Patent Application
20140084957
The present invention relates to a wiring check device and a wiring check system of a printed wiring board.
In a printed wiring board on which an LSI (Large Scale Integration) and an IC (Integrated Circuit) are mounted, it is necessary to improve an electromagnetic noise characteristic. That is, it is necessary to suppress emission of an unnecessary electromagnetic noise to outside and to prevent destruction and malfunction by electromagnetic noise mixed from outside.
When a design change or an addition of a measure part for improving an electromagnetic noise characteristic is performed after production of a printed wiring board, it will lead to a prolongation of a development period, or increase of a manufacturing cost thereof. Therefore, it is desirable to check an electromagnetic noise characteristic and to take a measure for improving an electromagnetic noise characteristic if needed in a design phase of a printed wiring board.
When a plane conductor which opposes a wiring is missing, and the wiring steps over this missing part, it is known to become a factor which causes deterioration of an electromagnetic noise characteristic of a printed wiring board.
Here, there are a large number of clearance holes formed in order to avoid conducting with vias exist in a plane conductor which becomes a power or a ground of a printed wiring board. Moreover, there are many points where a plane conductor is missing, such as a gap for dividing a power or a ground, and a notch provided in order to let a wiring pass, exist in various shapes. Below, a point where a plane conductor is missing, such as a gap for dividing a power or a ground, and a notch provided in order to let a wiring pass, is called a slit.
When the slit and a wiring oppose, a part where a wiring steps over the slit will be formed.
When the wiring 1003 steps over the slit 1001, a return path of a signal current becomes longer, and strong electromagnetic noise will be emitted. It becomes easy for electromagnetic noise mixed from outside to superpose on the wiring 1003 around the slit 1001 of a plane conductor 1000, which causes destruction or malfunction of an electronic apparatus.
A technology to check such wiring is disclosed in patent literature 1, for example.
A check device disclosed in the patent literature 1 extracts a wiring which is susceptible to noise and steps over a specified region to a substrate for which a layout design is performed. And interference noise is checked for this wiring. This device includes a region designation means, a wiring extracting means and an interference check means. The region designation means is a means which specifies an optional region to a substrate by which a layout design is performed. The wiring extracting means is a means which extracts a wiring which steps over a region specified by the region designation means and other part. The interference check means is a means which performs a noise interference check to a wiring extracted by the wiring extracting means. According to this device, because an area is specified in accordance with a plane shape of the substrate, it is said that the region designation can be performed automatically even if a user does not perform the region designation separately.
However, in the device described in the patent literature 1, there is a case in which a user performs a region designation for extracting a wiring. Therefore, full automation of a check cannot be performed, and there is a problem that the user has to intervene in a check stage. Although it is described that the region designation can be performed automatically by this device, the automatic region designation has the large restrictions as found from the description of specification paragraph [0021] of patent literature 1. That is, there are restrictions that all layers of the multi-layer printed wiring board must be almost same plane-shaped, and it is effective if there is a wiring only in a plane layer designed by a specific shape.
For example, a technology in relation to a full automation of a check is disclosed in patent literature 2. In a return path cutoff check system of a printed wiring board described in the patent literature 2, it is detected whether a wiring on the printed wiring board is formed only on a single plane layer. In this system, a wiring and plane layers are automatically selected from CAD (Computer Aided Design) data, and the wiring and the plane layers which exist above and below the wiring are overlapped as an image. And it is detected whether the wiring is formed only on the single plane layer.
In the system described in patent literature 2, there is little problem such as a user having to intervene in the check stage, or the restriction in the automatic region designation. However, only information whether a wiring is formed only on the single plane layer is detected by this system. Therefore, it is impossible to defect a magnitude of influence by a wiring formed on a plurality of plane layers in consideration of a difference in a configuration of the wiring or the plane layer.
For example, a technology in relation to a solution of such problem is disclosed in patent literature 3. In patent literature 3, a plane stepping over wiring check system which determines whether a wiring steps over a space between plane layers of a same kind or between different kinds of plane layers is disclosed. In this system, a wiring and a plurality of plane layers of check targets are extracted from CAD data, those projection overlaps are detected, and an attribute of each plane layer is determined. And a wiring which steps over a space between the plane layers of a same kind and a wiring which steps over a space between the plane layers of a different kind are distinguished, and weighting is applied to each wiring. Thereby, level classification by the kind of the plane layer is performed of the degree of influence by the wiring stepping over a space between the plane layers.
In order to improve an electromagnetic noise characteristic of a printed wiring board, it is effective and efficient to perform a measure design with priority from a wiring with a high risk of deterioration of an electromagnetic noise characteristic.
Here, in the wiring check system described in patent literature 3, a bridge wiring is detected from only a relation between the position of the wiring and the configuration of the plane conductor located just close to the wiring. That is, when a risk of deterioration of an electromagnetic noise characteristic is determined, a plane conductor other than the plane conductor located just close to the wiring is not considered at all.
On the other hand, the inventors of the present application have found that the difference in an electromagnetic noise characteristic occurs depending on the configuration of a plane conductor other than the plane conductor located just close to the wiring. An evaluation result of a relation between a configuration of a plane conductor other than the plane conductor located just proximally to the wiring and an electromagnetic noise characteristic will be described using
Schematic diagrams of printed wiring boards 10 and 20 used for evaluation are shown in
The printed wiring boards 10 and 20 are four-layered configurations in which a glass epoxy board (standard notation: FR-4) of a dielectric substrate is used as a substrate material, respectively. A wiring 13 of a line width 0.3 mm and a pad 14 for noise impression are formed respectively in the top layer A. A plane conductor 11 is formed respectively in the layer B of the second layer. A plane conductor 12 is formed in the layer C of the printed wiring board 10 and a plane conductor 21 is formed in the layer C of the printed wiring board 20. A conductive pattern is not formed in the layer D of the fourth layer.
A coaxial connector (SMA connector 15) for voltage measurement is connected to the wiring end of one side of the wiring 13 formed in the layer A, and the other end is open without anything being connected to other wiring end thereof. Moreover, an internal conductor of the SMA connector 15 is connected to the wiring 13 on the layer A, and an outer conductor thereof is connected to the plane conductor 11 on the layer B. The pad 14 is formed in the size of 5 mm square on a substrate end portion and connected by a via with the plane conductor 11 on the layer B. Further, there is no electric connection by a via or a capacitor between the plane conductors on the layer B and the layer C.
A slit with a size of 30 mm×1 mm is formed in the plane conductor 11 on the layer B of respective printed wiring boards 10 and 20 in a position just under the wiring 13 on the layer A. That is, the wiring 13 on the layer A is a wiring which steps over a center of the slit formed in the plane conductor 11 on the layer B. A slit with a size of 30 mm×1 mm is formed in the plane conductor 12 on the layer C of the printed wiring board 10 in a position just under the wiring 13 on the layer A. On the other hand, a slit is not formed in the plane conductor 21 on the layer C of the printed wiring board 20.
Measurement results of an induced voltage to the wiring 13 are shown in
From
The inventors of the present application also have evaluated a case where slits of plane conductors 31 and 32 as shown in
Measurement results of induced voltages of the printed wiring boards 30 and 40 shown in
From
It is found from the above mentioned measurement results that the difference occurs in the electromagnetic noise characteristic depending on the configuration of the plane conductor other than the nearest plane conductor to the wiring even if the configuration of the slit in the nearest plane conductor to the wiring is the same.
That is, if a plurality of plane conductors are overlapped in the substrate laminating direction and the slit in the nearest plane conductor to the wiring is covered with other plane conductors, it is found that the influence on an electromagnetic noise characteristic becomes small.
The principle by which the influence on the electromagnetic noise characteristic becomes small by other plane conductors covering the slit in the plane conductor most close to the wiring will be described using
On the other hand,
In
It is found that the risks of deterioration of an electromagnetic noise characteristic differs due to the presence of plane conductors other than the plane conductor located closest to the wiring, based on the above mentioned principle.
As mentioned above, in order to improve an electromagnetic noise characteristic of a printed wiring board, it is effective and efficient to perform preferentially a measure design of a wiring with a high risk of deteriorating of an electromagnetic noise characteristic. Therefore, in a system to check a wiring, it is desirable to take into account the presence of a plane conductor other than the plane conductor located closest to the wiring.
On the other hand, as mentioned above, in the wiring check system disclosed in patent literature 3, a bridge wiring is detected only by the relation between the position of the wiring and the configuration of the plane conductor located closest to the wiring. That is, the effect is not taken into account at all that a risk of deterioration of an electromagnetic noise characteristic is reduced by the presence of a plane conductor other than the plane conductor located closest to the wiring, Therefore, an electromagnetic noise characteristic cannot be improved efficiently.
The objective of the present invention is to provide a wiring check device, a wiring check system, a wiring check method, a wiring check program, and a recording medium where it is possible, with respect to finding a risk of deterioration of electromagnetic noise characteristics, to take into account the presence of a plane conductor other than a plane conductor which is located closest to the wiring.
In order to achieve the above object, a wiring check device according to this exemplary embodiment comprising: a wiring information acquisition unit which acquires wiring information on a wiring comprised in a printed wiring board having a multi-layered structure; a plane conductor detection unit which detects a plurality of plane conductors on multiple layers among the multi-layered structure comprising a layer located closest to a layer comprising the wiring; a plane conductor overlap configuration detection unit which detects a plane conductor overlap configuration of a configuration in which the plurality of plane conductors are overlapped; and a bridge point detection unit which detects a point where the wiring steps over a plane conductor excluded region in the plane conductor overlap configuration on the basis of a wiring-plane conductor overlap configuration of a configuration in which the wiring and the plane conductor overlap configuration are overlapped.
A wiring check system according to this exemplary embodiment comprising: a wiring information acquisition means which acquires wiring information on a wiring comprised in a printed wiring board having a multi-layered structure; a plane conductor detection means which detects a plurality of plane conductors on multiple layers among the multi-layered structure which comprise a layer located closest to a layer comprising the wiring; a plane conductor overlap configuration detection means which detects a plane conductor overlap configuration of a configuration in which the plurality of plane conductors are overlapped; and a bridge point detection means which detects a point where the wiring steps over a plane conductor excluded region in the plane conductor overlap configuration on the basis of a wiring-plane conductor overlap configuration of is a configuration in which the wiring and the plane conductor overlap configuration are overlapped.
A wiring checking method according to this exemplary embodiment comprising: a wiring information acquisition step which acquires wiring information on a wiring comprised in a printed wiring board having a multi-layered structure; a plane conductor detection step which detects a plurality of plane conductors on multiple layers among the multi-layered structure comprising a layer located closest to a layer comprising the wiring; a plane conductor overlap configuration detection step which detects a plane conductor overlap configuration of a configuration in which the plurality of plane conductors are overlapped; and a bridge point detection step which detects a point where the wiring steps over a plane conductor excluded region in the plane conductor overlap configuration on the basis of a wiring-plane conductor overlap configuration of a configuration in which the wiring and the plane conductor overlap configuration are overlapped.
A wiring check program according to this exemplary embodiment for making a computer executes steps of: a wiring information acquisition step which acquires wiring information on a wiring comprised in a printed wiring board having a multi-layered structure; a plane conductor detection step which detects a plurality of plane conductors on multiple layers among the multi-layered structure comprising a layer located closest to a layer comprising the wiring; a plane conductor overlap configuration detection step which detects a plane conductor overlap configuration of a configuration in which the plurality of plane conductors are overlapped; and a bridge point detection step which detects a point where the wiring steps over a plane conductor excluded region in the plane conductor overlap configuration on the basis of a wiring-plane conductor overlap configuration of a configuration in which the wiring and the plane conductor overlap configuration are overlapped.
A recording medium according to this exemplary embodiment which is a computer readable storage medium recording a wiring check program according to the present invention
According to the present invention, it becomes possible, with respect to finding a risk of deterioration of electromagnetic noise characteristics, to take into account the presence of a plane conductor other than a plane conductor which is located closest to the wiring.
Exemplary embodiments of the present invention will be described with reference to drawings. However, the exemplary embodiments do not limit the technical scope of the present invention.
A wiring check system according to a first exemplary embodiment of the present invention will be described using
A wiring check system 100 according to this exemplary embodiment includes a wiring information acquisition means 101, a plane conductor detection means 102, a plane conductor overlap configuration detection means 103 and a bridge point detection means 104.
The wiring information acquisition means 101 acquires wiring information on a wiring included in a printed wiring board having a multi-layered structure. The plane conductor detection means 102 detects a plurality of plane conductors of multiple layers including a layer nearest to a layer having a wiring among the multi-layered structure. The plane conductor overlap configuration detection means 103 detects a plane conductor overlap configuration which is a configuration in which a plurality of plane conductors are overlapped. The bridge point detection means 104 detects a wiring-plane conductor overlap configuration which is a configuration of overlapping a wiring and a plane conductor overlap configuration. And a point where a wiring steps over a plane conductor excluded region in the plane conductor overlap configuration is detected based on the wiring-plane conductor overlap configuration.
Next, a wiring checking method of a printed wiring board by the wiring check system 100 in this exemplary embodiment will be described using
A printed wiring board for which a wiring check is performed by the wiring check system 100, a printed wiring board 110 shown in
First, the wiring information acquisition means 101 acquires wiring information on the wiring 114 (Step 1). The wiring 114 here is a target wiring checked by the wiring check system 100.
Next, the plane conductor detection means 102 detects a plurality of plane conductors 115 and 116 in the multiple layers 112 and 113 including the layer 112 nearest to the layer 111 having the wiring 114 (Step 2).
And the plane conductor overlap configuration detection means 103 detects the configuration in which the plane conductors 115 and 116 overlap with each other (Step 3). Below, the configuration in which the plane conductors 115 and 116 overlap with each one another will be called a plane conductor overlap configuration 117. The plane conductor overlap configuration 117 is shown in
The bridge point detection means 104 detects bridge points 120 and 121 which are points in which the wiring 114 steps over the plane conductor excluded region 119 in the plane conductor overlap configuration 117 from a configuration in which the wiring and the plane conductor overlap configuration are overlapped (Step 4). Below, the configuration in which this wiring and the plane conductor overlap configuration are overlapped will be called a wiring-plane conductor overlap configuration 118.
The wiring check system is completed as mentioned above. Although a wiring provided in the printed wiring board 110 is only the wiring 114, if a wiring check of the printed wiring board having a plurality of wirings is performed, steps 1-4 are performed for the respective wirings.
As mentioned above, according to the wiring check system 100 of this exemplary embodiment, it is possible, with respect to finding a risk of deterioration of electromagnetic noise characteristics, to take into account the configuration of a plane conductor other than the plane conductor which is located closest to the wiring.
Therefore, an electromagnetic noise characteristic of a printed wiring board can be improved efficiently.
Further, the wiring check system 100 according to this exemplary embodiment may be configured by a single device, or may be configured by a plurality of devices.
A wiring check system according to a second exemplary embodiment of the present invention will be described using
The recording device 210 includes a design information recording unit 211. The design information recording unit 211 records design information (CAD data) on a printed wiring board. For example, position information on a wiring of a printed wiring board is included in the design information.
The wiring check device 220 includes a wiring information acquisition unit 221, a plane conductor detection unit 222, a plane conductor overlap configuration detection unit 223 and a bridge point detection unit 224.
The wiring information acquisition unit 221 refers to the design information recorded in the design information recording unit 211 and acquires wiring information on a wiring which becomes a check target. The plane conductor detection unit 222 detects a plurality of plane conductors of multiple layers including a layer nearest to the layer of the wiring. The plane conductor overlap configuration detection unit 223 detects a plane conductor overlap configuration which is a configuration in which a plurality of plane conductors which the plane conductor detection unit 222 detected overlap one another. The bridge point detection unit 224 detects a wiring-plane conductor overlap configuration which is a configuration in which a wiring which becomes a check target and a plane conductor overlap configuration are overlapped. And the bridge point detection unit 224 detects a bridge point which the wiring steps over a plane conductor excluded region in the plane conductor overlap configuration on the basis of a wiring-plane conductor overlap configuration.
The output device 230 outputs information on the bridge point detected by the bridge point detection unit 224.
Next, a wiring checking method of a printed wiring board by the wiring check system 200 of this exemplary embodiment will be described using a flow chart shown in
When the wiring check system 200 begins to operate, the wiring information acquisition unit 221 reads a CAD data of the printed wiring board 240 recorded in the design information recording unit 211. And the wiring information acquisition unit 221 acquires wiring information on the wiring 254 which becomes a check target (Step 5). For example, wiring information is a position coordinate (such as XY coordinates) of a wiring or information on a wiring layer.
Next, the plane conductor detection unit 222 detects the plane conductors 248-253 provided in the multiple layers (layers 241-247) including the layers 243 and 245 nearest to the layer 244 having the wiring 254 based on the acquired wiring information (Step 6). At that time, the plane conductor detection unit 222 detects the plane conductors by reading the CAD data of the printed wiring board 240 recorded in the design information recording unit 211.
Next, the plane conductor overlap configuration detection unit 223 detects a plane conductor overlap configuration 255 which is a configuration in which the plane conductors 248-253 which the plane conductor detection unit 222 detected overlap (Step 7).
And the bridge point detection unit 224 detects a wiring-plane conductor overlap configuration 256 which is a configuration in which the plane conductor overlap configuration 255 and the wiring 254 have overlapped one another (Step 8).
And the bridge point detection unit 224 detects a point where the wiring 254 steps over a plane conductor excluded region in the plane conductor overlap configuration 255 from the wiring-plane conductor overlap configuration 256 (Step 9). That is, the bridge point which the bridge point detection unit 224 detects is a point in which the wiring 254 steps over a region where neither plane conductors of the plane conductors 248-253 are formed. In this exemplary embodiment, the bridge point detection unit 224 detects bridge points 257 and 258 shown in
When there is a target wiring of a wiring check in addition to the wiring 254 (in Step 10, YES), the wiring information acquisition unit 221 reads the design information again and repeats the steps from Step 5 to Step 9. On the other hand, when there are no target wirings on a wiring check (in Step 10, NO), information on the bridge point which the bridge point detection unit 224 detected is transmitted to the output device 230. And the output device 230 outputs information on the received bridge point (Step 11). Here, the output device 230 may display information on the received bridge point on a display screen and may print. Thus, the wiring check by the wiring check system 200 ends.
In the way mentioned above, the wiring check system 200 in this exemplary embodiment detects a bridge point, taking into account not only the plane conductors 243 and 245 which are located closest to the wiring 254, but also the configurations of the plane conductors 241, 242, 246 and 247.
Therefore, it is possible, with respect to finding a risk of deterioration of electromagnetic noise characteristics, to take into account the presence of a plane conductor other than the plane conductor which is located closest to the wiring. That is, it is possible to know a risk of a deterioration of electromagnetic noise characteristics by the presence of a plane conductor other than the plane conductor which is located closest to the wiring, taking into account the effect of reducing the risk of a deterioration of electromagnetic noise characteristics. Therefore, an electromagnetic noise characteristic of a printed wiring board can be improved efficiently.
Further, according to this exemplary embodiment, the plane conductors of all layers provided in the printed wiring board are detected and overlapped. That is, all the plane conductors overlap one another irrespective of in what layer the wiring exists. Therefore, even when many wirings which become check targets are arranged in a plurality of layers, all plane conductors should always be detected, and one configuration in which all plane conductors overlap one another should also be detected about the overlap thereof. Therefore, operation of the plane conductor detection unit 222 and the plane conductor overlap configuration detection unit 223 can be set as the same operation irrespective of the position of the wiring, respectively.
Here, in some printed wiring board, a plane conductor is often arranged in the same layer as a wiring. That is, a wiring and a plane conductor are often intermingled in one layer. However, in a layer where a wiring exists, a plane conductor does not exist in a position in which the wiring exists. Therefore, even if a plane conductor in the same layer as the wiring is included, or not included, a position of a point where the wring steps over a plane conductor excluded region in the configuration in which a plurality of plane conductors overlap one another does not change. Therefore, the plane conductor detection unit 222 does not need to detect the plane conductor of the same layer as the wiring.
However, as shown in a fourth exemplary embodiment mentioned later, when detecting a bridge point and taking into account an area of a plane conductor excluded region, a detected bridge point may be different by whether the plane conductor of the same layer as the wiring is included or not.
Further, the bridge point includes a point where a wiring steps over a plane conductor excluded region formed inside the plane conductor, and a point where the wiring step over a plane conductor excluded region formed between a plurality of plane conductors. A point where a wiring steps over a plane conductor excluded region formed inside the plane conductor will be called an in-plane conductor bridge point below. A point where a wiring steps over a plane conductor excluded region formed between a plurality of plane conductors an inter-plane conductor bridge point below. Therefore, the bridge point includes an in-plane conductor bridge point and an inter-plane conductor bridge point. Here, the bridge point detection unit 224 may distinguish and detect an in-plane conductor bridge point and inter-plane conductor bridge point. Because an inter-plane conductor bridge point has generally a higher risk of deterioration of an electromagnetic noise characteristic compared with an in-plane conductor bridge point, it is possible to take a design measure more efficiently, and to improve an electromagnetic noise characteristic by distinguishing and detecting them.
Next, a third exemplary embodiment of the present invention is described.
In the second exemplary embodiment, as the wiring checking method of the wiring check system 200, the method to overlap all plane conductors 248-253 provided in the printed wiring board 240 is used. Below, the method to overlap all the plane conductors 248-253 provided in this printed wiring board 240 will be called a first wiring checking method. However, the wiring checking method by the wiring check system 200 is not limited to this.
For example, a plurality of detected plane conductors may be distinguished and detected the plane conductors located above the wiring, and the plane conductors located below the wiring, respectively, and they may be overlapped in each group.
Only the plane conductor within a predetermined distance from the wiring may be detected among a plurality of plane conductors provided in the printed wiring board.
Accordingly, according to this exemplary embodiment, such other wiring checking methods by the wiring check system 200 are described.
First, the method in which the plane conductors detected by the plane conductor detection unit 222 are distinguished by the plane conductors located above the wiring and the plane conductors located below the wiring, respectively, and they may be overlapped in each group is described. Below, the method in which the plane conductors located above the wiring and the plane conductors located below the wiring are distinguished, and they are overlapped in each group is called a second wiring checking method.
Further, as a target printed wiring board on a wiring check, the printed wiring board 240 shown in
The plane conductor detection unit 222 detects the plane conductors 248-250 located above the wiring 254, and the plane conductors 251-253 located below the wiring 254, respectively.
And the plane conductor overlap configuration detection unit 223 detects a configuration in which the plane conductors 248-250 located above the wiring 254 overlap one another. Below, the configuration in which the plane conductors 248-250 located above the wiring 254 overlap one another is called an upper plane conductor overlap configuration 259. Similarly, the plane conductor overlap configuration detection unit 223 also detects a configuration in which the plane conductors 251-253 located below the wiring 254 overlap one another. Below, the configuration in which the plane conductors 251-253 located below the wiring 254 overlap one another is called a lower plane conductor overlap configuration 260. The upper plane conductor overlap configuration 259 and the lower plane conductor overlap configuration 260 are shown in
Next, the bridge point detection unit 224 detects a configuration in which the wiring 254 and the upper plane conductor overlap configuration 259 overlap one another. Below, the configuration in which the wiring 254 and the upper plane conductor overlap configuration 259 overlap is called a wiring-upper plane conductor overlap configuration. Similarly, the bridge point detection unit 224 also detects a configuration in which the wiring 254 and the lower plane conductor overlap configuration 260 overlap. Below, the configuration in which the wiring 254 and the lower plane conductor overlap configuration 260 overlap one another is called a wiring-lower plane conductor overlap configuration.
And the bridge point detection unit 224 detects a point where the wiring 254 steps over a plane conductor excluded region from each of the wiring-upper plane conductor overlap configuration and the wiring-lower plane conductor overlap configuration. And information on the bridge point detected by the bridge point detection unit 224 is outputted by the output device 230. In the way mentioned above, a wiring check by the second wiring checking method completes.
Next, the second wiring checking method is described with a more detailed specific example. Here, a printed wiring board 270 will be used as a target on a wiring check. The printed wiring board 270 has a 6 layered structure of layers 271-276. Further, although not being illustrated, the layers 271-276 are laminated by this order, and the layer 271 is the top layer, and the layer 276 is the bottom layer. A top view of each layer of the printed wiring board 270 is shown in
First, the wiring information acquisition unit 221 acquires wiring information on the wiring 283 from the design information recording unit 211.
Next, the plane conductor detection unit 222 detects a plurality of plane conductors of multiple layers including the nearest layers 272 and 274 to the layer 273 having the wirings 283. Here, the plane conductor detection unit 222 detects the plane conductors 277 and 278 provided in the layers above the layer 273 having the wirings 283. Similarly, the plane conductor detection unit 222 detects the plane conductors 279-282 provided in the layers below the layer 273 having the wirings 283.
The plane conductor overlap configuration detection unit 223 detects a configuration in which the plane conductors 277 and 278 overlap. Below, the configuration in which the plane conductors 277 and 278 overlap one another is called an upper plane conductor overlap configuration 285. Similarly, the plane conductor overlap configuration detection unit 223 detects a configuration in which the plane conductors 279-282 overlap. Below, the configuration in which the plane conductors 279-282 overlap one another is called a lower plane conductor overlap configuration 286.
Next, the bridge point detection unit 224 detects a configuration in which the wiring 283 and the upper plane conductor overlap configuration 285 overlap one another. Below, the configuration in which the wiring 283 and the upper plane conductor overlap configuration 285 overlap is called a wiring-upper plane conductor overlap configuration 287. Similarly, the bridge point detection unit 224 detects a configuration in which the wiring 283 and the lower plane conductor overlap configuration 286 overlap one another. Below, the configuration in which the wiring 283 and the lower plane conductor overlap configuration 286 overlap one another is called a wiring-lower plane conductor overlap configuration 288.
And the bridge point detection unit 224 detects points (bridge points 289 and 290) where the wiring 283 steps over a plane conductor excluded region in the upper plane conductor overlap configuration 285 based on the wiring-upper plane conductor overlap configuration 287. Similarly, the bridge point detection unit 224 detects a point where the wiring 283 steps over a plane conductor excluded region in the lower plane conductor overlap configuration 286 based on the wiring-lower plane conductor overlap configuration 288. Further, because there is no point in which the wiring 283 steps over a plane conductor excluded region in the wiring-lower plane conductor overlap configuration 288, a bridge point is not detected. In the way mentioned above, the detection of the bridge point in the wiring 283 completes.
Next, the wiring information acquisition unit 221 acquires wiring information on the wiring 284 from the design information recording unit 211. And the wiring-upper plane conductor overlap configuration 291 and the wiring-lower plane conductor overlap configuration 292 are detected by the same step as in case of the wiring 283.
And the bridge point detection unit 224 detects a point where the wiring 284 steps over a plane conductor excluded region in the upper plane conductor overlap configuration 285 based on the wiring-upper plane conductor overlap configuration 291. A bridge point is not detected in the wiring-upper plane conductor overlap configuration 291 because there is not a point where the wiring 284 steps over a plane conductor excluded region. Similarly, the bridge point detection unit 224 detects a point where the wiring 283 steps over a plane conductor excluded region in the lower plane conductor overlap configuration 286 based on the wiring-lower plane conductor overlap configuration 292, that is, the bridge points 293 and 294 shown in
When the detection of the bridge point of the wirings 283 and 284 is completed, the wiring check device 220 transmits information on the detection thereof to the output device 230. And the output device 230 outputs information on the received bridge point. As an output method of the information on the bridge point by the output device 230, there are a method of overlapping the bridge point on the wirings 283 and 284, and putting a round mark, and a method of putting a round mark on a plane conductor. The point which has a high risk of deterioration of an electromagnetic noise characteristic and should be taken a measure design with priority becomes clear by displaying in this way. Thereby, a measure design can be performed efficiently.
Further, in order to display a bridge point on the plane conductor, it is necessary to detect which layer the plane conductor in which the bridge point was detected is. This can be realized by the plane conductor detection unit 222 detecting information on a boundary line between a plane conductor formation region and an excluded region thereof (slit) in each layer, and by the bridge point detection unit 224 referring to this information. That is, the bridge point detection unit 224 should determine of which layer a plane conductor from which the bridge point was detected on the basis of the information of the boundary line between each layer is a plane conductor.
In the way mentioned above, the second wiring checking method is completed.
When emission of electromagnetic noise and coupling of electromagnetic noise entered from outside in a printed wiring board are considered, this method becomes very effective in checking a wiring formed in a substrate inner layer (a layer other than the top layer and the bottom layer in a laminated structure). That is, in the case of a wiring formed in a substrate inner layer, the risk of deteriorating an electromagnetic noise characteristic is different between the state where the wiring is not exposed to the outside of the printed wiring board in both the upper part and the lower part of the printed wiring board, and the state where it is exposed to the outside of the printed wiring board in at least one of the upper part and the lower part of the printed wiring board. However, the state that the wiring is exposed to the outside the printed wiring board in one of the upper part and the lower part of the printed wiring board cannot be grasped in case where only a plane conductor overlap configuration in which all the plane conductors included in the printed wiring board have overlapped is detected like the first wiring checking method. On the other hand, according to the second wiring checking method, the wiring-upper plane conductor overlap configuration and the wiring-lower plane conductor overlap configuration are detected respectively. Therefore, the state that the wiring is exposed to the outside of the printed wiring board in one of the upper part and the lower part of the printed wiring board can be grasped.
Further, in the second checking method, a plane conductor located in the same layer as the wiring may also be detected like the first checking method. In this case, the plane conductor located in the same layer as the wiring may be treated that it is included in both of the upper plane conductor overlap configuration and the lower plane conductor overlap configuration.
Next, as other example of the wiring checking method, a method to detect only a plane conductor within a predetermined distance from a wiring or within a predetermined number of layers among a plurality of plane conductors provided in the printed wiring board will be described. Below, the method to detect only a plane conductor within a predetermined distance from this wiring or within a predetermined number of layers will be called a third wiring checking method.
Further, the principle that the distance between the wiring and the plane conductor influences the magnitude of the risk of deteriorating an electromagnetic noise characteristic is as stated in case of the description about
From the reason mentioned above, when a wiring steps over a plane conductor excluded region (slit), the distance between this slit and the plane conductor arranged in other layer influences a risk of deteriorating an electromagnetic noise characteristic. Based on this, for example, the third wiring checking method such as a method of detecting plane conductors of the upper and the lower two layers from a layer where a wiring exists, or detecting plane conductors within 1 mm in a vertical direction from a wiring can be considered.
The details of the third wiring checking method will be described. Further, as a target printed wiring board on a wiring check, the printed wiring board 240 shown in
The plane conductor detection unit 222 detects plane conductors arranged: in a predetermined number of layers, for example, within two layers from a wiring; within a predetermined distance in a substrate laminating direction from a wiring, for example, within 1 mm from a layer including a wiring; or within 1 mm from a layer located proximate a layer including a wiring.
In this exemplary embodiment, it will be set so that plane conductors of layers within two layers from a layer including a wiring may be detected. In this case, the plane conductor detection unit 222 detects plane conductors 249-252 in layers 242, 243, 245 and 256 within two layers from a layer 244 including a wiring 254 as shown in
Next, the plane conductor overlap configuration detection unit 223 detects a plane conductor overlap configuration 295 which is a configuration in which the plane conductors 249-252 overlap one another. The plane conductor overlap configuration 295 is shown in
The bridge point detection unit 224 detects a wiring-plane conductor overlap configuration 296 which is a configuration in which the wiring 254 and the plane conductor overlap configuration 295 overlap one another.
And the bridge point detection unit 224 detects a point where the wiring 254 steps over a plane conductor excluded region in the plane conductor overlap configuration 295 based on the wiring-plane conductor overlap configuration 296.
Further, because the step in which the output device 230 outputs information on the bridge point after the bridge point detection unit 224 detects a bridge point is similar to other wiring checking methods, the description thereof will be omitted.
In the way mentioned above, the third wiring checking method is completed.
Further, although the plane conductor located in the same layer as the wiring also is also detected in the third wiring checking method like the first wiring checking method, it is not limited to this. That is, a plane conductor except a plane conductor located in the same layer as a wiring may be detected.
According to the third wiring checking method, a bridge point corresponding to the distance and the number of layers from the wiring can be detected Here, in a usual printed wiring board, one dielectric layer separating plane conductors has a thickness of a range from tens of micrometers to several millimeters. Accordingly, it is possible to check a wiring more precisely corresponding to the risk of deterioration of an electromagnetic noise characteristic by specifying the range to detect a plane conductor according to a number of layers or distance.
Further, a wiring check may be performed by a method which combined the third wiring checking method and the second wiring checking method. For example, a plane conductor corresponding to a distance or a number of layers from a wiring is detected, and the plane conductors to be detected may be separated into plane conductors located above the wiring and the plane conductors located below the wiring, and they may be detected, respectively.
Moreover, a wiring may be checked by combining a plurality of checking methods mutually among the first checking method, the second checking method, and the third checking method. For example, in a printed wiring board, some wiring may be checked by the first checking method, and other wiring may be checked by a method which combined the second checking method and the third checking method. Thus, it is possible to perform a wiring check flexibly corresponding to the type, the size or the like of a printed wiring board.
That is, according to the wiring check system 200, multiple wiring checking methods may be prepared, and a configuration that a designer selects which method is employed corresponding to a type of the substrate and the electromagnetic noise characteristic thereof may be used. For example, as shown in
Using the methods mentioned above, by performing a wiring check, a bridge point with a low risk of deteriorating an electromagnetic noise characteristic will be excluded, and only a high-risk bridge point will be detected. Accordingly, the efficiency of a design which improves an electromagnetic noise characteristic can be realized. Thereby, the reliability of an electronic apparatus including a printed wiring board can be improved.
By the way, the inventor of the present application found that a risk of deteriorating an electromagnetic noise characteristic when a wiring steps over the plane conductor excluded region also depends on the area of the plane conductor excluded region. The basis thereof will be described based on a measurement result of an induced voltage by the inventor of the present application.
The configuration of a target printed wiring board of a measurement of an induced voltage is similar to the printed wiring board shown in
Accordingly, according to the fourth exemplary embodiment of the present invention, when a risk of deteriorating an electromagnetic noise characteristic is determined, the size of the plane conductor excluded region which a wiring steps over will be considered.
A wiring check system 300 according to this exemplary embodiment will be described using
The area calculation unit 301 calculates the area of the plane conductor excluded region in the plane conductor overlap configuration.
And the bridge point detection unit 224 detects only a point where a wiring steps over a plane conductor excluded region having the areas beyond the predetermined size as a bridge point. That is, the bridge point detection unit 224 in this exemplary embodiment does not detect a point where the wiring steps over a plane conductor excluded region less than the predetermined area as a bridge point. For example, even if a wiring is stepping over a plane conductor excluded region with a size which is restored to an inside of a quadrangle of 3 mm×3 mm and a circle of 3 mm in radius, it is not detected as a bridge point.
Small plane conductor excluded regions (slits) below several mm square such as clearance holes for preventing conducting of penetration vias or pins of a mounting component, and a plane conductor exists in a general printed wiring board. And even if these slits are not covered by a plane conductor of other layer, the risk of deterioration of an electromagnetic noise characteristic is low. Therefore, by regarding a small slit as a plane conductor formation region, and excluding it from a detection target of a bridge point, a so-called pseudo error of a wiring check system can be reduced. Thereby, a high-risk point of deterioration of an electromagnetic noise characteristic can be detected more accurately.
Further, as the size of the slit which should be excluded from a detection target of a bridge point, a measurement result of an induced voltage of a wiring 13 shown in
Thereby, the bridge point detection unit 224 in this exemplary embodiment can detect only a bridge point in which a risk of deteriorating an electromagnetic noise characteristic is high. Therefore, an electromagnetic noise characteristic of a printed wiring board can be improved more efficiently.
Further, as a method in detail for removing a plane conductor excluded region less than the predetermined area from a detection target, the wiring check device 220 may have a hole filling unit 302 as shown in
A more concrete operation method of the wiring check system 300 of this exemplary embodiment in a case of using the wiring check device 220 shown in
Further, as a target which performs a wiring check, a printed wiring board 310 shown in
Further, it is assumed that the design information on the printed wiring board 310 to which a wiring check is performed is recorded in advance in the design information recording unit 221.
First, the wiring information acquisition unit 221 acquires wiring information on the wiring 317 (Step 12).
And the plane conductor detection unit 222 detects the plane conductors 315 and 316 included in the multiple layers (layers 312, 313 and 314) including the layer 312 nearest to the layer 311 having the wiring 317 (Step 13). The plane conductor overlap configuration detection unit 223 detects a plane conductor overlap configuration 320 which is a configuration in which the plane conductors 315 and 316 overlap one another (Step 14). In a plane conductor overlap configuration 320, a part of one of the slits formed in the plane conductor 315 of the layer 312 is covered by the plane conductor 316 of the layer 313, and its size will be d1×d4. Because other slit and the clearance hole are not covered by the plane conductor 316 of the layer 313, its size is not changed.
Next, the area calculation unit 301 calculates the area of the plane conductor excluded region in the plane conductor overlap configuration 320 (Step 15). And the hole filling unit 302 performs hole filling for the plane conductor excluded region of the area smaller than the predetermined value recorded in the recording device 210 (Step 15). The plane conductor overlap configuration 320 will be a plane conductor overlap configuration 321 by performing hole filling by the hole filling unit 302. Here, the hole filling is performed to the slit of d1×d4 smaller than the quadrangle of a default d5 (d1, d3 and d4<d5<d2) which the storage device 210 records, and the clearance hole with a diameter d3.
Next, the bridge point detection unit 224 detects the wiring-plane conductor overlap configuration 322 in which the wiring 317 and the plane conductor overlap configuration 321 overlap one another (Step 16).
And the bridge point detection unit 224 detects the points (bridge points 323 and 324) where the wiring 317 steps over the plane conductor excluded region in the plane conductor overlap configuration 321 based on the wiring-plane conductor overlap configuration 322 (Step 17).
And a similar step is also performed to the wirings 318 and 319, and points where the respective wirings step over the plane conductor excluded region in the plane conductor overlap configuration 321 is detected. However, because the wirings 318 and 319 do not step over the plane conductor excluded region in the plane conductor overlap configuration 321, the bridge point is not detected.
And when a wiring check is completed about all wirings (in Step 18, NO), the information on the bridge point which the bridge point detection unit 224 detected is transmitted to the output device 230. And the output device 230 outputs the information on the received bridge point (Step 19). Thereby, operation of the wiring check system in this exemplary embodiment is completed.
Further, the detection result of the bridge point in the case where the plane conductor excluded region less than the predetermined area was not performed by the hole filling unit 302 is shown in
On the other hand, the wiring check system 300 in this exemplary embodiment detects only a point where a wiring steps over a plane conductor excluded region larger than the predetermined area. Therefore, a point of a low risk of deterioration of an electromagnetic noise characteristic is not detected any more, and a point with a high risk which should perform improvement design is detected more accurately.
An input device may be added to the configuration of the wiring check system 300 shown in
Further, in this exemplary embodiment, a bridge point detected may be different by whether a plane conductor arranged in the same layer as a wiring is included in a plane conductor overlap configuration. This is because the area of the plane conductor excluded region in the plane conductor overlap configuration becomes small by including the plane conductor arranged in the same layer as the wiring, and it may be performed hole filling by the hole filling unit 302. That is, a point where a risk of deteriorating an electromagnetic noise characteristic is high can be detected more correctly by including the plane conductor arranged in the same layer as the wiring in the plane conductor overlap configuration.
By the way, the inventor of the present application found by an electromagnetic field simulation that a risk of deteriorating an electromagnetic noise characteristic may not be reduced in spite of a slit of a plane conductor located proximate a wiring being covered by other plane conductor. The contents and the result of the electromagnetic field simulation will be described.
First, a difference in a coupling voltage to the wiring 335 by presence or absence of the plane conductor 337 was investigated using such simulation model. Further, the FDTD (Finite Difference Time Domain) method which is an electromagnetic field analysis method of the time domain type was used for the simulation.
A result of the simulation is shown in
Here, in a general printed wiring board, plane conductors are connected mutually by a large number of vias or capacitors. Accordingly, as shown in
A result of the simulation is shown in
That is, it was found that the risk of deteriorating an electromagnetic noise characteristic was reduced when the plane conductors were electrically connected mutually, so that it could be deemed that it was equal to the case where two plane conductors overlapped one another. This is considered because a noise current which flows through the periphery of the slit of the plane conductor 338 comes to flow into the plane conductor 339 by connecting the plane conductors by the vias, and a path of the noise current will approach a case in which both plane conductors overlap one another. When a capacitor is used for connecting between plane conductors, the same effect as the case of connecting by vias is obtained. That is, when the capacitor is used for connecting between the plane conductors, a path of a noise current is formed between the two plane conductors.
Further, in order to deem that two plane conductors connected by vias or a capacitor is the same as the configuration in which both of them overlap one another, an arrangement of the via or the capacitor becomes important. Here, a path of a noise current which flows through a plane conductor is considered.
From this, in order to deem that two plane conductors are similar to the configuration where both overlap one another, vias or capacitors should just be arranged in the neighborhood of the line segment where a boundary line between a plane conductor formation region and a plane conductor excluded region in a layer located proximate the wiring and a plane conductor of other layer overlap. Or, vias or capacitors may be arranged in the neighborhood of the intersection of a boundary line between a plane conductor formation region and a plane conductor excluded region in a layer located proximate the wiring and a boundary line between a plane conductor formation region and a plane conductor excluded region in other layer. Further, a path of a noise current becomes shortest so that the vias or the capacitors are near a line on which a boundary line and other plane conductor overlap or an intersection of boundary lines. That is, it approaches a current path in the configuration in which two plane conductors overlap one another. On the other hand, when vias or capacitors are away from the line segment on which a boundary line and other plane conductor overlap, or the intersection of boundary lines, a path of a noise current becomes longer. That is, a difference from the current path when two plane conductors overlap one another becomes larger. Therefore, as for a via or a capacitor, it is desirable that it is close to a line segment with which a boundary line between a plane conductor formation region and a plane conductor excluded region and other plane conductor overlap, and an intersection of a boundary line between a plane conductor formation region and a plane conductor excluded region.
Here, the range of an arrangement position of a via or a capacitor with which two plane conductors can be deemed to be equivalent to the configuration in which both of them overlap one another. As for a path of a noise current, when a phase of a current by a path of a noise current becoming long is taken into consideration, it is desirable to adopt 1/10 to less than 1/20 of a wave length of the noise current so that it may become sufficiently small compared with the wave length thereof. For example, when a maximum frequency of a noise current is set to 1 GHz, a dielectric substrate is set to FR-4, and a wavelength shortening effect is taken into consideration, it will be about 14 mm by 1/10 of the wave length, and will be about 7 mm by 1/20.
Further, in a general printed wiring board, vias or capacitors are arranged a lot in about several centimeters of interval from several millimeters. Therefore, as observed by the simulation shown in
From the above, when detecting a risk of deterioration of an electromagnetic noise characteristic, it can be said that it is desirable to also take into consideration connection of plane conductors by a via, a capacitor, or the like.
Accordingly, in the fifth exemplary embodiment of the present invention, a wiring check system which can also take into consideration connection of plane conductors by a via, a capacitor, or the like.
A wiring check system 400 in this exemplary embodiment is shown in
The boundary line intersection detection unit 401 detects a boundary line between a plane conductor formation region and a plane conductor excluded region in the respective layers where plane conductors which the plane conductor detection unit 222 detected are arranged. And the boundary line intersection detection unit 401 detects an intersection of a boundary line in a case where plane conductors of each layer overlap one another.
The joint detection unit 402 detects presence or absence of a connection between a plurality of plane conductors within a predetermined distance from the intersection of the boundary line which the boundary line intersection detection unit 401 detected. Further, for example, a connection between the plane conductors is realized by a via or a capacitor.
Next, operation of the wiring check system 400 according to this exemplary embodiment will be described using
Further, it is assumed that the design information on the printed wiring board 410 to which a wiring check is performed is recorded in the design information recording unit 211 in advance.
First, the wiring information acquisition unit 221 acquires wiring information on the target wiring 418 on a wiring check (Step 20). And the plane conductor detection unit 222 detects the plane conductors 415-417 of multiple layers (layers 411-414) including the nearest layer 412 to the layer 411 having the wiring 418 (Step 21).
And the boundary line intersection detection unit 401 detects a boundary line between a plane conductor formation region and a plane conductor excluded region in the layers 412 and 413 (Step 22). And the boundary line intersection detection unit 401 detects an intersection of a boundary line in a case of overlapping the plane conductors 415-417. In the printed wiring board 410, the boundary line intersections which the boundary line intersection detection unit 401 detects are eight boundary line intersections 421 shown in
Next, the joint detection unit 402 detects a joint where it is within a predetermined distance from a boundary line intersection 421 (Step 23). That is, it is detected whether two plane conductors are connected electrically by a predetermined within a predetermined range from the boundary line intersection 421. Specifically, it is detected whether vias or capacitors which connect the plane conductors 415-417 exist within the range of the predetermined value d6 recorded in the recording device 210 centering on the boundary line intersection 421. Moreover, when a joint is not detected within the predetermined range from the boundary line intersection, the joint detection unit 402 detects information on the boundary line intersection. Information on a boundary line intersection is a coordinate of a boundary line intersection or an arrangement of a layer having the boundary lines. Here, in the printed wiring board 410, a joint which connects between the plane conductors does not exist. Therefore, information about all boundary line intersections among eight boundary line intersections 421 is detected.
The plane conductor overlap configuration detection unit 223 detects a plane conductor overlap configuration 422 which is a configuration in which the plane conductors 415-417 which the plane conductor detection unit 222 detected overlap one another (Step 24). And because a plane conductor excluded region smaller than a quadrangle of a predetermined value d7 recorded in the storage device 210 is deemed as a plane conductor formation region, it is performed hole filling, and it will be a plane conductor overlap configuration 423 (Step 25). And the bridge point detection unit 224 detects a wiring-plane conductor overlap configuration 424 which is a configuration in which the wiring 417 and the plane conductor overlap configuration 423 overlap one another (Step 26). Moreover, the bridge point detection unit 224 detects a point where the wiring 417 steps over a plane conductor excluded region in the plane conductor overlap configuration 423 based on the wiring-plane conductor overlap configuration 424 (Step 27). Similarly, a bridge point is also detected about the wirings 419 and 420.
When a check about all the wirings is finished (it is NO in Step 28), the wiring check device 220 transmits information about the bridge points which the bridge point detection unit 224 detected to the output device 230.
And the wiring check device 220 also transmits information about the boundary line intersection in which a joint was not detected within a predetermined range among eight boundary line intersections 421 to the output device 230. Information about the boundary line intersection is a coordinate of a boundary line intersection or information about a plane conductor having boundary lines which the joint detection unit 402 detected.
And the output device 230 outputs information about the bridge point and information about a boundary line intersection in which a joint was not detected within the predetermined range (Step 29).
An example of information which the output device 230 outputs is shown in
Further, the boundary line intersection detection unit 401 may detect not only an intersection of a boundary line but also a line segment on which a boundary line on the layer nearest to the wiring and a plane conductor in other layer overlap. Below, a line segment on which a boundary line on the layer nearest to the wiring and a plane conductor in other layer overlap is called an overlap line segment. In this case, the joint detection unit 402 detects whether a via or a capacitor exists within a predetermined range from the overlap line segment. And in the output by the output device 230, an overlap line segment from which a via or a capacitor was not detected within a predetermined range may be displayed by arranging on the plane conductor.
And, the second wiring checking method or the third wiring checking method which was described in the third exemplary embodiment may be combined with the wiring checking method in this exemplary embodiment. That is, a plane conductor located above a layer having a wiring, and a plane conductor located below the layer may be distinguished and detected. A plane conductor may be detected within a predetermined distance or within a predetermined number of layers from a layer having a wiring.
As mentioned above, when a risk of deterioration of an electromagnetic noise characteristic is detected in this exemplary embodiment, a connection between the plane conductors by vias or capacitors can also be taken into consideration. Therefore, an electromagnetic noise characteristic can be improved more efficiently.
Moreover, it goes without saying that the first exemplary embodiment to the fifth exemplary embodiment can be achieved by preparing a recording medium which recorded a program code of software which realizes a function of each exemplary embodiment, reading the program code stored in the recording medium with a general purpose computer, and operating as a wiring check device.
Further, as a recording medium which supplies a program, for example, it should be able to memorize the above-mentioned program such as a CD-ROM (Compact Disc Read Only Memory), a DVD-R (Digital Versatile Disk Recordable), an optical disc, a magnetic disk and a non-volatility memory card.
Although the part or everything of the above-mentioned exemplary embodiments can also be described like the following supplementary notes, they are not limited to the followings.
(Supplementary note 1) A wiring check device comprising: a wiring information acquisition unit which acquires wiring information on a wiring comprised in a printed wiring board having a multi-layered structure; a plane conductor detection unit which detects a plurality of plane conductors on multiple layers among the multi-layered structure comprising a layer located closest to a layer comprising the wiring; a plane conductor overlap configuration detection unit which detects a plane conductor overlap configuration of a configuration in which the plurality of plane conductors are overlapped; and a bridge point detection unit which detects a point where the wiring steps over a plane conductor excluded region in the plane conductor overlap configuration on the basis of a wiring-plane conductor overlap configuration of a configuration in which the wiring and the plane conductor overlap configuration are overlapped.
(Supplementary note 2) The wiring check device according to supplementary note 1, wherein a plane conductor provided in a layer of the same layer as the wiring is also included in the plurality of plane conductors which the plane conductor detection unit detects.
(Supplementary note 3) The wiring check device according to supplementary note 1 or 2, wherein the plane conductor overlap configuration detection unit detects an upper plane conductor overlap configuration of a configuration in which plane conductors disposed above the wiring are overlapped, and a lower plane conductor overlap configuration of a configuration in which plane conductors disposed below the wiring are overlapped, respectively.
(Supplementary note 4) The wiring check device according to any one of supplementary notes 1 to 3, wherein the plane conductor detection unit detects only a plane conductor which is disposed within a predetermined distance from the wiring in the laminating direction.
(Supplementary note 5) The wiring check device according to any one of supplementary notes 1 to 4, further comprising an area calculation unit which calculates an area of the plane conductor excluded region, wherein the bridge point to be detected by the bridge point detection unit is a point where the wiring steps over the plane conductor excluded region having an area equal to or more than a predetermined value.
(Supplementary note 6) The wiring check device according to any one of supplementary notes 1 to 5, further comprising: a boundary line intersection detection unit which detects a boundary line between a plane conductor formation region and a plane conductor excluded region in the respective layers of the multiple layers, and detects an intersection of the boundary line when the plurality of plane conductors are overlapped; and a joint detection unit which detects presence or absence of a joint between the plurality of plane conductors within a predetermined distance from the intersection of the boundary line.
(Supplementary note 7) The wiring check device according to supplementary note 6, wherein the joint detection unit detects presence or absence of the joint within a predetermined distance from a line segment where the boundary line on a layer nearest to a layer having the wiring and a plane conductor in a layer other than the layer nearest to the layer having the wiring overlap.
(Supplementary note 8) The wiring check device according to any one of supplementary notes 1 to 7, wherein the bridge point comprises an in-plane conductor bridge point which is a point where the wiring steps over a plane conductor excluded region formed inside the plane conductor, and an inter-plane conductor bridge point which is a point where the wiring steps over a plane conductor excluded region formed between a plurality of plane conductors, and the bridge point detection unit distinguishes and detects the in-plane conductor bridge point and the inter-plane conductor bridge point.
(Supplementary note 9) A wiring check system comprising: a wiring information acquisition means which acquires wiring information on a wiring comprised in a printed wiring board having a multi-layered structure; a plane conductor detection means which detects a plurality of plane conductors on multiple layers among the multi-layered structure which comprise a layer located closest to a layer comprising the wiring; a plane conductor overlap configuration detection means which detects a plane conductor overlap configuration of a configuration in which the plurality of plane conductors are overlapped; and a bridge point detection means which detects a point where the wiring steps over a plane conductor excluded region in the plane conductor overlap configuration on the basis of a wiring-plane conductor overlap configuration of a configuration in which the wiring and the plane conductor overlap configuration are overlapped.
(Supplementary note 10) The wiring check system according to supplementary note 9, wherein a plane conductor provided in a layer of the same layer as the wiring is also comprised in the plurality of plane conductors which the plane conductor detection means detects.
(Supplementary note 11) The wiring check system according to supplementary note 9 or 10, wherein the plane conductor overlap configuration detection means detects an upper plane conductor overlap configuration of a configuration in which plane conductors disposed above the wiring are overlapped, and a lower plane conductor overlap configuration of a configuration in which plane conductors disposed below the wiring are overlapped, respectively.
(Supplementary note 12) The wiring check system according to any one of supplementary notes 9 to 11, wherein the plane conductor detection means detects only a plane conductor which is disposed within a predetermined distance from the wiring in the laminating direction.
(Supplementary note 13) The wiring check system according to any one of supplementary notes 9 to 12, further comprising an area calculation means which calculates an area of the plane conductor excluded region, wherein the bridge point to be detected by the bridge point detection means is a point where the wiring steps over the plane conductor excluded region having an area equal to or more than a predetermined value.
(Supplementary note 14) The wiring check system according to any one of supplementary notes 9 to 13, further comprising: a boundary line intersection detection means which detects a boundary line between a plane conductor formation region and a plane conductor excluded region in the respective layers of the multiple layers, and detects an intersection of the boundary line when the plurality of plane conductors are overlapped; and a joint detection means which detects presence or absence of a joint between the plurality of plane conductors within a predetermined distance from the intersection of the boundary line.
(Supplementary note 15) The wiring check system according to supplementary note 14, wherein the joint detection means detects presence or absence of the joint within a predetermined distance from a line segment where the boundary line on a layer nearest to a layer having the wiring and a plane conductor in a layer other than the layer nearest to the layer having the wiring overlap.
(Supplementary note 16) The wiring check system according to any one of supplementary notes 9 to 15, wherein the bridge point comprises an in-plane conductor bridge point which is a point where the wiring steps over a plane conductor excluded region formed inside the plane conductor, and an inter-plane conductor bridge point which is a point where the wiring steps over a plane conductor excluded region formed between a plurality of plane conductors, and the bridge point detection means distinguishes and detects the in-plane conductor bridge point and the inter-plane conductor bridge point.
(Supplementary note 17) a wiring check system described in any one of supplementary notes 9 to 16, further comprising an output means which outputs information which the bridge point detection means detected.
(Supplementary note 18) A wiring checking method comprising: a wiring information acquisition step which acquires wiring information on a wiring comprised in a printed wiring board having a multi-layered structure; a plane conductor detection step which detects a plurality of plane conductors on multiple layers among the multi-layered structure comprising a layer located closest to a layer comprising the wiring; a plane conductor overlap configuration detection step which detects a plane conductor overlap configuration of a configuration in which the plurality of plane conductors are overlapped; and a bridge point detection step which detects a point where the wiring steps over a plane conductor excluded region in the plane conductor overlap configuration on the basis of a wiring-plane conductor overlap configuration of a configuration in which the wiring and the plane conductor overlap configuration are overlapped.
(Supplementary note 19) The wiring checking method according to supplementary note 18, wherein the plurality of plane conductors detected in the plane conductor detection step comprise a plane conductor which a layer of the same layer as the wiring has.
(Supplementary note 20) The wiring checking method according to supplementary note 18 or 19, wherein an upper plane conductor overlap configuration of a configuration in which plane conductors disposed above the wiring are overlapped, and a lower plane conductor overlap configuration of a configuration in which plane conductors disposed below the wiring are overlapped are detected respectively in the plane conductor overlap configuration detection step.
(Supplementary note 21) The wiring checking method according to any one of supplementary notes 18 to 20, wherein only a plane conductor which is disposed within a predetermined distance from the wiring in the laminating direction is detected in the plane conductor detection step.
(Supplementary note 22) The wiring checking method according to any one of supplementary notes 18 to 21, further comprising an area calculating step which calculates an area of the plane conductor excluded region, wherein the bridge point to be detected in the bridge point detection step is a point where the wiring steps over the plane conductor excluded region having an area equal to or more than a predetermined value.
(Supplementary note 23) The wiring checking method according to any one of supplementary notes 18 to 22, further comprising: a boundary line intersection detection step which detects a boundary line between a plane conductor formation region and a plane conductor excluded region in the respective layers of the multiple layers, and detects an intersection of the boundary line when the plurality of plane conductors are overlapped; and a joint detection step which detects presence or absence of a joint between the plurality of plane conductors within a predetermined distance from the intersection of the boundary line.
(Supplementary note 24) The wiring checking method according to supplementary note 23, wherein the joint detection step detects presence or absence of the joint within a predetermined distance from a line segment where the boundary line on a layer nearest to a layer having the wiring and a plane conductor in a layer other than the layer nearest to the layer having the wiring overlap.
(Supplementary note 25) The wiring checking method according to any one of supplementary notes 18 to 24, wherein the bridge point comprises an in-plane conductor bridge point which is a point where the wiring steps over a plane conductor excluded region formed inside the plane conductor, and an inter-plane conductor bridge point which is a point where the wiring steps over a plane conductor excluded region formed between a plurality of plane conductors, and the in-plane conductor bridge point and the inter-plane conductor bridge point are distinguished and detected in the bridge point detection step.
(Supplementary note 26) The wiring checking method according to any one of supplementary notes 18 to 25, further comprising an output step of outputting information which the bridge point detection step detected.
(Supplementary note 27) A wiring check program for making a computer executes steps of: a wiring information acquisition step which acquires wiring information on a wiring comprised in a printed wiring board having a multi-layered structure; a plane conductor detection step which detects a plurality of plane conductors on multiple layers among the multi-layered structure comprising a layer located closest to a layer comprising the wiring; a plane conductor overlap configuration detection step which detects a plane conductor overlap configuration of a configuration in which the plurality of plane conductors are overlapped; and a bridge point detection step which detects a point where the wiring steps over a plane conductor excluded region in the plane conductor overlap configuration on the basis of a wiring-plane conductor overlap configuration of a configuration in which the wiring and the plane conductor overlap configuration are overlapped.
(Supplementary note 28) A recording medium which is a computer readable storage medium records a wiring check program according to supplementary note 27.
Although the present invention has been described with reference to the exemplary embodiments as mentioned above, the present invention is not limited to the above-mentioned exemplary embodiments. Various change in the configurations and details of the invention of the present application which a person skilled in the art can understand within the scope of the invention of the present application can be made.
This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2011-116002 filed on May 24, 2011, the disclosure of which is incorporated herein its entirety.
The check system of a plane bridge wiring of a printed wiring board of the present invention is applicable in the use such as the wiring check tools of a printed wiring board for improving an electromagnetic noise characteristic.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2011-116002 | May 2011 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2012/063570 | 5/21/2012 | WO | 00 | 11/22/2013 |
