Membership
Tour
Register
Log in
Specific sequence of method steps
Follow
Industry
CPC
H01L24/92
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
Current Industry
H01L24/92
Specific sequence of method steps
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Method for laser drilling process for an integrated circuit package
Patent number
12,368,053
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Shen Cheng
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
Patent number
12,362,260
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated filter optical package
Patent number
12,364,052
Issue date
Jul 15, 2025
Texas Instruments Incorporated
Steven Alfred Kummerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
Patent number
12,362,325
Issue date
Jul 15, 2025
Intel Corporation
Anup Pancholi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
Patent number
12,347,802
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microdevice integration into system substrate
Patent number
12,349,527
Issue date
Jul 1, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,341,105
Issue date
Jun 24, 2025
Shinko Electric Industries Co., Ltd.
Kenichi Koi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device for improving internal quantum efficiency
Patent number
12,334,485
Issue date
Jun 17, 2025
Samsung Display Co., Ltd.
Jin Woo Choi
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Electronic package and manufacturing method thereof
Patent number
12,334,425
Issue date
Jun 17, 2025
Siliconware Precision Industries Co., Ltd.
Ho-Chuan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming recesses in molding compound of wafer to reduce stress
Patent number
12,334,474
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro light-emitting diode
Patent number
12,334,481
Issue date
Jun 17, 2025
PlayNitride Display Co., Ltd.
Chi-Heng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for UBM/RDL routing
Patent number
12,322,727
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tsan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die attached leveling control by metal stopper bumps
Patent number
12,322,722
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method of forming same
Patent number
12,294,002
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
12,293,991
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
Patent number
12,293,972
Issue date
May 6, 2025
UTAC HEADQUARTERS PTE. LTD.
Natawat Kasikornrungroj
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for packaging stacking flip chip
Patent number
12,293,984
Issue date
May 6, 2025
Hebei Beixin Semiconductor Technology Co., Ltd.
Honglei Ran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,288,739
Issue date
Apr 29, 2025
Rohm Co., Ltd.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with embedded wiring on re-distributed bumps
Patent number
12,288,770
Issue date
Apr 29, 2025
NXP B.V.
Kuan-Hsiang Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection using fanout interposer chiplet
Patent number
12,283,549
Issue date
Apr 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package including electronic structure and electronic bo...
Patent number
12,283,560
Issue date
Apr 22, 2025
Siliconware Precision Industries Co., Ltd.
Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
Patent number
12,278,227
Issue date
Apr 15, 2025
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component and method for producing a component
Patent number
12,278,318
Issue date
Apr 15, 2025
Osram Opto Semiconductors GmbH
Thomas Schwarz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor structure including a barrier s...
Patent number
12,278,208
Issue date
Apr 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Underfill film for semiconductor package and method for manufacturi...
Patent number
12,278,117
Issue date
Apr 15, 2025
Doosan Corporation
Taejin Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacking structure, package structure and method of fabricating the...
Patent number
12,272,674
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-bump sidewall protection
Patent number
12,272,663
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Hua Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding method
Patent number
12,266,623
Issue date
Apr 1, 2025
SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
Yunzhi Ling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device with substrate for el...
Patent number
12,266,649
Issue date
Apr 1, 2025
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Info structure with copper pillar having reversed profile
Patent number
12,261,074
Issue date
Mar 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT
Publication number
20250239462
Publication date
Jul 24, 2025
TEXAS INSTRUMENTS INCORPORATED
NAZILA DADVAND
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
Publication number
20250239561
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250233107
Publication date
Jul 17, 2025
Fuji Electric Co., Ltd.
Ryotaro TSURUOKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20250233115
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
Publication number
20250233111
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Shiuan Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250233119
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250226296
Publication date
Jul 10, 2025
ROHM CO., LTD.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER
Publication number
20250226365
Publication date
Jul 10, 2025
QUALCOMM Incorporated
Je-Hsiung LAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL CIRCUIT FORMATION METHOD AND ELECTRICAL CIRCUIT FORMATIO...
Publication number
20250226357
Publication date
Jul 10, 2025
FUJI CORPORATION
Ryo SAKAKIBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Semiconductor Devices Including Shape-Memory Metallization
Publication number
20250226338
Publication date
Jul 10, 2025
Wolfspeed, Inc.
Afshin Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTING STRUCTURE
Publication number
20250219004
Publication date
Jul 3, 2025
NITTO DENKO CORPORATION
Masatoshi KATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20250219010
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
Publication number
20250210610
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
Publication number
20250210608
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Lipu Kris Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250210576
Publication date
Jun 26, 2025
Samsung Electronics Co., Ltd.
Youngbae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...
Publication number
20250210451
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Hsuan Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
Publication number
20250201617
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20250192095
Publication date
Jun 12, 2025
TRON FUTURE TECH INC.
KUAN-NENG CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER
Publication number
20250183133
Publication date
Jun 5, 2025
TEXAS INSTRUMENTS INCORPORATED
Chun Ping Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
Publication number
20250183143
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250183224
Publication date
Jun 5, 2025
Samsung Electronics Co., Ltd.
JIN-WOO PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20250183140
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Tzu-Sheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20250174612
Publication date
May 29, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Hyun Goo Cha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250167159
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
Publication number
20250160096
Publication date
May 15, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...
Publication number
20250157894
Publication date
May 15, 2025
Alpha and Omega Semiconductor International LP
Yan Xun Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHOD AND LEAD FRAME WITH SIDE PO...
Publication number
20250157829
Publication date
May 15, 2025
TEXAS INSTRUMENTS INCORPORATED
Mark Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20250157939
Publication date
May 15, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Publication number
20250157985
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
Publication number
20250160095
Publication date
May 15, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS