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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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last 30 patents
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Patent Grant
Doped selective metal caps to improve copper electromigration with...
Patent number
11,990,368
Issue date
May 21, 2024
Applied Materials, Inc.
Mehul B. Naik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit devices and methods of manufacturing the same
Patent number
11,929,393
Issue date
Mar 12, 2024
Samsung Electronics Co., Ltd.
Jungoo Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit devices and methods of manufacturing the same
Patent number
11,569,344
Issue date
Jan 31, 2023
Samsung Electronics Co., Ltd.
Jungoo Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Doped selective metal caps to improve copper electromigration with...
Patent number
11,373,903
Issue date
Jun 28, 2022
Applied Materials, Inc.
Mehul B. Naik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing wafer level low melting temperature interco...
Patent number
11,222,813
Issue date
Jan 11, 2022
Raytheon Company
Sean P. Kilcoyne
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Optoelectronic component and method for producing an optoelectronic...
Patent number
11,114,525
Issue date
Sep 7, 2021
OSRAM OLED GmbH
Guido Weiss
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Seed layers for copper interconnects
Patent number
10,847,463
Issue date
Nov 24, 2020
Applied Materials, Inc.
Zhiyuan Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing a semiconductor device
Patent number
10,741,443
Issue date
Aug 11, 2020
Kioxia Corporation
Masayuki Kitamura
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing wafer level low melting temperature interco...
Patent number
10,504,777
Issue date
Dec 10, 2019
Raytheon Company
Sean P. Kilcoyne
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Low temperature molybdenum film deposition utilizing boron nucleati...
Patent number
10,453,744
Issue date
Oct 22, 2019
Entegris, Inc.
Shuang Meng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structures
Patent number
10,396,032
Issue date
Aug 27, 2019
Semiconductor Manufacturing International (Shanghai) Corporation
Chenglong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and fabrication method thereof
Patent number
10,373,911
Issue date
Aug 6, 2019
Semiconductor Manufacturing International (Shanghai) Corporation
Hai Yang Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a semiconductor device
Patent number
10,325,805
Issue date
Jun 18, 2019
Kabushiki Kaisha Toshiba
Masayuki Kitamura
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Plating method, plated component, and plating system
Patent number
10,179,950
Issue date
Jan 15, 2019
Tokyo Electron Limited
Yuichiro Inatomi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Metallic interconnects products
Patent number
10,096,547
Issue date
Oct 9, 2018
Uri Cohen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing interconnects in semiconductor devices
Patent number
10,062,607
Issue date
Aug 28, 2018
Applied Materials, Inc.
Ismail T. Emesh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
Patent number
10,047,430
Issue date
Aug 14, 2018
Applied Materials, Inc.
Peijun Ding
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Barrier structure for copper interconnect
Patent number
9,984,975
Issue date
May 29, 2018
Taiwan Semiconductor Manufacturing Company
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to deposit CVD ruthenium
Patent number
9,938,622
Issue date
Apr 10, 2018
Applied Materials, Inc.
Tae Hong Ha
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for electrochemically depositing metal on a reactive metal film
Patent number
9,840,788
Issue date
Dec 12, 2017
Applied Materials, Inc.
Roey Shaviv
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Patent Grant
Method for electrochemically depositing metal on a reactive metal film
Patent number
9,828,687
Issue date
Nov 28, 2017
Applied Materials, Inc.
Roey Shaviv
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Semiconductor structures and fabrication method thereof
Patent number
9,793,209
Issue date
Oct 17, 2017
Semiconductor Manufacturing International (Shanghai) Corporation
Chenglong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon film forming method, thin film forming method and cross-sec...
Patent number
9,758,865
Issue date
Sep 12, 2017
Tokyo Electron Limited
Kazuhide Hasebe
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor devices and methods of manufacturing the same
Patent number
9,754,826
Issue date
Sep 5, 2017
Samsung Electronics Co., Ltd.
Jong-Won Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal oxysilicate diffusion barriers for damascene metallization wi...
Patent number
9,728,502
Issue date
Aug 8, 2017
Samsung Electronics Co., Ltd.
Ganesh Hegde
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Seed layer deposition in microscale features
Patent number
9,714,474
Issue date
Jul 25, 2017
Tel Nexx, Inc.
Arthur Keigler
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Seed layers for metallic interconnects
Patent number
9,673,090
Issue date
Jun 6, 2017
Uri Cohen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming three-dimensional interconnection, circuit arran...
Patent number
9,543,201
Issue date
Jan 10, 2017
JSR Corporation
Kenzou Ookita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing interconnects in semiconductor devices
Patent number
9,425,092
Issue date
Aug 23, 2016
Applied Materials, Inc.
Ismail T. Emesh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and structure to improve the conductivity of narrow copper f...
Patent number
9,392,690
Issue date
Jul 12, 2016
GLOBALFOUNDRIES Inc.
