TREA

Stacked arrangements of planar printed circuit boards

Follow

Industry

  • CPC
  • H05K1/144
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/144Stacked arrangements of planar printed circuit boards
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240147622
    • Publication date May 2, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Yoon LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS
    • Publication number 20240147602
    • Publication date May 2, 2024
    • CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Xianfeng YANG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240138066
    • Publication date Apr 25, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIGHT EMITTING DIODE MODULE AND SYSTEM INCLUDING THE SAME
    • Publication number 20240136487
    • Publication date Apr 25, 2024
    • SEOUL SEMICONDUCTOR CO., LTD.
    • Meen Woo KWAK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240138052
    • Publication date Apr 25, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FIELD DEVICE AND METHOD FOR COMPACT ARRANGEMENT OF ELECTRONIC ASSEM...
    • Publication number 20240138067
    • Publication date Apr 25, 2024
    • Vega Grieshaber KG
    • Thomas ILG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD WELD STRUCTURE
    • Publication number 20240130044
    • Publication date Apr 18, 2024
    • Taicang Manaflex Technology Co., Ltd.
    • Robert C. Lane
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENT...
    • Publication number 20240107726
    • Publication date Mar 28, 2024
    • Samsung Electronics Co., Ltd.
    • Hyelim YUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ENCLOSURE ASSEMBLIES, AND RELATED DEVICES AND METHODS
    • Publication number 20240107654
    • Publication date Mar 28, 2024
    • Cummins Inc.
    • Vineet K. Pandey
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
    • Publication number 20240098890
    • Publication date Mar 21, 2024
    • PanelSemi Corporation
    • Chao-Jung CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DRIVE AND CONTROL INTEGRATED BOARD, CONTROL SYSTEM, AND ROBOT
    • Publication number 20240098875
    • Publication date Mar 21, 2024
    • QKM TECHNOLOGY (DONG GUAN) CO., LTD
    • Jinbo SHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE
    • Publication number 20240080983
    • Publication date Mar 7, 2024
    • LG Innotek Co., Ltd.
    • Kwang Sung KIM
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD
    • Publication number 20240080982
    • Publication date Mar 7, 2024
    • Samsung Electronics Co., Ltd.
    • Juho Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE INCLUDING INTERPOSER
    • Publication number 20240074059
    • Publication date Feb 29, 2024
    • Samsung Electronics Co., Ltd.
    • Jungsik PARK
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240064911
    • Publication date Feb 22, 2024
    • SAMSUNG DISPLAY CO., LTD.
    • JEONGJIN PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit Board Assembly with Interposer Circuit Board and Correspond...
    • Publication number 20240064898
    • Publication date Feb 22, 2024
    • Motorola Mobility LLC
    • Wayne G Morrison
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY
    • Publication number 20240057255
    • Publication date Feb 15, 2024
    • ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
    • Stanley Buchert
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FREE POSITIONING CHARGING PAD
    • Publication number 20240055906
    • Publication date Feb 15, 2024
    • AIRA, INC.
    • Eric Heindel Goodchild
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    WIRELESS MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
    • Publication number 20240056520
    • Publication date Feb 15, 2024
    • Samsung Electronics Co., Ltd.
    • Youngsub KIM
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
    • Publication number 20240055745
    • Publication date Feb 15, 2024
    • Murata Manufacturing Co., Ltd.
    • Nobuo IKEMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
    • Publication number 20240057256
    • Publication date Feb 15, 2024
    • JCET GROUP CO., LTD.
    • Yaojian LIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic Module
    • Publication number 20240049391
    • Publication date Feb 8, 2024
    • CYNTEC CO., LTD.
    • Chien Ming Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Overlap Joint Flex Circuit Board Interconnection
    • Publication number 20240049392
    • Publication date Feb 8, 2024
    • Google LLC
    • John Martinis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WEARABLE NEUROSTIMULATOR WITH RIVET CONNECTION
    • Publication number 20240039190
    • Publication date Feb 1, 2024
    • AVATION MEDICAL, INC.
    • Austin Morgan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240023239
    • Publication date Jan 18, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Jung Jui KANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH-FREQUENCY MODULE
    • Publication number 20240023263
    • Publication date Jan 18, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihiro DAIMON
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    CIRCUIT BOARD MODULE
    • Publication number 20240023245
    • Publication date Jan 18, 2024
    • CHICONY ELECTRONICS CO., LTD.
    • Hsueh Hua Wang
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    HIGH CONNECTIVITY DEVICE STACKING
    • Publication number 20240021582
    • Publication date Jan 18, 2024
    • Applied Materials, Inc.
    • Kurtis LESCHKIES
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD (PCB) COOLING
    • Publication number 20240015881
    • Publication date Jan 11, 2024
    • HAMILTON SUNDSTRAND CORPORATION
    • Yongduk Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
    • Publication number 20240015914
    • Publication date Jan 11, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihiro DAIMON
    • H03 - BASIC ELECTRONIC CIRCUITRY