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  • CPC
  • H01L2224/84986
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/84986Specific sequence of steps
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method for die and clip attachment
    • Patent number 11,289,447
    • Issue date Mar 29, 2022
    • Alpha Assembly Solutions, Inc.
    • Oscar Khaselev
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-clip structure for die bonding
    • Patent number 11,189,592
    • Issue date Nov 30, 2021
    • Infineon Technologies Austria AG
    • Balehithlu Manjappaiah Upendra
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Multi-Clip Structure for Die Bonding
    • Publication number 20200105707
    • Publication date Apr 2, 2020
    • Balehithlu Manjappaiah Upendra
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method for Die and Clip Attachment
    • Publication number 20180166415
    • Publication date Jun 14, 2018
    • Alpha Assembly Solutions Inc.
    • Oscar Khaselev
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-Die Package with Separate Inter-Die Interconnects
    • Publication number 20140240945
    • Publication date Aug 28, 2014
    • Infineon Technologies Austria AG
    • Khalil Hosseini
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked Semiconductor Package
    • Publication number 20130256852
    • Publication date Oct 3, 2013
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS