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H01L2224/43821

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/43821Spray coating

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Patents Grantslast 30 patents

Information Patent Grant
Miniaturization of optical sensor modules through wirebonded ball s...
- Patent number 11,552,053
- Issue date Jan 10, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- G02 - OPTICS
Information Patent Grant
Wire bonding structure and method for forming same
- Patent number 8,247,911
- Issue date Aug 21, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device, method for producing or as...
- Patent number 5,031,821
- Issue date Jul 16, 1991
- Hitachi, Ltd.
- Tsuyoshi Kaneda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME
- Publication number 20100213619
- Publication date Aug 26, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS