Stacked arrangements

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CPC
H01L2224/25174

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/25174Stacked arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light emitting array structure and display
- Patent number 12,094,861
- Issue date Sep 17, 2024
- Lextar Electronics Corporation
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with bridge die laterally wrapped by insulating e...
- Patent number 12,033,949
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display device
- Patent number 11,990,458
- Issue date May 21, 2024
- LG Display Co., Ltd.
- Jae Yong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,710,715
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Joo Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bridged fanout chiplet connectivity
- Patent number 11,658,123
- Issue date May 23, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package with connection stru...
- Patent number 11,532,587
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including a first die and a second die and a brid...
- Patent number 11,482,497
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,456,268
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,362,057
- Issue date Jun 14, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,127,708
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,985,127
- Issue date Apr 20, 2021
- Samsung Electronics Co., Ltd.
- Jeong Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming complex electronic circuits by interconnecting g...
- Patent number 10,964,665
- Issue date Mar 30, 2021
- Nthdegree Technologies Worldwide, Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar wafer level fan-out of multi-chip modules having different s...
- Patent number 10,943,883
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package with connection stru...
- Patent number 10,916,519
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package integrating active and passive components wit...
- Patent number 10,825,775
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Myung Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronics package and method of manufacturing thereof
- Patent number 10,700,035
- Issue date Jun 30, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,522,497
- Issue date Dec 31, 2019
- Samsung Electronics Co., Ltd.
- Jeong Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,504,865
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits using a printable solution def...
- Patent number 10,499,499
- Issue date Dec 3, 2019
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a semiconductor package
- Patent number 10,340,259
- Issue date Jul 2, 2019
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronics package and method of manufacturing thereof
- Patent number 10,312,194
- Issue date Jun 4, 2019
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits using a patterned hydrophobic...
- Patent number 9,913,371
- Issue date Mar 6, 2018
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits
- Patent number 9,572,249
- Issue date Feb 14, 2017
- Nthdegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-terminal printed devices interconnected as circuits
- Patent number 9,275,978
- Issue date Mar 1, 2016
- NthDegree Technologies Worldwide Inc.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-terminal printed devices interconnected as circuits
- Patent number 9,099,568
- Issue date Aug 4, 2015
- NthDegree Technologies Worldwide Inc.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including double-sided multi-electrode chip em...
- Patent number 8,446,003
- Issue date May 21, 2013
- Denso Corporation
- Atsushi Komura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20240332202
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240178357
- Publication date May 30, 2024
- AUO Corporation
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages Including Interconnect Die Embedded in Package Substrates
- Publication number 20230307427
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Semiconductor Package with Connection Stru...
- Publication number 20230122816
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20230036283
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220359478
- Publication date Nov 10, 2022
- SAMSUNG DISPLAY CO., LTD.
- Xinxing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY DEVICE
- Publication number 20220320055
- Publication date Oct 6, 2022
- LG Display Co., Ltd.
- Jae Yong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A FIRST DIE AND A SECOND DIE AND A BRID...
- Publication number 20220223534
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BRIDGED FANOUT CHIPLET CONNECTIVITY
- Publication number 20220102276
- Publication date Mar 31, 2022
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ARRAY STRUCTURE AND DISPLAY
- Publication number 20220093578
- Publication date Mar 24, 2022
- Lextar Electronics Corporation
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210384153
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Joo Hyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Semiconductor Package with Connection Stru...
- Publication number 20210167032
- Publication date Jun 3, 2021
- Taiwan Semiconductor Maufacturing Co., Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210118839
- Publication date Apr 22, 2021
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR WAFER LEVEL FAN-OUT OF MULTI-CHIP MODULES HAVING DIFFERENT S...
- Publication number 20210091032
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200235065
- Publication date Jul 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20200126942
- Publication date Apr 23, 2020
- Samsung Electronics Co., Ltd.
- Jeong Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200075526
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Method Forming Same
- Publication number 20190378809
- Publication date Dec 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190371731
- Publication date Dec 5, 2019
- Samsung Electronics Co., Ltd.
- Myung Sam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190131270
- Publication date May 2, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190096841
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180130747
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180130762
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING COMPLEX ELECTRONIC CIRCUITS
- Publication number 20140268591
- Publication date Sep 18, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-TERMINAL PRINTED DEVICES INTERCONNECTED AS CIRCUITS
- Publication number 20140264460
- Publication date Sep 18, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100295170
- Publication date Nov 25, 2010
- DENSO CORPORATION
- Atsushi KOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Stacked arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting array structure and display

Package structure with bridge die laterally wrapped by insulating e...

Light emitting diode display device

Semiconductor package

Hybrid bridged fanout chiplet connectivity

Method for manufacturing semiconductor package with connection stru...

Package structure including a first die and a second die and a brid...

Semiconductor package and manufacturing method thereof

Chip package structure and manufacturing method thereof

Package structure and method of manufacturing the same

Fan-out semiconductor package

Method for forming complex electronic circuits by interconnecting g...

Planar wafer level fan-out of multi-chip modules having different s...

Method for manufacturing semiconductor package with connection stru...

Semiconductor package integrating active and passive components wit...

Stacked electronics package and method of manufacturing thereof

Fan-out semiconductor package

Package structure and method of manufacturing the same

Printing complex electronic circuits using a printable solution def...

Method for fabricating a semiconductor package

Stacked electronics package and method of manufacturing thereof

Printing complex electronic circuits using a patterned hydrophobic...

Printing complex electronic circuits

Three-terminal printed devices interconnected as circuits

Three-terminal printed devices interconnected as circuits

Semiconductor device including double-sided multi-electrode chip em...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

Packages Including Interconnect Die Embedded in Package Substrates

Method for Manufacturing Semiconductor Package with Connection Stru...

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME

LIGHT EMITTING DIODE DISPLAY DEVICE

PACKAGE STRUCTURE INCLUDING A FIRST DIE AND A SECOND DIE AND A BRID...

HYBRID BRIDGED FANOUT CHIPLET CONNECTIVITY

LIGHT EMITTING ARRAY STRUCTURE AND DISPLAY

SEMICONDUCTOR PACKAGE

Method for Manufacturing Semiconductor Package with Connection Stru...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PLANAR WAFER LEVEL FAN-OUT OF MULTI-CHIP MODULES HAVING DIFFERENT S...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

FAN-OUT SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Packages and Method Forming Same

SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

PRINTING COMPLEX ELECTRONIC CIRCUITS

THREE-TERMINAL PRINTED DEVICES INTERCONNECTED AS CIRCUITS

SEMICONDUCTOR DEVICE