Split or nearly split shielding or ground planes

Industry

CPC
H05K1/0227

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0227Split or nearly split shielding or ground planes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board design for high speed application
- Patent number 11,903,121
- Issue date Feb 13, 2024
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,812,552
- Issue date Nov 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chul Mun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for shielding bent signal lines
- Patent number 11,696,390
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Durable memory device
- Patent number 11,439,004
- Issue date Sep 6, 2022
- TEAM GROUP INC.
- Chin Feng Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Non-overlapping power/ground planes for localized power distributio...
- Patent number 11,330,699
- Issue date May 10, 2022
- San Diego State University Research Foundation
- Arif Ege Engin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 11,094,453
- Issue date Aug 17, 2021
- TDK Corporation
- Kazuharu Kitatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-uniform magnetic foil embedded in component carrier
- Patent number 10,993,313
- Issue date Apr 27, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield structure for a low crosstalk single ended clock distributio...
- Patent number 10,939,541
- Issue date Mar 2, 2021
- Huawei Technologies Co., Ltd.
- Dmitry Petrov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission line design with routing-over-void compensation
- Patent number 10,856,407
- Issue date Dec 1, 2020
- Intel Corporation
- Khang Choong Yong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Optimizing power efficiency of a power amplifier circuit to reduce...
- Patent number 10,833,635
- Issue date Nov 10, 2020
- Corning Optical Communications LLC
- Dror Harel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wiring board
- Patent number 10,804,210
- Issue date Oct 13, 2020
- Shinko Electric Industries Co., Ltd.
- Rie Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board design for high speed application
- Patent number 10,772,191
- Issue date Sep 8, 2020
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resource allocation for traffic-profile-dependent scheduling request
- Patent number 10,708,807
- Issue date Jul 7, 2020
- QUALCOMM Incorporated
- Chong Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device having circuit board including third conductors i...
- Patent number 10,580,460
- Issue date Mar 3, 2020
- Kabushiki Kaisha Toshiba
- Kiyokazu Ishizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split resonator and printed circuit board including the same
- Patent number 10,573,951
- Issue date Feb 25, 2020
- Samsung Electronics Co., Ltd.
- Soon Yong Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-chip coplanar waveguide having a shielding layer comprising a ca...
- Patent number 10,446,898
- Issue date Oct 15, 2019
- QUALCOMM Incorporated
- Haitao Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optimizing power efficiency of a power amplifier circuit to reduce...
- Patent number 10,418,948
- Issue date Sep 17, 2019
- Corning Optical Communications LLC
- Dror Harel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cable structure
- Patent number 10,217,545
- Issue date Feb 26, 2019
- Wistron Corp.
- Sheng-Lun Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric compressor control system and electric compressor for vehi...
- Patent number 10,202,020
- Issue date Feb 12, 2019
- MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD.
- Makoto Hattori
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Apparatus and methods for shielding a wireless power transmitter
- Patent number 10,181,757
- Issue date Jan 15, 2019
- QUALCOMM Incorporated
- Seong Heon Jeong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power circuit device
- Patent number 10,177,674
- Issue date Jan 8, 2019
- Mitsubishi Electric Corporation
- Mamoru Kamikura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Methods and apparatus for adaptive grounding and noise mitigation i...
- Patent number 10,103,495
- Issue date Oct 16, 2018
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector inserts and receptacle tongues formed using printed circu...
- Patent number 9,992,863
- Issue date Jun 5, 2018
- Apple Inc.
- Mahmoud R. Amini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 9,900,990
- Issue date Feb 20, 2018
- Samsung Display Co., Ltd.
- Ki Hyuk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 9,814,129
- Issue date Nov 7, 2017
- LG Innotek Co., Ltd
- Yong Seok Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board equipped with a high-frequency component emitting int...
- Patent number 9,801,268
- Issue date Oct 24, 2017
- Endress + Hauser GmbH + Co. KG
- Thomas Blodt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference suppressing structure and electronic d...
- Patent number 9,668,390
- Issue date May 30, 2017
- SK Hynix Inc.
- Kuo Ying Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line, a transmission line apparatus, and an electronic...
- Patent number 9,666,925
- Issue date May 30, 2017
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic noise filter device and equivalent filter circuit t...
- Patent number 9,655,230
- Issue date May 16, 2017
- NATIONAL TAIWAN UNIVERSITY
- Tzong-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter assembly without galvanic isolation
- Patent number 9,577,507
- Issue date Feb 21, 2017
- LSIS Co., Ltd.
- Deokyoung Lim
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20240121886
- Publication date Apr 11, 2024
- Nippon Telegraph and Telephone Corporation
- Miwa Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION
- Publication number 20220353985
- Publication date Nov 3, 2022
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING INTERDIGITAL SLOTS AND/OR SPLITS ON...
- Publication number 20220264739
- Publication date Aug 18, 2022
- TÜRKIYE BILIMSEL VE TEKNOLOJIK ARASTIRMA KURUMU
- AHMET YASIN CITKAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DURABLE MEMORY DEVICE
- Publication number 20220264740
- Publication date Aug 18, 2022
- TEAM GROUP INC.
- CHIN FENG CHANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SYSTEMS FOR SHIELDING BENT SIGNAL LINES
- Publication number 20210410274
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-OVERLAPPING POWER/GROUND PLANES FOR LOCALIZED POWER DISTRIBUTIO...
- Publication number 20210153341
- Publication date May 20, 2021
- San Diego State University Research Foundation
- Arif Ege ENGIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION
- Publication number 20200352023
- Publication date Nov 5, 2020
- MEDIATEK INC.
- Nan-Jang Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZING POWER EFFICIENCY OF A POWER AMPLIFIER CIRCUIT TO REDUCE...
- Publication number 20190363677
- Publication date Nov 28, 2019
- Corning Optical Communications LLC
- Dror Harel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
OPTIMIZING POWER EFFICIENCY OF A POWER AMPLIFIER CIRCUIT TO REDUCE...
- Publication number 20180337640
- Publication date Nov 22, 2018
- CORNING OPTICAL COMMUNICATIONS WIRELESS LTD
- Dror Harel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS AND APPARATUS FOR ADAPTIVE GROUNDING AND NOISE MITIGATION I...
- Publication number 20180062321
- Publication date Mar 1, 2018
- SKYWORKS SOLUTIONS, INC.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT RESONATOR AND PRINTED CIRCUIT BOARD INCLUDING THE SAME
- Publication number 20180048047
- Publication date Feb 15, 2018
- Samsung Electronics Co., Ltd.
- Soon Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE
- Publication number 20150334821
- Publication date Nov 19, 2015
- Industrial Technology Research Institute
- Shih-Hsien WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CIRCUIT-LAYER CIRCUIT BOARD
- Publication number 20150296609
- Publication date Oct 15, 2015
- SUNPLUS TECHNOLOGY CO., LTD.
- Chin-Ta HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING VIA AND MANUFACTURING METHOD THEREOF
- Publication number 20150181693
- Publication date Jun 25, 2015
- Industrial Technology Research Institute
- Shih-Hsien WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION CIRCUIT AND COMMUNICATION EQUIPMENT
- Publication number 20140368291
- Publication date Dec 18, 2014
- Yokogawa Electric Corporation
- Satoshi Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATTENUATION REDUCTION GROUNDING PATTERN STRUCTURE FOR CONNECTION PA...
- Publication number 20140318833
- Publication date Oct 30, 2014
- ADVANCED FLEXBLE CIRCUITS CO., LTD.
- CHING-CHENG TIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20140254992
- Publication date Sep 11, 2014
- Masahiro HIRAYAMA
- G02 - OPTICS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140247574
- Publication date Sep 4, 2014
- Canon Kabushiki Kaisha
- Hiroto Tamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20140209367
- Publication date Jul 31, 2014
- NEC Corporation
- Jun Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE
- Publication number 20140184361
- Publication date Jul 3, 2014
- Murata Manufacturing Co., Ltd.
- Noboru KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT SUBSTRATE
- Publication number 20140133114
- Publication date May 15, 2014
- Taiyo Yuden Co., Ltd.
- Tetsuo Saji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CHECK DEVICE AND WIRING CHECK SYSTEM
- Publication number 20140084957
- Publication date Mar 27, 2014
- NEC Corporation
- Ken Morishita
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT MODULE
- Publication number 20140045546
- Publication date Feb 13, 2014
- Murata Manufacturing Co., Ltd.
- Syuichi ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20130322833
- Publication date Dec 5, 2013
- Masahiro HIRAYAMA
- G02 - OPTICS
Information Patent Application
Wireless Terminal
- Publication number 20130314296
- Publication date Nov 28, 2013
- HUAWEI DEVICE CO., LTD.
- Huiliang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Obtaining Large Creepage Isolation on Print...
- Publication number 20130269982
- Publication date Oct 17, 2013
- Dejan Teofilovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3-D INTEGRATED PACKAGE
- Publication number 20130235542
- Publication date Sep 12, 2013
- Finisar Corporation
- Yunpeng SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND GROUNDING DEVICE FOR ENHANCING EMS AND WIRELESS COMMUNIC...
- Publication number 20130169487
- Publication date Jul 4, 2013
- CLIMAX TECHNOLOGY CO., LTD
- Hsiao-Pin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD CAPABLE OF LIMITING ELECTROMAGNETIC INTERFERENCE
- Publication number 20130092427
- Publication date Apr 18, 2013
- HON HAI Precision Industry CO., LTD.
- CHENG-SUNG WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SOURCE CONTROL CIRCUIT MODULE
- Publication number 20130063913
- Publication date Mar 14, 2013
- Murata Manufacturing Co., Ltd.
- Masato YOSHIDA
- G06 - COMPUTING CALCULATING COUNTING

Split or nearly split shielding or ground planes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board design for high speed application

Printed circuit board

Systems for shielding bent signal lines

Durable memory device

Non-overlapping power/ground planes for localized power distributio...

Electronic device and method for manufacturing electronic device

Non-uniform magnetic foil embedded in component carrier

Shield structure for a low crosstalk single ended clock distributio...

Transmission line design with routing-over-void compensation

Optimizing power efficiency of a power amplifier circuit to reduce...

Wiring board

Printed circuit board design for high speed application

Resource allocation for traffic-profile-dependent scheduling request

Electronic device having circuit board including third conductors i...

Split resonator and printed circuit board including the same

On-chip coplanar waveguide having a shielding layer comprising a ca...

Optimizing power efficiency of a power amplifier circuit to reduce...

Cable structure

Electric compressor control system and electric compressor for vehi...

Apparatus and methods for shielding a wireless power transmitter

Power circuit device

Methods and apparatus for adaptive grounding and noise mitigation i...

Connector inserts and receptacle tongues formed using printed circu...

Flexible printed circuit board

Printed circuit board and method of fabricating the same

Circuit board equipped with a high-frequency component emitting int...

Electromagnetic interference suppressing structure and electronic d...

Transmission line, a transmission line apparatus, and an electronic...

Electromagnetic noise filter device and equivalent filter circuit t...

Inverter assembly without galvanic isolation

Patents Applicationslast 30 patents

WIRING BOARD

PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION

PRINTED CIRCUIT BOARD INCLUDING INTERDIGITAL SLOTS AND/OR SPLITS ON...

DURABLE MEMORY DEVICE

SYSTEMS FOR SHIELDING BENT SIGNAL LINES

NON-OVERLAPPING POWER/GROUND PLANES FOR LOCALIZED POWER DISTRIBUTIO...

PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION

OPTIMIZING POWER EFFICIENCY OF A POWER AMPLIFIER CIRCUIT TO REDUCE...

OPTIMIZING POWER EFFICIENCY OF A POWER AMPLIFIER CIRCUIT TO REDUCE...

METHODS AND APPARATUS FOR ADAPTIVE GROUNDING AND NOISE MITIGATION I...

SPLIT RESONATOR AND PRINTED CIRCUIT BOARD INCLUDING THE SAME

VIA STRUCTURE

MULTI-CIRCUIT-LAYER CIRCUIT BOARD

CIRCUIT BOARD HAVING VIA AND MANUFACTURING METHOD THEREOF

INSULATION CIRCUIT AND COMMUNICATION EQUIPMENT

ATTENUATION REDUCTION GROUNDING PATTERN STRUCTURE FOR CONNECTION PA...

FLEXIBLE CIRCUIT BOARD

PRINTED CIRCUIT BOARD

WIRING BOARD

HIGH FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE

MULTILAYER CIRCUIT SUBSTRATE

WIRING CHECK DEVICE AND WIRING CHECK SYSTEM

CIRCUIT MODULE

FLEXIBLE CIRCUIT BOARD

Wireless Terminal

Systems and Methods for Obtaining Large Creepage Isolation on Print...

3-D INTEGRATED PACKAGE

DEVICE AND GROUNDING DEVICE FOR ENHANCING EMS AND WIRELESS COMMUNIC...

PRINTED CIRCUIT BOARD CAPABLE OF LIMITING ELECTROMAGNETIC INTERFERENCE

POWER SOURCE CONTROL CIRCUIT MODULE