Specific sequence of method steps

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H01L2224/80906

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80906Specific sequence of method steps

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Patents Grantslast 30 patents

Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 11,810,891
- Issue date Nov 7, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembly by direct bonding between two elements, each ele...
- Patent number 11,305,372
- Issue date Apr 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 10,937,755
- Issue date Mar 2, 2021
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pad structure for hybrid bonding and methods of forming...
- Patent number 10,177,106
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pad structure for hybrid bonding and methods of forming...
- Patent number 9,842,816
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pad structure for hybrid bonding and methods of forming...
- Patent number 9,437,572
- Issue date Sep 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20240304593
- Publication date Sep 12, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHO...
- Publication number 20240222315
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20210183810
- Publication date Jun 17, 2021
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20200006280
- Publication date Jan 2, 2020
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Pad Structure for Hybrid Bonding and Methods of Forming...
- Publication number 20180068965
- Publication date Mar 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS