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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 12,132,040
- Issue date Oct 29, 2024
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,996,399
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,942,463
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,710,727
- Issue date Jul 25, 2023
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor IC-embedded substrate having heat dissipation structu...
- Patent number 11,682,628
- Issue date Jun 20, 2023
- TDK Corporation
- Kazutoshi Tsuyutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having chip pads of different surface areas, and...
- Patent number 11,682,643
- Issue date Jun 20, 2023
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,664,362
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling of integrated circuits (ICS) through a passivation-defined...
- Patent number 11,450,630
- Issue date Sep 20, 2022
- Cirrus Logic, Inc.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,393,781
- Issue date Jul 19, 2022
- Kioxia Corporation
- Takashi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,335,656
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,270,987
- Issue date Mar 8, 2022
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,257,805
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 10,784,219
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for electrical overstress protection
- Patent number 10,770,452
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Leslie Paul Wallis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,748,848
- Issue date Aug 18, 2020
- Au Optronics Corporation
- Chih-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 10,748,871
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Seong Hwan Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,748,886
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection pads for low cross-talk vertical wirebonds
- Patent number 10,580,756
- Issue date Mar 3, 2020
- Intel Corporation
- Hungying L. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on file display device including the same
- Patent number 10,546,807
- Issue date Jan 28, 2020
- LG Display Co., Ltd.
- Soon-Dong Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,438,927
- Issue date Oct 8, 2019
- Samsung Electronics Co, Ltd.
- Ha Yong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 10,388,642
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film type semiconductor package
- Patent number 10,256,174
- Issue date Apr 9, 2019
- Samsung Electronics Co., Ltd.
- Na-rae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and method for binding the same
- Patent number 9,960,132
- Issue date May 1, 2018
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming pad layout for flipchip...
- Patent number 9,780,057
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,659,888
- Issue date May 23, 2017
- Renesas Electronics Corporation
- Makio Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented bond pads and methods of fabrication thereof
- Patent number 9,543,260
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, substrate and semiconductor device manufactur...
- Patent number 9,520,374
- Issue date Dec 13, 2016
- Rohm Co., Ltd.
- Yasumasa Kasuya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240404970
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME
- Publication number 20240339382
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- YOU CHYE HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
- Publication number 20240266341
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY DEVICE
- Publication number 20240222322
- Publication date Jul 4, 2024
- SAMSUNG ELECRTONICS CO., LTD.
- Hanmin Nam
- G11 - INFORMATION STORAGE
Information Patent Application
Dielectric Blocking Layer and Method Forming the Same
- Publication number 20230411329
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411328
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Shinya ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-PITCH JOINING PAD STRUCTURE
- Publication number 20230317652
- Publication date Oct 5, 2023
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230268333
- Publication date Aug 24, 2023
- Samsung Electronics Co., Ltd.
- Hyun Mog PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...
- Publication number 20230253353
- Publication date Aug 10, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230230946
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Seongyo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE
- Publication number 20230215828
- Publication date Jul 6, 2023
- Micron Technology, Inc.
- Andreas Kuesel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230215829
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- JINHEE HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230215827
- Publication date Jul 6, 2023
- MURATA MANUFACTURING CO., LTD.
- Kiyohiro KASHIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230132272
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- JUN YOUNG OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...
- Publication number 20230060594
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ENHANCED QUAD FLAT NO-LEAD ELECTRONIC DEVICE WITH CONDUCT...
- Publication number 20230044284
- Publication date Feb 9, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005885
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Hyemi Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD T...
- Publication number 20220336314
- Publication date Oct 20, 2022
- SMArim Global Corp.
- TIEN-LAI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF, AND MANUFACT...
- Publication number 20220302059
- Publication date Sep 22, 2022
- TDK Corporation
- Atsushi YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20220278063
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20220189940
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Hyun Mog PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding with Uniform Pattern Density
- Publication number 20220173092
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...
- Publication number 20220173061
- Publication date Jun 2, 2022
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...
- Publication number 20220130778
- Publication date Apr 28, 2022
- Cirrus Logic International Semiconductor Ltd.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210280545
- Publication date Sep 9, 2021
- Kioxia Corporation
- Takashi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20210082897
- Publication date Mar 18, 2021
- KIOXIA Corporation
- Nobuaki OKADA
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20210005561
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20200381413
- Publication date Dec 3, 2020
- Samsung Electronics Co., Ltd.
- Hyun Mog PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IC-EMBEDDED SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20200194375
- Publication date Jun 18, 2020
- TDK Corporation
- Kazutoshi TSUYUTANI
- H01 - BASIC ELECTRIC ELEMENTS

Square or rectangular array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor storage device

Bonded assembly containing different size opposing bonding pads and...

Hybrid bonding with uniform pattern density

Semiconductor devices

Semiconductor device and method of manufacturing

Semiconductor storage device

Semiconductor IC-embedded substrate having heat dissipation structu...

Semiconductor chip having chip pads of different surface areas, and...

Semiconductor devices

Coupling of integrated circuits (ICS) through a passivation-defined...

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing

Semiconductor devices

Hybrid bonding with uniform pattern density

Semiconductor device and method of manufacturing

Apparatus and methods for electrical overstress protection

Electronic device

Semiconductor chip and semiconductor package including the same

Semiconductor devices

Connection pads for low cross-talk vertical wirebonds

Chip on file display device including the same

Fan-out semiconductor package

Hybrid bonding with uniform pattern density

Film type semiconductor package

Display apparatus and method for binding the same

Semiconductor device and method of forming pad layout for flipchip...

Semiconductor device

Segmented bond pads and methods of fabrication thereof

Semiconductor device, substrate and semiconductor device manufactur...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME

HYBRID BONDING WITH UNIFORM PATTERN DENSITY

NON-VOLATILE MEMORY DEVICE

Dielectric Blocking Layer and Method Forming the Same

SEMICONDUCTOR DEVICE

FINE-PITCH JOINING PAD STRUCTURE

SEMICONDUCTOR DEVICES

BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...

SEMICONDUCTOR PACKAGE

LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...

FLIP-CHIP ENHANCED QUAD FLAT NO-LEAD ELECTRONIC DEVICE WITH CONDUCT...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

CHIP MODULE WITH HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD T...

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF, AND MANUFACT...

Semiconductor Device and Method of Manufacturing

SEMICONDUCTOR DEVICES

Hybrid Bonding with Uniform Pattern Density

SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...

COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STORAGE DEVICE

Semiconductor Device and Method of Manufacturing

SEMICONDUCTOR DEVICES

SEMICONDUCTOR IC-EMBEDDED SUBSTRATE AND ITS MANUFACTURING METHOD