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H01L2224/81986

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81986Specific sequence of steps

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package manufacturing method, and adhesive sheet used...
- Patent number 11,935,865
- Issue date Mar 19, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimentional packaging method and package structure of photoni...
- Patent number 11,789,218
- Issue date Oct 17, 2023
- Hangzhou Guangzhiyuan Technology Co., Ltd.
- Yichen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package interface with improved impedance continuity
- Patent number 11,756,905
- Issue date Sep 12, 2023
- CREDO TECHNOLOGY GROUP LIMITED
- Mengying Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,749,667
- Issue date Sep 5, 2023
- Kioxia Corporation
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,664,320
- Issue date May 30, 2023
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing and filling containers
- Patent number 11,345,073
- Issue date May 31, 2022
- KHS GmbH
- Ludwig Clüsserath
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,342,301
- Issue date May 24, 2022
- Kulicke and Soffa Industries, Inc.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer stamp
- Patent number 11,318,663
- Issue date May 3, 2022
- X Display Company Technology Limited
- Tanya Yvette Moore
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
High density interconnect device and method
- Patent number 11,158,578
- Issue date Oct 26, 2021
- Intel Corporation
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed under bump metallurgy (UBM) interconnect bridge structure
- Patent number 11,139,269
- Issue date Oct 5, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,049,839
- Issue date Jun 29, 2021
- Kulicke and Soffa Industries, Inc.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,024,619
- Issue date Jun 1, 2021
- TOSHIBA MEMORY CORPORATION
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge support structure
- Patent number 10,957,650
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure of wafer-level system-in-pac...
- Patent number 10,930,617
- Issue date Feb 23, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer stamp
- Patent number 10,899,067
- Issue date Jan 26, 2021
- X Display Company Technology Limited
- Tanya Yvette Moore
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing semiconductor device, and mounting device
- Patent number 10,896,901
- Issue date Jan 19, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 10,847,485
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED module and method for fabricating the same
- Patent number 10,847,504
- Issue date Nov 24, 2020
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level system-in-package structure and electronic apparatus th...
- Patent number 10,811,385
- Issue date Oct 20, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for wafer-level system in package
- Patent number 10,756,056
- Issue date Aug 25, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
- Patent number 10,734,346
- Issue date Aug 4, 2020
- ELPIS TECHNOLOGIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
- Patent number 10,446,479
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 10,446,499
- Issue date Oct 15, 2019
- Intel Corporation
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,418,315
- Issue date Sep 17, 2019
- Fujitsu Limited
- Hironori Kawaminami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 10,412,834
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20250046776
- Publication date Feb 6, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20230411346
- Publication date Dec 21, 2023
- STATS ChipPAC Pte Ltd.
- JoonYoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MONITORING GAS BYPRODUCTS OF A BONDING SYSTEM, AND RELAT...
- Publication number 20230260953
- Publication date Aug 17, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20230253337
- Publication date Aug 10, 2023
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-REMELT SOLDER ENFORCEMENT JOINT
- Publication number 20230137877
- Publication date May 4, 2023
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENTIONAL PACKAGING METHOD AND PACKAGE STRUCTURE OF PHOTONI...
- Publication number 20220365295
- Publication date Nov 17, 2022
- Hangzhou Guangzhiyuan Technology Co., Ltd.
- Samuel Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly Packaging Method, Semiconductor Assembly and...
- Publication number 20220216176
- Publication date Jul 7, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20220028790
- Publication date Jan 27, 2022
- Intel Corporation
- MIHIR K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Interface with Improved Impedance Continuity
- Publication number 20210375798
- Publication date Dec 2, 2021
- CREDO TECHNOLOGY GROUP LIMITED
- Mengying MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD, AND ADHESIVE SHEET USED...
- Publication number 20210327848
- Publication date Oct 21, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CHIP INITIAL STRUCTURE, SUBSTRATE STRUCTURE, CHIP TRANSFERRING...
- Publication number 20210320088
- Publication date Oct 14, 2021
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20210242191
- Publication date Aug 5, 2021
- Toshiba Memory Corporation
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure
- Publication number 20210233892
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER STAMP
- Publication number 20210101329
- Publication date Apr 8, 2021
- X Display Company Technology Limited
- Tanya Yvette Moore
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210066230
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE SUPPORT STRUCTURE
- Publication number 20210057341
- Publication date Feb 25, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200203300
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE
- Publication number 20190312020
- Publication date Oct 10, 2019
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING APP...
- Publication number 20190296001
- Publication date Sep 26, 2019
- Toshiba Memory Corporation
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190252360
- Publication date Aug 15, 2019
- LUMENS CO., LTD
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
- Publication number 20190244926
- Publication date Aug 8, 2019
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SE...
- Publication number 20190229084
- Publication date Jul 25, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE OF WAFER-LEVEL SYSTEM-IN-PAC...
- Publication number 20190115316
- Publication date Apr 18, 2019
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
- Publication number 20180068937
- Publication date Mar 8, 2018
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170374743
- Publication date Dec 28, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Arata KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAMP WITH STRUCTURED POSTS
- Publication number 20170047306
- Publication date Feb 16, 2017
- X-Celeprint Limited
- Matthew Meitl
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor Chip Assembly and Method for Manufacturing the Same
- Publication number 20150364446
- Publication date Dec 17, 2015
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELE...
- Publication number 20150171049
- Publication date Jun 18, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Specific sequence of steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High density interconnect device and method

