Stacked arrangements

Industry

CPC
H01L2224/49174

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/49174Stacked arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including stacked dies with interleaved wire...
- Patent number 12,136,607
- Issue date Nov 5, 2024
- Micron Technology, Inc.
- Koichi Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,658,149
- Issue date May 23, 2023
- SK hynix Inc.
- Jin Kyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die for stacked integrated circuits
- Patent number 11,532,592
- Issue date Dec 20, 2022
- Western Digital Technologies, Inc.
- David C. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,896,891
- Issue date Jan 19, 2021
- TOSHIBA MEMORY CORPORATION
- Yu Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 10,483,209
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line optimization for multi-die systems
- Patent number 10,468,073
- Issue date Nov 5, 2019
- SanDisk Technologies LLC
- John Thomas Contreras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wire studs as vertical i...
- Patent number 10,446,523
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including package substrate and chip stack in...
- Patent number 10,283,486
- Issue date May 7, 2019
- Samsung Electronics Co., Ltd.
- Jin-Young Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded wide I/O semiconductor device
- Patent number 9,899,347
- Issue date Feb 20, 2018
- SanDisk Technologies LLC
- Michael Mostovoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and connection checking method for semiconduct...
- Patent number 9,502,385
- Issue date Nov 22, 2016
- Renesas Electronics Corporation
- Naoto Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts
- Patent number 9,461,015
- Issue date Oct 4, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wire studs as vertical interconnect in...
- Patent number 9,443,797
- Issue date Sep 13, 2016
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module having stacked substrates arranged to provide tightly-...
- Patent number 9,391,055
- Issue date Jul 12, 2016
- Lockheed Martin Corporation
- Gregory George Romas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact arrangements for stackable microelectronic package structur...
- Patent number 9,349,707
- Issue date May 24, 2016
- Invensas Corporation
- Zhuowen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale technique for interconnecting vertically stacked dies
- Patent number 9,331,051
- Issue date May 3, 2016
- Technische Universiteit Eindhoven
- Pinxiang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-circular die package interconnect
- Patent number 9,305,901
- Issue date Apr 5, 2016
- Seagate Technology LLC
- Frank Dropps
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 9,147,623
- Issue date Sep 29, 2015
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die sensor package
- Patent number 9,134,193
- Issue date Sep 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor packages including semiconductor chips having protrus...
- Patent number 9,093,441
- Issue date Jul 28, 2015
- SK Hynix Inc.
- Ji Eun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and ref...
- Patent number 9,030,031
- Issue date May 12, 2015
- Tessera, Inc.
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip structure and multi-chip stack package
- Patent number 9,018,772
- Issue date Apr 28, 2015
- ChipMOS Technologies Inc.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 9,006,098
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of wafer level package
- Patent number 8,980,695
- Issue date Mar 17, 2015
- ChipMOS Technologies Inc.
- Tsung Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of carrier-free semiconductor package
- Patent number 8,962,396
- Issue date Feb 24, 2015
- Siliconware Precision Industries Co., Ltd.
- Ching-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management for nonvolatile memory array
- Patent number 8,929,169
- Issue date Jan 6, 2015
- SanDisk Technologies Inc.
- Nian Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit
- Patent number 8,829,659
- Issue date Sep 9, 2014
- Sony Corporation
- Xiaobing Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 8,803,307
- Issue date Aug 12, 2014
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts
- Patent number 8,787,032
- Issue date Jul 22, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STACK STRUCTURE
- Publication number 20240030190
- Publication date Jan 25, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Honglong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE
- Publication number 20230395566
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Vijayakrishna J. Vankayala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE
- Publication number 20230395565
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Vijayakrishna J. Vankayala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS
- Publication number 20230082706
- Publication date Mar 16, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE...
- Publication number 20230061258
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Koichi Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230028252
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- Hwan-Wook Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220189914
- Publication date Jun 16, 2022
- SK HYNIX INC.
- Jin Kyoung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DIE FOR STACKED INTEGRATED CIRCUITS
- Publication number 20210351152
- Publication date Nov 11, 2021
- Western Digital Technologies, Inc.
- David C. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20200083171
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200083192
- Publication date Mar 12, 2020
- Toshiba Memory Corporation
- Yu Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE OPTIMIZATION FOR MULTI-DIE SYSTEMS
- Publication number 20190206450
- Publication date Jul 4, 2019
- SanDisk Technologies LLC
- John Thomas Contreras
- G11 - INFORMATION STORAGE
Information Patent Application
WIRE BONDED WIDE I/O SEMICONDUCTOR DEVICE
- Publication number 20180174996
- Publication date Jun 21, 2018
- SanDisk Technologies LLC
- Michael Mostovoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180145053
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- JIN-YOUNG JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR DEVICE INCLUDING FAN-OUT MEMO...
- Publication number 20160329298
- Publication date Nov 10, 2016
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CONNECTION CHECKING METHOD FOR SEMICONDUCT...
- Publication number 20150221618
- Publication date Aug 6, 2015
- RENESAS ELECTRONICS CORPORATION
- Naoto AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE SENSOR PACKAGE
- Publication number 20150160087
- Publication date Jun 11, 2015
- Chee Seng Foong
- B60 - VEHICLES IN GENERAL
Information Patent Application
STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL
- Publication number 20140363924
- Publication date Dec 11, 2014
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20140346683
- Publication date Nov 27, 2014
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF WAFER LEVEL PACKAGE
- Publication number 20140315355
- Publication date Oct 23, 2014
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer scale technique for interconnecting vertically stacked dies
- Publication number 20140300008
- Publication date Oct 9, 2014
- Pinxiang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS
- Publication number 20140239513
- Publication date Aug 28, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING SEMICONDUCTOR CHIPS HAVING PROTRUS...
- Publication number 20140175638
- Publication date Jun 26, 2014
- SK HYNIX INC.
- Ji Eun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND MULTI-CHIP STACK PACKAGE
- Publication number 20140159253
- Publication date Jun 12, 2014
- CHIPMOS TECHNOLOGIES INC.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING STACKED SUBSTRATES ARRANGED TO PROVIDE TIGHTLY-...
- Publication number 20140152373
- Publication date Jun 5, 2014
- Lockheed Martin Corporation
- Gregory George Romas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND REF...
- Publication number 20140117567
- Publication date May 1, 2014
- Tessera, Inc.
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Wire Studs as Vertical I...
- Publication number 20140077364
- Publication date Mar 20, 2014
- STATS ChipPAC, Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF CARRIER-FREE SEMICONDUCTOR PACKAGE
- Publication number 20140080265
- Publication date Mar 20, 2014
- Siliconware Precision Industries Co., Ltd.
- Ching-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140061899
- Publication date Mar 6, 2014
- CHIPMOS TECHNOLOGIES INC.
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20130292854
- Publication date Nov 7, 2013
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS

Stacked arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices including stacked dies with interleaved wire...

Impedance controlled electrical interconnection employing meta-mate...

Semiconductor package including stacked semiconductor chips

Capacitor die for stacked integrated circuits

Impedance controlled electrical interconnection employing meta-mate...

Semiconductor device

Impedance controlled electrical interconnection employing meta-mate...

Transmission line optimization for multi-die systems

Semiconductor device and method of forming wire studs as vertical i...

Semiconductor package including package substrate and chip stack in...

Wire bonded wide I/O semiconductor device

Semiconductor device and connection checking method for semiconduct...

Enhanced stacked microelectronic assemblies with central contacts

Semiconductor device having wire studs as vertical interconnect in...

Power module having stacked substrates arranged to provide tightly-...

Contact arrangements for stackable microelectronic package structur...

Wafer scale technique for interconnecting vertically stacked dies

Non-circular die package interconnect

Stacked microelectronic devices and methods for manufacturing stack...

Stacked die sensor package

Semiconductor packages including semiconductor chips having protrus...

Microelectronic assembly with impedance controlled wirebond and ref...

Chip structure and multi-chip stack package

Impedance controlled electrical interconnection employing meta-mate...

Manufacturing method of wafer level package

Fabrication method of carrier-free semiconductor package

Power management for nonvolatile memory array

Integrated circuit

Stacked microelectronic devices and methods for manufacturing stack...

Enhanced stacked microelectronic assemblies with central contacts

Patents Applicationslast 30 patents

SEMICONDUCTOR STACK STRUCTURE

REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE

INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE

MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS

SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE...

SEMICONDUCTOR PACKAGE

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

CAPACITOR DIE FOR STACKED INTEGRATED CIRCUITS

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

SEMICONDUCTOR DEVICE

TRANSMISSION LINE OPTIMIZATION FOR MULTI-DIE SYSTEMS

WIRE BONDED WIDE I/O SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR DEVICE INCLUDING FAN-OUT MEMO...

SEMICONDUCTOR DEVICE AND CONNECTION CHECKING METHOD FOR SEMICONDUCT...

STACKED DIE SENSOR PACKAGE

STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

MANUFACTURING METHOD OF WAFER LEVEL PACKAGE

Wafer scale technique for interconnecting vertically stacked dies

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS

SEMICONDUCTOR PACKAGES INCLUDING SEMICONDUCTOR CHIPS HAVING PROTRUS...

CHIP STRUCTURE AND MULTI-CHIP STACK PACKAGE

POWER MODULE HAVING STACKED SUBSTRATES ARRANGED TO PROVIDE TIGHTLY-...

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND REF...

Semiconductor Device and Method of Forming Wire Studs as Vertical I...

FABRICATION METHOD OF CARRIER-FREE SEMICONDUCTOR PACKAGE

WAFER LEVEL PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...