Specific sequence of steps

Industry

CPC
H01L2224/82986

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82986Specific sequence of steps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure using metal bridges to interconne...
- Patent number 11,810,895
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including glass substrate having improved reli...
- Patent number 11,355,465
- Issue date Jun 7, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shun Mitarai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electric circuit comprising a circuit carri...
- Patent number 11,056,460
- Issue date Jul 6, 2021
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,861,773
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect substrate f...
- Patent number 10,607,946
- Issue date Mar 31, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 10,165,677
- Issue date Dec 25, 2018
- Palo Alto Research Center Incorporated
- Ping Mei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of forming interconnect substrate f...
- Patent number 9,679,863
- Issue date Jun 13, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,559,078
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting devices in substrate and device-mounting substra...
- Patent number 9,119,332
- Issue date Aug 25, 2015
- Sony Corporation
- Katsuhiro Tomoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package including wire bond and electrically con...
- Patent number 8,907,482
- Issue date Dec 9, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing 3D circuits from bare die or packaged IC c...
- Patent number 8,790,742
- Issue date Jul 29, 2014
- nScrypt, Inc.
- Kenneth H. Church
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing 3D circuits from bare die or packaged IC c...
- Patent number 7,972,650
- Issue date Jul 5, 2011
- nScrypt, Inc.
- Kenneth H. Church
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...
- Publication number 20230369292
- Publication date Nov 16, 2023
- Huawei Technologies Co., Ltd
- Shan GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...
- Publication number 20230121991
- Publication date Apr 20, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220367768
- Publication date Nov 17, 2022
- SAMSUNG DISPLAY CO., LTD.
- Sung Geun BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210035890
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200321301
- Publication date Oct 8, 2020
- Sony Semiconductor Solutions Corporation
- SHUN MITARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC CIRCUIT
- Publication number 20190393187
- Publication date Dec 26, 2019
- SIEMENS AKTIENGESELLSCHAFT
- STEFAN PFEFFERLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...
- Publication number 20190124757
- Publication date Apr 25, 2019
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Associated Methods
- Publication number 20140345924
- Publication date Nov 27, 2014
- Nokia Corporation
- Mark Lee ALLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...
- Publication number 20140124962
- Publication date May 8, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Substration...
- Publication number 20130075936
- Publication date Mar 28, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20130021766
- Publication date Jan 24, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...
- Publication number 20110266039
- Publication date Nov 3, 2011
- SONY CORPORATION
- Katsuhiro TOMODA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING 3D CIRCUITS FROM BARE DIE OR PACKAGED IC C...
- Publication number 20110237002
- Publication date Sep 29, 2011
- nScrypt, Inc.
- KENNETH H. CHURCH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Specific sequence of steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Electrical interconnect structure using metal bridges to interconne...

Semiconductor device including glass substrate having improved reli...

Bare die integration with printed components on flexible substrate...

Method for producing an electric circuit comprising a circuit carri...

Semiconductor package and manufacturing method thereof

Semiconductor device and method of forming interconnect substrate f...

Bare die integration with printed components on flexible substrate...

Semiconductor device and method of forming interconnect substrate f...

Electronic component

Method of mounting devices in substrate and device-mounting substra...

Integrated circuit package including wire bond and electrically con...

Method for manufacturing 3D circuits from bare die or packaged IC c...

Method for manufacturing 3D circuits from bare die or packaged IC c...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...

ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR PRODUCING AN ELECTRIC CIRCUIT

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...

Apparatus and Associated Methods

INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...

Semiconductor Device and Method of Forming Interconnect Substration...

Electronic Component

METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...

METHOD FOR MANUFACTURING 3D CIRCUITS FROM BARE DIE OR PACKAGED IC C...