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H01L2224/41174

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/41174Stacked arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module including multiple signal wiring patterns disposed on...
- Patent number 10,734,911
- Issue date Aug 4, 2020
- Rohm Co., Ltd.
- Tatsuya Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and conductive member for semiconductor module...
- Patent number 10,475,667
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 9,905,500
- Issue date Feb 27, 2018
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20200035656
- Publication date Jan 30, 2020
- ROHM CO., LTD.
- Tatsuya MIYAZAKI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20170025336
- Publication date Jan 26, 2017
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H01 - BASIC ELECTRIC ELEMENTS