Fenton R. McFeely
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME
Publication number
20240186369
Publication date
Jun 6, 2024
Samsung Electronics Co., Ltd.
Jungoo Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME
Publication number
20230163164
Publication date
May 25, 2023
Samsung Electronics Co., Ltd.
Jungoo Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...
Publication number
20220336271
Publication date
Oct 20, 2022
Applied Materials, Inc.
Mehul B. NAIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...
Publication number
20200075396
Publication date
Mar 5, 2020
Raytheon Company
Sean P. Kilcoyne
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
Publication number
20190259659
Publication date
Aug 22, 2019
Kabushiki Kaisha Toshiba
Masayuki KITAMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...
Publication number
20190252244
Publication date
Aug 15, 2019
Raytheon Company
Sean P. Kilcoyne
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
Publication number
20180327893
Publication date
Nov 15, 2018
Applied Materials, Inc.
Peijun Ding
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
Publication number
20180294231
Publication date
Oct 11, 2018
Semiconductor Manufacturing International (Shanghai) Corporation
Hai Yang ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES
Publication number
20180012842
Publication date
Jan 11, 2018
Semiconductor Manufacturing International (Shanghai) Corporation
CHENGLONG ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
Publication number
20170316973
Publication date
Nov 2, 2017
Kabushiki Kaisha Toshiba
Masayuki KITAMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-THIN COPPER SEED LAYER FOR ELECTROPLATING INTO SMALL FEATURES
Publication number
20140374907
Publication date
Dec 25, 2014
Jick M. YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cu/CuMn BARRIER LAYER AND FABRICATING METHOD THEREOF
Publication number
20140332961
Publication date
Nov 13, 2014
NATIONAL CHENG KUNG UNIVERSITY
Wen-His Lee
B32 - LAYERED PRODUCTS
Information
Patent Application
COPPER INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20140327141
Publication date
Nov 6, 2014
Chen-Hua YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
Publication number
20140305802
Publication date
Oct 16, 2014
Applied Materials, Inc.
Peijun Ding
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHODS FOR PRODUCING INTERCONNECTS IN SEMICONDUCTOR DEVICES
Publication number
20140287577
Publication date
Sep 25, 2014
Ismail T. Emesh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method to Increase Interconnect Reliability
Publication number
20140264871
Publication date
Sep 18, 2014
Intermolecular, Inc.
Mankoo Lee
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method and Structure to Improve the Conductivity of Narrow Copper F...
Publication number
20140151097
Publication date
Jun 5, 2014
International Business Machines Corporation
Fenton R. McFeely
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER SEED LAYER FOR AN INTERCONNECT STRUCTURE HAVING A DOPING CON...
Publication number
20140138832
Publication date
May 22, 2014
International Business Machines Corporation
Chengyu Niu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHOD TO DEPOSIT CVD RUTHENIUM
Publication number
20140134351
Publication date
May 15, 2014
Applied Materials, Inc.
Tae Hong Ha
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
ELECTROCHEMICAL DEPOSITION ON A WORKPIECE HAVING HIGH SHEET RESISTANCE
Publication number
20140103534
Publication date
Apr 17, 2014
Applied Materials, Inc.
Ismail T. Emesh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING LOW RESISTIVITY TaNx/Ta DIFFUSION BARRIERS FOR BA...
Publication number
20140061918
Publication date
Mar 6, 2014
Christopher Jezewski
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Electroplated Metallic Interconnects And Products
Publication number
20140061919
Publication date
Mar 6, 2014
Uri Cohen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE
Publication number
20140024212
Publication date
Jan 23, 2014
GLOBALFOUNDRIES INC.
Vivian W. Ryan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SYSTEMS, METHODS AND MATERIALS INCLUDING CRYSTALLIZATION OF SUBSTRA...
Publication number
20140021477
Publication date
Jan 23, 2014
Venkatraman Prabhakar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-THIN COPPER SEED LAYER FOR ELECTROPLATING INTO SMALL FEATURES
Publication number
20130341794
Publication date
Dec 26, 2013
Applied Materials, Inc.
Jick M. YU
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Patent Application
COPPER INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20130270702
Publication date
Oct 17, 2013
TAIWAN SEMICONDUCTOR MANUFACTURING COMPAY, LTD.
Chen-Hua YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Incorporating High-Purity Copper Deposit As Smoothing Step After Di...
Publication number
20130213816
Publication date
Aug 22, 2013
TEL NEXX, Inc.
Johannes S. Chiu
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
Publication number
20130217226
Publication date
Aug 22, 2013
Masayuki Kitamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURE EMPLOYING A Mn-GROUP VIIIB ALLOY LINER
Publication number
20130178058
Publication date
Jul 11, 2013
Toshiba America Electronic Components, Inc
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
Publication number
20130134494
Publication date
May 30, 2013
Samsung Electronics Co., Ltd.
Jong-Won HONG
H01 - BASIC ELECTRIC ELEMENTS