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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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Patents Grants
last 30 patents
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Patent Grant
Integrated circuit package and method of forming same
Patent number
12,294,002
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
12,293,991
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
Patent number
12,293,972
Issue date
May 6, 2025
UTAC HEADQUARTERS PTE. LTD.
Natawat Kasikornrungroj
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for packaging stacking flip chip
Patent number
12,293,984
Issue date
May 6, 2025
Hebei Beixin Semiconductor Technology Co., Ltd.
Honglei Ran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,288,739
Issue date
Apr 29, 2025
Rohm Co., Ltd.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with embedded wiring on re-distributed bumps
Patent number
12,288,770
Issue date
Apr 29, 2025
NXP B.V.
Kuan-Hsiang Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection using fanout interposer chiplet
Patent number
12,283,549
Issue date
Apr 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package including electronic structure and electronic bo...
Patent number
12,283,560
Issue date
Apr 22, 2025
Siliconware Precision Industries Co., Ltd.
Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
Patent number
12,278,227
Issue date
Apr 15, 2025
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component and method for producing a component
Patent number
12,278,318
Issue date
Apr 15, 2025
Osram Opto Semiconductors GmbH
Thomas Schwarz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor structure including a barrier s...
Patent number
12,278,208
Issue date
Apr 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Underfill film for semiconductor package and method for manufacturi...
Patent number
12,278,117
Issue date
Apr 15, 2025
Doosan Corporation
Taejin Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacking structure, package structure and method of fabricating the...
Patent number
12,272,674
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-bump sidewall protection
Patent number
12,272,663
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Hua Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device with substrate for el...
Patent number
12,266,649
Issue date
Apr 1, 2025
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding method
Patent number
12,266,623
Issue date
Apr 1, 2025
SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
Yunzhi Ling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Info structure with copper pillar having reversed profile
Patent number
12,261,074
Issue date
Mar 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
Patent number
12,255,076
Issue date
Mar 18, 2025
STMicroelectronics, Inc.
Ian Harvey Arellano
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
Patent number
12,249,564
Issue date
Mar 11, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method of forming same
Patent number
12,243,843
Issue date
Mar 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Circuits including micropatterns and using partial curing to adhere...
Patent number
12,237,292
Issue date
Feb 25, 2025
3M Innovative Properties Company
Teresa M. Goeddel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to radio-frequency filters on silicon-o...
Patent number
12,237,861
Issue date
Feb 25, 2025
Skyworks Solutions, Inc.
James Phillip Young
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacture of semiconductor de...
Patent number
12,237,248
Issue date
Feb 25, 2025
AOI Electronics Co., Ltd.
Katsuhiro Takao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,237,239
Issue date
Feb 25, 2025
Amkor Technology Singapore Holding Pte Ltd.
Jin Young Khim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mixed hybrid bonding structures and methods of forming the same
Patent number
12,224,261
Issue date
Feb 11, 2025
Intel Corporation
Shawna Liff
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package and method of forming same
Patent number
12,222,545
Issue date
Feb 11, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro LED display and manufacturing method therefor
Patent number
12,218,295
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Byunghoon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Camera module, and photosensitive assembly and manufacturing method...
Patent number
12,211,864
Issue date
Jan 28, 2025
NINGBO SUNNY OPOTECH CO., LTD.
Zhongyu Luan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and devices using microchannels for interconnections
Patent number
12,205,882
Issue date
Jan 21, 2025
3M Innovative Properties Company
Kayla C. Niccum
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated power switching device heat sink
Patent number
12,199,020
Issue date
Jan 14, 2025
American Axle & Manufacturing, Inc.
James P. Downs
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250167159
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
Publication number
20250160096
Publication date
May 15, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20250157939
Publication date
May 15, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Publication number
20250157985
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHOD AND LEAD FRAME WITH SIDE PO...
Publication number
20250157829
Publication date
May 15, 2025
TEXAS INSTRUMENTS INCORPORATED
Mark Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...
Publication number
20250157894
Publication date
May 15, 2025
Alpha and Omega Semiconductor International LP
Yan Xun Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
Publication number
20250160095
Publication date
May 15, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
Publication number
20250157971
Publication date
May 15, 2025
Institute of Semiconductors, Guangdong Academy of Sciences
Chuan HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Publication number
20250157975
Publication date
May 15, 2025
NITTO DENKO CORPORATION
Tsubasa OMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D-IC FOR RF APPLICATIONS
Publication number
20250157988
Publication date
May 15, 2025
INFINEON TECHNOLOGIES AG
Hans Taddiken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
Publication number
20250157940
Publication date
May 15, 2025
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR EL...
Publication number
20250158006
Publication date
May 15, 2025
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
Publication number
20250150113
Publication date
May 8, 2025
Skyworks Solutions, Inc.
James Phillip YOUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
Publication number
20250151421
Publication date
May 8, 2025
UTAC Headquarters Pte. Ltd.
Jeffrey Punzalan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE
Publication number
20250140653
Publication date
May 1, 2025
TEXAS INSTRUMENTS INCORPORATED
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
Publication number
20250140730
Publication date
May 1, 2025
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FOR FLIP CHIP PACKAGING
Publication number
20250132288
Publication date
Apr 24, 2025
YIN-JUI SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20250132220
Publication date
Apr 24, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Dong Hyeon Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES
Publication number
20250132289
Publication date
Apr 24, 2025
NEXPERIA B.V.
Antonio B. Dimaano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250132214
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER
Publication number
20250125302
Publication date
Apr 17, 2025
Samsung Electronics Co., Ltd.
Jing Cheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
Publication number
20250112198
Publication date
Apr 3, 2025
Intel Corporation
Pratyasha Mohapatra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL THERMAL DISSIPATION STRU...
Publication number
20250112114
Publication date
Apr 3, 2025
TEXAS INSTRUMENTS INCORPORATED
Ninad Shahane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250112134
Publication date
Apr 3, 2025
Mitsubishi Electric Corporation
Yoshihisa UCHIDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A CIRCUIT ARRANGEMENT FOR AN ELECTRIC MACHINE,...
Publication number
20250112214
Publication date
Apr 3, 2025
Audi AG
Daniel RUPPERT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250105169
Publication date
Mar 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Leu-Jen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING ME...
Publication number
20250105087
Publication date
Mar 27, 2025
Samsung Electronics Co., Ltd.
Chunyan RUAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER
Publication number
20250105200
Publication date
Mar 27, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Seokbong KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...
Publication number
20250096183
Publication date
Mar 20, 2025
Renesas Electronics America Inc.
Martin Ashley VAGUES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
Publication number
20250096009
Publication date
Mar 20, 2025
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS