Spray coating

Industry

CPC
H01L2224/11821

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11821Spray coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,791,313
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,456,280
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 10,833,053
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 9,735,123
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 9,397,063
- Issue date Jul 19, 2016
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Manufacture of coated copper pillars
- Patent number 9,331,040
- Issue date May 3, 2016
- Atotech Deutschland GmbH
- Thomas Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering device, soldering method, and substrate and electronic co...
- Patent number 9,289,841
- Issue date Mar 22, 2016
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating wafer-level chip package
- Patent number 9,230,927
- Issue date Jan 5, 2016
- Xintec Inc.
- Chuan-Jin Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices employing semiconductor die having hydrophobic coatings, an...
- Patent number 9,220,183
- Issue date Dec 22, 2015
- International Business Machines Corporation
- Daniel J. Buvid
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 9,030,001
- Issue date May 12, 2015
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 8,580,607
- Issue date Nov 12, 2013
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and apparatus for electrostatic discharge protection using a...
- Patent number 7,629,202
- Issue date Dec 8, 2009
- International Business Machines Corporation
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230369288
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20220392872
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20210057382
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ELEMENT AND CHIP PACKAGE
- Publication number 20150171041
- Publication date Jun 18, 2015
- MUTUAL-PAK TECHNOLOGY CO., LTD.
- Po Ching CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FABRICATING WAFER-LEVEL CHIP PACKAGE
- Publication number 20150099357
- Publication date Apr 9, 2015
- XINTEC INC.
- Chuan-Jin SHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC CO...
- Publication number 20140212678
- Publication date Jul 31, 2014
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
- Publication number 20140077351
- Publication date Mar 20, 2014
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
- Publication number 20120025365
- Publication date Feb 2, 2012
- Tessera Research LLC
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Application
ROOM TEMPERATURE DIRECT METAL-METAL BONDING
- Publication number 20110226841
- Publication date Sep 22, 2011
- Jun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...
- Publication number 20090275191
- Publication date Nov 5, 2009
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS

Spray coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of forming the same

Semiconductor package and method of forming the same

Semiconductor package and method of forming the same

Semiconductor device structure and manufacturing method

Microelectronic packages with nanoparticle joining

Manufacture of coated copper pillars

Soldering device, soldering method, and substrate and electronic co...

Method of fabricating wafer-level chip package

Devices employing semiconductor die having hydrophobic coatings, an...

Microelectronic packages with nanoparticle joining

Microelectronic packages with nanoparticle joining

Method and apparatus for electrostatic discharge protection using a...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

CHIP ELEMENT AND CHIP PACKAGE

METHOD OF FABRICATING WAFER-LEVEL CHIP PACKAGE

SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC CO...

MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING

MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...