Chip package structure

Semiconductor package manufacturing method, and adhesive sheet used...

Three-dimentional packaging method and package structure of photoni...

Package interface with improved impedance continuity

Semiconductor manufacturing apparatus

High density interconnect device and method

Chip package structure

Method and device for producing and filling containers

Bonding tools for bonding machines, bonding machines for bonding se...

Multi-layer stamp

High density interconnect device and method

Mixed under bump metallurgy (UBM) interconnect bridge structure

Bonding tools for bonding machines, bonding machines for bonding se...

Semiconductor manufacturing apparatus

Bridge support structure

Packaging method and package structure of wafer-level system-in-pac...

Multi-layer stamp

Method of manufacturing semiconductor device, and mounting device

Chip package structure and method for forming the same

Micro-LED module and method for fabricating the same

Wafer-level system-in-package structure and electronic apparatus th...

Methods and structures for wafer-level system in package

Method of manufacturing chip-on-chip structure comprising sinterted...

Semiconductor device and method of forming a PoP device with embedd...

High density interconnect device and method

Semiconductor device and manufacturing method thereof

Method for manufacturing semiconductor apparatus, method for manufa...

Semiconductor chip mounted on a packaging substrate

Mounting structure and method for manufacturing same

Patents Applicationslast 30 patents

PACKAGING STRUCTURE AND PACKAGING METHOD

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

METHODS OF MONITORING GAS BYPRODUCTS OF A BONDING SYSTEM, AND RELAT...

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

NO-REMELT SOLDER ENFORCEMENT JOINT

THREE-DIMENTIONAL PACKAGING METHOD AND PACKAGE STRUCTURE OF PHOTONI...

CHIP PACKAGE STRUCTURE

Semiconductor Assembly Packaging Method, Semiconductor Assembly and...

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

Package Interface with Improved Impedance Continuity

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD, AND ADHESIVE SHEET USED...

LED CHIP INITIAL STRUCTURE, SUBSTRATE STRUCTURE, CHIP TRANSFERRING...

SEMICONDUCTOR MANUFACTURING APPARATUS

Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure

MULTI-LAYER STAMP

CHIP PACKAGE STRUCTURE

BRIDGE SUPPORT STRUCTURE

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE

SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING APP...

MICRO-LED MODULE AND METHOD FOR FABRICATING THE SAME

CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE

BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SE...

PACKAGING METHOD AND PACKAGE STRUCTURE OF WAFER-LEVEL SYSTEM-IN-PAC...

Semiconductor Device and Method of Forming a POP Device with Embedd...

MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

STAMP WITH STRUCTURED POSTS

Semiconductor Chip Assembly and Method for Manufacturing the Same

METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELE...