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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
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Patents Grants
last 30 patents
Information
Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
Patent number
12,347,802
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
12,347,749
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
12,347,731
Issue date
Jul 1, 2025
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microdevice integration into system substrate
Patent number
12,349,527
Issue date
Jul 1, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-substrate underfill formation for an integrated circuit ass...
Patent number
12,341,121
Issue date
Jun 24, 2025
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,341,105
Issue date
Jun 24, 2025
Shinko Electric Industries Co., Ltd.
Kenichi Koi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device for improving internal quantum efficiency
Patent number
12,334,485
Issue date
Jun 17, 2025
Samsung Display Co., Ltd.
Jin Woo Choi
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Package with tilted interface between device die and encapsulating...
Patent number
12,334,406
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Yen Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and manufacturing method thereof
Patent number
12,334,425
Issue date
Jun 17, 2025
Siliconware Precision Industries Co., Ltd.
Ho-Chuan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming recesses in molding compound of wafer to reduce stress
Patent number
12,334,474
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro light-emitting diode
Patent number
12,334,481
Issue date
Jun 17, 2025
PlayNitride Display Co., Ltd.
Chi-Heng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density substrate routing in package
Patent number
12,327,807
Issue date
Jun 10, 2025
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,327,812
Issue date
Jun 10, 2025
Amkor Technology Singapore Holding Pte Ltd.
Yeong Beom Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for UBM/RDL routing
Patent number
12,322,727
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tsan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
12,322,683
Issue date
Jun 3, 2025
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die attached leveling control by metal stopper bumps
Patent number
12,322,722
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device reflective bank structure
Patent number
12,322,738
Issue date
Jun 3, 2025
Apple Inc.
Kapil V. Sakariya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for package with interposers
Patent number
12,322,670
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
12,315,831
Issue date
May 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method of forming same
Patent number
12,294,002
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
12,293,991
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
Patent number
12,293,972
Issue date
May 6, 2025
UTAC HEADQUARTERS PTE. LTD.
Natawat Kasikornrungroj
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for packaging stacking flip chip
Patent number
12,293,984
Issue date
May 6, 2025
Hebei Beixin Semiconductor Technology Co., Ltd.
Honglei Ran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,288,739
Issue date
Apr 29, 2025
Rohm Co., Ltd.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with embedded wiring on re-distributed bumps
Patent number
12,288,770
Issue date
Apr 29, 2025
NXP B.V.
Kuan-Hsiang Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
12,283,555
Issue date
Apr 22, 2025
Analog Devices International Unlimited Company
Bilge Bayrakci
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection using fanout interposer chiplet
Patent number
12,283,549
Issue date
Apr 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package including electronic structure and electronic bo...
Patent number
12,283,560
Issue date
Apr 22, 2025
Siliconware Precision Industries Co., Ltd.
Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
Patent number
12,278,227
Issue date
Apr 15, 2025
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component and method for producing a component
Patent number
12,278,318
Issue date
Apr 15, 2025
Osram Opto Semiconductors GmbH
Thomas Schwarz
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20250219010
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTING STRUCTURE
Publication number
20250219004
Publication date
Jul 3, 2025
NITTO DENKO CORPORATION
Masatoshi KATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages And Methods Of Forming The Same
Publication number
20250219024
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
Publication number
20250210610
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
Publication number
20250210608
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Lipu Kris Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250210576
Publication date
Jun 26, 2025
Samsung Electronics Co., Ltd.
Youngbae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...
Publication number
20250210451
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Hsuan Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
Publication number
20250201617
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250201678
Publication date
Jun 19, 2025
RENESAS ELECTRONICS CORPORATION
Yasutaka NAKASHIBA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20250192095
Publication date
Jun 12, 2025
TRON FUTURE TECH INC.
KUAN-NENG CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER
Publication number
20250183133
Publication date
Jun 5, 2025
TEXAS INSTRUMENTS INCORPORATED
Chun Ping Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
Publication number
20250183143
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250183224
Publication date
Jun 5, 2025
Samsung Electronics Co., Ltd.
JIN-WOO PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
Publication number
20250183191
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Yan-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20250183140
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Tzu-Sheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20250174612
Publication date
May 29, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Hyun Goo Cha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
Publication number
20250167007
Publication date
May 22, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Devarajan Balaraman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
Publication number
20250167180
Publication date
May 22, 2025
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250167159
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer Level Integration of Passive Devices
Publication number
20250167176
Publication date
May 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
Publication number
20250160096
Publication date
May 15, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...
Publication number
20250157894
Publication date
May 15, 2025
Alpha and Omega Semiconductor International LP
Yan Xun Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHOD AND LEAD FRAME WITH SIDE PO...
Publication number
20250157829
Publication date
May 15, 2025
TEXAS INSTRUMENTS INCORPORATED
Mark Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20250157939
Publication date
May 15, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Publication number
20250157985
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
Publication number
20250160095
Publication date
May 15, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
Publication number
20250157956
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
Publication number
20250157971
Publication date
May 15, 2025
Institute of Semiconductors, Guangdong Academy of Sciences
Chuan HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Publication number
20250157975
Publication date
May 15, 2025
NITTO DENKO CORPORATION
Tsubasa OMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D-IC FOR RF APPLICATIONS
Publication number
20250157988
Publication date
May 15, 2025
INFINEON TECHNOLOGIES AG
Hans Taddiken
H01 - BASIC ELECTRIC ELEMENTS