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250226296
Publication date
Jul 10, 2025
ROHM CO., LTD.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER
Publication number
20250226365
Publication date
Jul 10, 2025
QUALCOMM Incorporated
Je-Hsiung LAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT-EMITTING DIODE DISPLAY PANEL WITH MICRO LENS ARRAY
Publication number
20250226370
Publication date
Jul 10, 2025
Jade Bird Display (Shanghai) Limited
Lei ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL CIRCUIT FORMATION METHOD AND ELECTRICAL CIRCUIT FORMATIO...
Publication number
20250226357
Publication date
Jul 10, 2025
FUJI CORPORATION
Ryo SAKAKIBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Semiconductor Devices Including Shape-Memory Metallization
Publication number
20250226338
Publication date
Jul 10, 2025
Wolfspeed, Inc.
Afshin Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTING STRUCTURE
Publication number
20250219004
Publication date
Jul 3, 2025
NITTO DENKO CORPORATION
Masatoshi KATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20250219010
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages And Methods Of Forming The Same
Publication number
20250219024
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
Publication number
20250210610
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
Publication number
20250210608
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Lipu Kris Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250210576
Publication date
Jun 26, 2025
Samsung Electronics Co., Ltd.
Youngbae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...
Publication number
20250210451
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Hsuan Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
Publication number
20250201617
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250201678
Publication date
Jun 19, 2025
RENESAS ELECTRONICS CORPORATION
Yasutaka NAKASHIBA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20250192095
Publication date
Jun 12, 2025
TRON FUTURE TECH INC.
KUAN-NENG CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER
Publication number
20250183133
Publication date
Jun 5, 2025
TEXAS INSTRUMENTS INCORPORATED
Chun Ping Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
Publication number
20250183143
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250183224
Publication date
Jun 5, 2025
Samsung Electronics Co., Ltd.
JIN-WOO PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
Publication number
20250183191
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Yan-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20250183140
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Tzu-Sheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20250174612
Publication date
May 29, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Hyun Goo Cha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
Publication number
20250167007
Publication date
May 22, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Devarajan Balaraman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
Publication number
20250167180
Publication date
May 22, 2025
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250167159
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi WU
H01 - BASIC ELECTRIC ELEMENTS