specifically adapted to include a probing step

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H01L2224/0392

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0392specifically adapted to include a probing step

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor device with removable probe pads
- Patent number 12,051,631
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Naoki Yokoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming conductive layer, and conductive structure and f...
- Patent number 12,040,292
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ming-Teng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit for a hybrid molecular bonding
- Patent number 11,990,436
- Issue date May 21, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of treatment of an electronic circuit for a hybrid molecular...
- Patent number 11,715,710
- Issue date Aug 1, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having exposed redistribution layer features...
- Patent number 11,600,523
- Issue date Mar 7, 2023
- Microchip Technology Incorporated
- ManKit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test method and structure thereof
- Patent number 11,532,524
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,456,264
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Yoshiaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,387,172
- Issue date Jul 12, 2022
- Renesas Electronics Corporation
- Yoshinori Deguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,348,876
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 11,169,207
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device having multiple gate pads
- Patent number 11,004,841
- Issue date May 11, 2021
- Vishay SIliconix, LLC
- Chanho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with conductive structure
- Patent number 10,978,363
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with conductive structure
- Patent number 10,978,362
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having discretely located passivation materia...
- Patent number 10,896,886
- Issue date Jan 19, 2021
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, 3DIC structure and method of fabricating t...
- Patent number 10,886,245
- Issue date Jan 5, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,879,187
- Issue date Dec 29, 2020
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe methodology for ultrafine pitch interconnects
- Patent number 10,748,824
- Issue date Aug 18, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming interconnect assemblies with probed bond pads
- Patent number 10,741,460
- Issue date Aug 11, 2020
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 10,663,512
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,566,255
- Issue date Feb 18, 2020
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with conductive structure
- Patent number 10,490,468
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Chun Tsai
- G01 - MEASURING TESTING
Information Patent Grant
Split ball grid array pad for multi-chip modules
- Patent number 10,483,233
- Issue date Nov 19, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,381,279
- Issue date Aug 13, 2019
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,381,399
- Issue date Aug 13, 2019
- Canon Kabushiki Kaisha
- Shin Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including conductive pillars
- Patent number 10,276,529
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 10,175,294
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing semiconductor products, corresponding semic...
- Patent number 10,153,229
- Issue date Dec 11, 2018
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming interconnect assemblies with probed bond pads
- Patent number 10,134,647
- Issue date Nov 20, 2018
- Micron Technology, Inc.
- Owen R. Fay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF
- Publication number 20240387297
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR
- Publication number 20240282726
- Publication date Aug 22, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20240105527
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20230352351
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-LUM MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20220384371
- Publication date Dec 1, 2022
- STMicroelectronics S.r.l
- Samuele SCIARRILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT TEST METHOD AND STRUCTURE THEREOF
- Publication number 20220367296
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH REMOVABLE PROBE PADS
- Publication number 20220246484
- Publication date Aug 4, 2022
- Micron Technology, Inc.
- Naoki Yokoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT FOR A HYBRID MOLECULAR BONDING
- Publication number 20220157752
- Publication date May 19, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT TEST METHOD AND STRUCTURE THEREOF
- Publication number 20220028748
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE LAYER, AND CONDUCTIVE STRUCTURE AND F...
- Publication number 20220013479
- Publication date Jan 13, 2022
- Changxin Memory Technologies, Inc.
- Ming-Teng HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TREATMENT OF AN ELECTRONIC CIRCUIT FOR A HYBRID MOLECULAR...
- Publication number 20210366851
- Publication date Nov 25, 2021
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, 3DIC STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20200381379
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS
- Publication number 20200264231
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Application
PROBE METHODOLOGY FOR ULTRAFINE PITCH INTERCONNECTS
- Publication number 20200105630
- Publication date Apr 2, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE STRUCTURE
- Publication number 20200091022
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Chun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190348332
- Publication date Nov 14, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...
- Publication number 20190252338
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MULTIPLE GATE PADS
- Publication number 20190237458
- Publication date Aug 1, 2019
- Vishay-Siliconix
- Chanho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...
- Publication number 20190189576
- Publication date Jun 20, 2019
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS
- Publication number 20190128958
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190057913
- Publication date Feb 21, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR FORMING INTERCONNECT ASSEMBLIES WITH PROBED BOND PADS
- Publication number 20190051569
- Publication date Feb 14, 2019
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20180145001
- Publication date May 24, 2018
- RENESAS ELECTRONICS CORPORATION
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20180068910
- Publication date Mar 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS
- Publication number 20170358547
- Publication date Dec 14, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Wafer Level Chip Scale Pa...
- Publication number 20170236802
- Publication date Aug 17, 2017
- STATS ChipPAC Pte Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BOND PAD WIRING LEAD-OUT ARRANGEMENT AVOI...
- Publication number 20170229359
- Publication date Aug 10, 2017
- RENESAS ELECTRONICS CORPORATION
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING INTERCONNECT ASSEMBLIES WITH PROBED BOND PADS
- Publication number 20170207139
- Publication date Jul 20, 2017
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS
- Publication number 20140327464
- Publication date Nov 6, 2014
- Wei-Cheng WU
- G01 - MEASURING TESTING

specifically adapted to include a probing step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor device with removable probe pads

Method for forming conductive layer, and conductive structure and f...

Electronic circuit for a hybrid molecular bonding

Method of treatment of an electronic circuit for a hybrid molecular...

Semiconductor device and method of making wafer level chip scale pa...

Semiconductor package having exposed redistribution layer features...

Integrated circuit test method and structure thereof

Method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor package and method of fabricating the same

Testing of semiconductor chips with microbumps

Semiconductor device having multiple gate pads

Semiconductor structure with conductive structure

Semiconductor structure with conductive structure

Semiconductor devices having discretely located passivation materia...

Semiconductor structure, 3DIC structure and method of fabricating t...

Semiconductor package and method of fabricating the same

Semiconductor devices and semiconductor devices including a redistr...

Probe methodology for ultrafine pitch interconnects

Methods for forming interconnect assemblies with probed bond pads

Testing of semiconductor chips with microbumps

Method of manufacturing semiconductor device

Semiconductor structure with conductive structure

Split ball grid array pad for multi-chip modules

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device

Semiconductor devices including conductive pillars

Testing of semiconductor chips with microbumps

Method of manufacturing semiconductor products, corresponding semic...

Methods for forming interconnect assemblies with probed bond pads

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR

ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

INTEGRATED CIRCUIT TEST METHOD AND STRUCTURE THEREOF

STACKED SEMICONDUCTOR DEVICE WITH REMOVABLE PROBE PADS

ELECTRONIC CIRCUIT FOR A HYBRID MOLECULAR BONDING

INTEGRATED CIRCUIT TEST METHOD AND STRUCTURE THEREOF

METHOD FOR FORMING CONDUCTIVE LAYER, AND CONDUCTIVE STRUCTURE AND F...

METHOD OF TREATMENT OF AN ELECTRONIC CIRCUIT FOR A HYBRID MOLECULAR...

SEMICONDUCTOR STRUCTURE, 3DIC STRUCTURE AND METHOD OF FABRICATING T...

TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS

PROBE METHODOLOGY FOR ULTRAFINE PITCH INTERCONNECTS

SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

SEMICONDUCTOR DEVICE HAVING MULTIPLE GATE PADS

SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...

TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHODS FOR FORMING INTERCONNECT ASSEMBLIES WITH PROBED BOND PADS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS

Semiconductor Device and Method of Making Wafer Level Chip Scale Pa...

SEMICONDUCTOR DEVICE WITH BOND PAD WIRING LEAD-OUT ARRANGEMENT AVOI...

METHODS FOR FORMING INTERCONNECT ASSEMBLIES WITH PROBED BOND PADS

TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS