Stacked spaced PCBs Planar parts of folded flexible circuits having mounted components in between or spaced from each other

Industry

CPC
H05K2201/042

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/042Stacked spaced PCBs Planar parts of folded flexible circuits having mounted components in between or spaced from each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic control unit and method for assembling electronic contro...
- Patent number 11,956,900
- Issue date Apr 9, 2024
- Hitachi Astemo, Ltd.
- Tomohiro Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid state relay
- Patent number 11,949,407
- Issue date Apr 2, 2024
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Camera module, spacer component, and method for producing camera mo...
- Patent number 11,930,258
- Issue date Mar 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hirofumi Owaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling conduit for electrical components on a PCB
- Patent number 11,889,614
- Issue date Jan 30, 2024
- BorgWarner Inc.
- Lathom Alexander Louco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and electronic device including the same
- Patent number 11,889,626
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Kyungho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly and base station antenna
- Patent number 11,877,399
- Issue date Jan 16, 2024
- CommScope Technologies LLC
- Runmiao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for fixing camera module circuit board, and camera module
- Patent number 11,856,697
- Issue date Dec 26, 2023
- LG Innotek Co., Ltd
- Kwang Sung Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board assembly
- Patent number 11,825,604
- Issue date Nov 21, 2023
- Unimicron Technology Corporation
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including interposer
- Patent number 11,818,843
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Jungsik Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power electronics assembly
- Patent number RE49723
- Issue date Nov 7, 2023
- Turntide Technologies, Inc.
- Peter Barrass
Information Patent Grant
Overlapping printed circuit boards and electronic device including...
- Patent number 11,812,555
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Jinyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite printed wiring board and method of manufacturing the same
- Patent number 11,785,718
- Issue date Oct 10, 2023
- Mitsubishi Electric Corporation
- Takamichi Kono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly and terminal
- Patent number 11,778,744
- Issue date Oct 3, 2023
- VIVO MOBILE COMMUNICATION CO., LTD.
- Houxun Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Human-machine interface module structure
- Patent number 11,768,396
- Issue date Sep 26, 2023
- CHYNG HONG ELECTRONIC CO., LTD.
- Mu-Chun Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and electronic device including the same
- Patent number 11,770,898
- Issue date Sep 26, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,751,347
- Issue date Sep 5, 2023
- Kioxia Corporation
- Akitoshi Suzuki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compressible fluid micropump system and process
- Patent number 11,739,745
- Issue date Aug 29, 2023
- Drägerwerk AG & Co. KGaA
- Hans-Ullrich Hansmann
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Electronic device
- Patent number 11,711,909
- Issue date Jul 25, 2023
- Kioxia Corporation
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection plate, circuit board assembly, and electronic device
- Patent number 11,706,871
- Issue date Jul 18, 2023
- Huawei Technologies Co., Ltd.
- Hui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including structure for stacking substrates
- Patent number 11,696,404
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Manho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Network addressable lighting device architecture
- Patent number 11,690,154
- Issue date Jun 27, 2023
- POEWIT TECHNOLOGIES, INC.
- Victor Seung Bae Pak
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Module comprising antenna and RF element, and base station includin...
- Patent number 11,682,845
- Issue date Jun 20, 2023
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable lantern light with multiple operating modes
- Patent number 11,678,414
- Issue date Jun 13, 2023
- Promier Products Inc.
- Cody Duane Grandadam
- F21 - LIGHTING
Information Patent Grant
Power modules having an integrated clamp circuit and process thereof
- Patent number 11,652,478
- Issue date May 16, 2023
- Wolfspeed, Inc.
- Austin Curbow
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit board module and electronic device
- Patent number 11,653,448
- Issue date May 16, 2023
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Wen-Hu Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal solutions for multi-package assemblies and methods for fabr...
- Patent number 11,652,020
- Issue date May 16, 2023
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module assembly mounted on headlining of vehicle
- Patent number 11,612,058
- Issue date Mar 21, 2023
- Hyundai Mobis Co., Ltd.
- Myeong Nam Woo
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device with heat-radiant structure
- Patent number 11,604,256
- Issue date Mar 14, 2023
- Samsung Electronics Co., Ltd.
- Jaeyoung Huh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for fixing camera module circuit board, and camera module
- Patent number 11,602,052
- Issue date Mar 7, 2023
- LG Innotek Co., Ltd
- Kwang Sung Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Easy release board to board connector
- Patent number 11,596,069
- Issue date Feb 28, 2023
- Quanta Computer Inc.
- Chao-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DIODE MODULE AND SYSTEM INCLUDING THE SAME
- Publication number 20240136487
- Publication date Apr 25, 2024
- SEOUL SEMICONDUCTOR CO., LTD.
- Meen Woo KWAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240136739
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240138052
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD DEVICE AND METHOD FOR COMPACT ARRANGEMENT OF ELECTRONIC ASSEM...
- Publication number 20240138067
- Publication date Apr 25, 2024
- Vega Grieshaber KG
- Thomas ILG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING CONDUIT FOR ELECTRICAL COMPONENTS ON A PCB
- Publication number 20240121883
- Publication date Apr 11, 2024
- BorgWarner Inc.
- Lathom Alexander Louco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT SOURCE SUPPORT ASSEMBLY
- Publication number 20240107672
- Publication date Mar 28, 2024
- VALEO VISION
- Sebastian KRICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
- Publication number 20240106339
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- David Paul Buehler
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DRIVE AND CONTROL INTEGRATED BOARD, CONTROL SYSTEM, AND ROBOT
- Publication number 20240098875
- Publication date Mar 21, 2024
- QKM TECHNOLOGY (DONG GUAN) CO., LTD
- Jinbo SHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE
- Publication number 20240080983
- Publication date Mar 7, 2024
- LG Innotek Co., Ltd.
- Kwang Sung KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD
- Publication number 20240080982
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Juho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS AND IMAGE PICKUP APPARATUS
- Publication number 20240074030
- Publication date Feb 29, 2024
- Canon Kabushiki Kaisha
- Honkai TOMIMOTO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Circuit Board Assembly with Interposer Circuit Board and Correspond...
- Publication number 20240064898
- Publication date Feb 22, 2024
- Motorola Mobility LLC
- Wayne G Morrison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER ELECTRONIC SUBSTRATE
- Publication number 20240064900
- Publication date Feb 22, 2024
- SONY GROUP CORPORATION
- KANAHIRO SHIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE NEUROSTIMULATOR WITH RIVET CONNECTION
- Publication number 20240039190
- Publication date Feb 1, 2024
- AVATION MEDICAL, INC.
- Austin Morgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240023239
- Publication date Jan 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD (PCB) COOLING
- Publication number 20240015881
- Publication date Jan 11, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Yongduk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD AND CIRCUIT BOARD
- Publication number 20240008183
- Publication date Jan 4, 2024
- TDK Corporation
- Kiryu IKEBE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE
- Publication number 20240008167
- Publication date Jan 4, 2024
- HUAWEI TECHNOLOGIES CO., LTD.
- Lan LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20230413441
- Publication date Dec 21, 2023
- UNIMICRON TECHNOLOGY CORPORATION
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLING METHOD OF ELECTRONIC MODULE
- Publication number 20230413450
- Publication date Dec 21, 2023
- Delta Electronics, Inc.
- Kun Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION ELEMENT FOR ELECTRICALLY CONNECTING TWO CIRCUIT CARRIERS
- Publication number 20230380064
- Publication date Nov 23, 2023
- ROBERT BOSCH GmbH
- Joerg Offterdinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20230354536
- Publication date Nov 2, 2023
- KIOXIA Corporation
- Akitoshi SUZUKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BOARD UNIT
- Publication number 20230354555
- Publication date Nov 2, 2023
- AUTONETWORKS TECHNOLOGIES, LTD.
- Shun TAKAMIZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXING AUXILIARY DEVICE, FIXING DEVICE, AND ELECTRONIC EQUIPMENT
- Publication number 20230345636
- Publication date Oct 26, 2023
- Fulian Precision Electronics (Tianjin) Co., LTD.
- MING-HUA DUAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20230300985
- Publication date Sep 21, 2023
- Huawei Technologies Co., Ltd
- Jie SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIO FREQUENCY FRONT-END MODULE, MANUFACTURING METHOD THEREOF AND...
- Publication number 20230292438
- Publication date Sep 14, 2023
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun WENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230269868
- Publication date Aug 24, 2023
- Fuji Electric Co., Ltd.
- Tomomi NONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PACK
- Publication number 20230262897
- Publication date Aug 17, 2023
- BLACK & DECKER INC.
- Michael SIKORA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor Node Thermal Management and Illumination
- Publication number 20230243706
- Publication date Aug 3, 2023
- Dwellwell Analytics, Inc.
- Daniel Simpkins
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC CONTROL MODULE
- Publication number 20230247764
- Publication date Aug 3, 2023
- NISSAN MOTOR CO., LTD.
- Hironobu SUGIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Stacked spaced PCBs Planar parts of folded flexible circuits having mounted components in between or spaced from each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic control unit and method for assembling electronic contro...

Solid state relay

Camera module, spacer component, and method for producing camera mo...

Cooling conduit for electrical components on a PCB

Interposer and electronic device including the same

Printed circuit board assembly and base station antenna

Device for fixing camera module circuit board, and camera module

Circuit board assembly

Electronic device including interposer

Power electronics assembly

Overlapping printed circuit boards and electronic device including...

Composite printed wiring board and method of manufacturing the same

Printed circuit board assembly and terminal

Human-machine interface module structure

Substrate structure and electronic device including the same

Electronic apparatus

Compressible fluid micropump system and process

Electronic device

Connection plate, circuit board assembly, and electronic device

Electronic device including structure for stacking substrates

Network addressable lighting device architecture

Module comprising antenna and RF element, and base station includin...

Portable lantern light with multiple operating modes

Power modules having an integrated clamp circuit and process thereof

Circuit board module and electronic device

Thermal solutions for multi-package assemblies and methods for fabr...

Module assembly mounted on headlining of vehicle

Electronic device with heat-radiant structure

Device for fixing camera module circuit board, and camera module

Easy release board to board connector

Patents Applicationslast 30 patents

LIGHT EMITTING DIODE MODULE AND SYSTEM INCLUDING THE SAME

CIRCUIT MODULE

CIRCUIT MODULE

FIELD DEVICE AND METHOD FOR COMPACT ARRANGEMENT OF ELECTRONIC ASSEM...

COOLING CONDUIT FOR ELECTRICAL COMPONENTS ON A PCB

LIGHT SOURCE SUPPORT ASSEMBLY

SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE

DRIVE AND CONTROL INTEGRATED BOARD, CONTROL SYSTEM, AND ROBOT

DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE

ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD

ELECTRONIC APPARATUS AND IMAGE PICKUP APPARATUS

Circuit Board Assembly with Interposer Circuit Board and Correspond...

MULTILAYER ELECTRONIC SUBSTRATE

WEARABLE NEUROSTIMULATOR WITH RIVET CONNECTION

ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD (PCB) COOLING

MOUNTING BOARD AND CIRCUIT BOARD

HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE

CIRCUIT BOARD ASSEMBLY

ASSEMBLING METHOD OF ELECTRONIC MODULE

CONNECTION ELEMENT FOR ELECTRICALLY CONNECTING TWO CIRCUIT CARRIERS

ELECTRONIC APPARATUS

BOARD UNIT

FIXING AUXILIARY DEVICE, FIXING DEVICE, AND ELECTRONIC EQUIPMENT

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

RADIO FREQUENCY FRONT-END MODULE, MANUFACTURING METHOD THEREOF AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BATTERY PACK

Sensor Node Thermal Management and Illumination

ELECTRONIC CONTROL MODULE