Membership
Tour
Register
Log in
Stereolithography
Follow
Industry
CPC
H01L2224/03554
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/03554
Stereolithography
Industries
Overview
Organizations
People
Information
Impact
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD
Publication number
20120178189
Publication date
Jul 12, 2012
Douglas M. Reber
H01 - BASIC ELECTRIC ELEMENTS