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H01L2224/83986

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83986Specific sequence of steps

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 12,009,339
- Issue date Jun 11, 2024
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method of electronic device
- Patent number 11,948,908
- Issue date Apr 2, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate
- Patent number 11,948,907
- Issue date Apr 2, 2024
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package manufacturing method, and adhesive sheet used...
- Patent number 11,935,865
- Issue date Mar 19, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,854,783
- Issue date Dec 26, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 11,848,303
- Issue date Dec 19, 2023
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus, and method of manufacturing...
- Patent number 11,823,924
- Issue date Nov 21, 2023
- Kioxia Corporation
- Aoi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor package including filling me...
- Patent number 11,450,535
- Issue date Sep 20, 2022
- Nepes Co., Ltd.
- Yong-Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for die and clip attachment
- Patent number 11,289,447
- Issue date Mar 29, 2022
- Alpha Assembly Solutions, Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,195,741
- Issue date Dec 7, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor with external electrode
- Patent number 11,037,865
- Issue date Jun 15, 2021
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,937,674
- Issue date Mar 2, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,903,188
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material on package
- Patent number 10,896,862
- Issue date Jan 19, 2021
- International Business Machines Corporation
- Isabel De Sousa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, and mounting device
- Patent number 10,896,901
- Issue date Jan 19, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,886,252
- Issue date Jan 5, 2021
- Imec VZW
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including heating and...
- Patent number 10,669,454
- Issue date Jun 2, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,636,838
- Issue date Apr 28, 2020
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a substrate arrangement, substrate arrangement...
- Patent number 10,622,331
- Issue date Apr 14, 2020
- Heraeus Deutschland GmbH & Co. KG
- Andreas Hinrich
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device with solders of different melting points and m...
- Patent number 10,622,285
- Issue date Apr 14, 2020
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor chips
- Patent number 10,607,962
- Issue date Mar 31, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,600,729
- Issue date Mar 24, 2020
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with barrier layer
- Patent number 10,593,621
- Issue date Mar 17, 2020
- Shinko Electric Industries Co., Ltd.
- Keigo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 10,568,245
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 10,535,546
- Issue date Jan 14, 2020
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120354
- Publication date Apr 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING...
- Publication number 20220285181
- Publication date Sep 8, 2022
- KIOXIA Corporation
- Aoi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Chip Integration of III-Nitride-based Materials for O...
- Publication number 20220278073
- Publication date Sep 1, 2022
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John Michael Dallesasse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
- Publication number 20220271004
- Publication date Aug 25, 2022
- Seoul National University R&DB Foundation
- Yongtaek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20220230989
- Publication date Jul 21, 2022
- Nitto Denko Corporation
- Mayu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
- Publication number 20220059496
- Publication date Feb 24, 2022
- Seoul National University R&DB Foundation
- Yongtaek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20220005780
- Publication date Jan 6, 2022
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE
- Publication number 20210407952
- Publication date Dec 30, 2021
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD, AND ADHESIVE SHEET USED...
- Publication number 20210327848
- Publication date Oct 21, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-DEVICE-FORMED SAPPHIRE SUBSTRATE, METHOD OF MANUFACTU...
- Publication number 20210151354
- Publication date May 20, 2021
- V Technology Co., LTD.
- Yoshikatsu YANAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20200203261
- Publication date Jun 25, 2020
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20200095481
- Publication date Mar 26, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS
- Publication number 20190326253
- Publication date Oct 24, 2019
- International Business Machines Corporation
- ERIC J. CAMPBELL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE
- Publication number 20190312020
- Publication date Oct 10, 2019
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190221513
- Publication date Jul 18, 2019
- Samsung Electronics Co., Ltd.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING BY DIRECT ADHESION A FIRST SUBSTRATE TO A SECOND...
- Publication number 20190181114
- Publication date Jun 13, 2019
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20180247914
- Publication date Aug 30, 2018
- IMEC vzw
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL ON PACKAGE
- Publication number 20180190565
- Publication date Jul 5, 2018
- International Business Machines Corporation
- Isabel DE SOUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL ON PACKAGE
- Publication number 20180047655
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Isabel DE SOUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20180012833
- Publication date Jan 11, 2018
- Kabushiki Kaisha Toyota Jidoshokki
- Naoki KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...
- Publication number 20170347504
- Publication date Nov 30, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY
- Publication number 20170154867
- Publication date Jun 1, 2017
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY
- Publication number 20170103903
- Publication date Apr 13, 2017
- Shindengen Electric Manufacturing Co., Ltd.
- Ryo MATSUBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Method, Storage Medium, Bonding Apparatus and Bonding System
- Publication number 20160155721
- Publication date Jun 2, 2016
- TOKYO ELECTRON LIMITED
- Kenji SUGAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM MOLDING APPARATUS, SUBSTRATE PROCESSING SYSTEM HAVING THE SA...
- Publication number 20150056754
- Publication date Feb 26, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Seock Hyun Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORA...
- Publication number 20140361429
- Publication date Dec 11, 2014
- Renesas SP Drivers Inc.
- Hisao Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
- Publication number 20140353540
- Publication date Dec 4, 2014
- SUNRAY SCIENTIFIC, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Methods For Temporary Wafer Molding For Chip-On-Wafer Assembly
- Publication number 20140134800
- Publication date May 15, 2014
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS

Specific sequence of steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing semiconductor device

Electronic device and method of transferring electronic element usi...

Electronic device and manufacturing method of electronic device

Laminate

Semiconductor package manufacturing method, and adhesive sheet used...

Micro device arrangement in donor substrate

Electronic device and method of transferring electronic element usi...

Semiconductor manufacturing apparatus, and method of manufacturing...

Adhesive for semiconductor device, and high productivity method for...

Chip assembly

Manufacturing method for semiconductor package including filling me...

Method for die and clip attachment

Micro device arrangement in donor substrate

Semiconductor with external electrode

Method for transferring micro device

Selectively cross-linked thermal interface materials

Thermal interface material on package

Method of manufacturing semiconductor device, and mounting device

Method of bonding semiconductor substrates

Method for manufacturing semiconductor device including heating and...

Chip assembly

Integrated multi-color light-emitting pixel arrays based devices by...

Method for producing a substrate arrangement, substrate arrangement...

Semiconductor device with solders of different melting points and m...

Method for manufacturing semiconductor chips

Semiconductor package

Semiconductor device with barrier layer

Electronic-component mounting apparatus

Micro device arrangement in donor substrate

Method for manufacturing semiconductor apparatus, method for manufa...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

METHOD FOR USING A BUFFER SHEET

SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING...

Heterogeneous Chip Integration of III-Nitride-based Materials for O...

ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

LAMINATE

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD, AND ADHESIVE SHEET USED...

SEMICONDUCTOR-DEVICE-FORMED SAPPHIRE SUBSTRATE, METHOD OF MANUFACTU...

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE

SEMICONDUCTOR PACKAGE

METHOD FOR BONDING BY DIRECT ADHESION A FIRST SUBSTRATE TO A SECOND...

METHOD OF BONDING SEMICONDUCTOR SUBSTRATES

THERMAL INTERFACE MATERIAL ON PACKAGE

THERMAL INTERFACE MATERIAL ON PACKAGE

SEMICONDUCTOR MODULE

ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...

METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY

METHOD OF MANUFACTURING BONDED BODY

Bonding Method, Storage Medium, Bonding Apparatus and Bonding System

VACUUM MOLDING APPARATUS, SUBSTRATE PROCESSING SYSTEM HAVING THE SA...

SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORA...

Anisotropic Conductive Adhesive with Reduced Migration

Methods For Temporary Wafer Molding For Chip-On-Wafer Assembly