Stereolithography

Industry

CPC
H01L2224/11554

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11554Stereolithography

Industries

Patents Grantslast 30 patents

Information Patent Grant
Conductive bump, method for producing the same, and electronic comp...
- Patent number 8,575,751
- Issue date Nov 5, 2013
- Panasonic Corporation
- Daisuke Sakurai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 8,178,972
- Issue date May 15, 2012
- Mitsubishi Denki Kabushiki Kaisha
- Naoki Yutani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic component mounting structure and method for manufacturin...
- Patent number 8,120,188
- Issue date Feb 21, 2012
- Panasonic Corporation
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,880,763
- Issue date Feb 1, 2011
- Mitsubishi Denki Kabushiki Kaisha
- Naoki Yutani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reinforced, self-aligning conductive structures for semiconductor d...
- Patent number 7,557,452
- Issue date Jul 7, 2009
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Repairable three-dimensional semiconductor subsystem
- Patent number 7,427,809
- Issue date Sep 23, 2008
- Salmon Technologies, LLC
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support ring for use with a contact pad and semiconductor device co...
- Patent number 7,170,171
- Issue date Jan 30, 2007
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures for stabilizing semiconductor devices relative to test s...
- Patent number 7,138,653
- Issue date Nov 21, 2006
- Micron Technology, Inc.
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Grant
Methods for providing support for conductive structures protruding...
- Patent number 7,109,106
- Issue date Sep 19, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming semiconductor devices so as to stabilize the sa...
- Patent number 7,041,513
- Issue date May 9, 2006
- Micron Technology, Inc.
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Grant
Ring positionable about a periphery of a contact pad, semiconductor...
- Patent number 6,902,995
- Issue date Jun 7, 2005
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support ring for use with a contact pad and semiconductor device co...
- Patent number 6,882,049
- Issue date Apr 19, 2005
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ring positionable about a periphery of a contact pad, semiconductor...
- Patent number 6,548,897
- Issue date Apr 15, 2003
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ring positionable about a periphery of a contact pad, semiconductor...
- Patent number 6,506,671
- Issue date Jan 14, 2003
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURE OF ELECTRONIC CHIPS
- Publication number 20220375840
- Publication date Nov 24, 2022
- STMicroelectronics (Tours) SAS
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20110057311
- Publication date Mar 10, 2011
- Mitsubishi Denki Kabushiki Kaisha
- Naoki YUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURIN...
- Publication number 20100052189
- Publication date Mar 4, 2010
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BUMP, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMP...
- Publication number 20090315178
- Publication date Dec 24, 2009
- Daisuke Sakurai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPON...
- Publication number 20090301771
- Publication date Dec 10, 2009
- Shozo Ochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20090004761
- Publication date Jan 1, 2009
- Mitsubishi Denki Kabushiki Kaisha
- Naoki YUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for fabricating reinforced, self-aligning conductive struct...
- Publication number 20070148817
- Publication date Jun 28, 2007
- Vernon M. Williams
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical connection methods employing corresponding, insulator-co...
- Publication number 20070148818
- Publication date Jun 28, 2007
- Vernon M. Williams
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods for fabricating semiconductor devices so as to stabilize th...
- Publication number 20060189005
- Publication date Aug 24, 2006
- Salman Akram
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20060131745
- Publication date Jun 22, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Naoki Yutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Repairable three-dimensional semiconductor subsystem
- Publication number 20060131728
- Publication date Jun 22, 2006
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for fabricating electronic components to include supports f...
- Publication number 20050227411
- Publication date Oct 13, 2005
- Ford B. Grigg
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Support ring for use with a contact pad and semiconductor device co...
- Publication number 20050156314
- Publication date Jul 21, 2005
- Ford B. Grigg
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods for providing support for conductive structures protruding...
- Publication number 20030176016
- Publication date Sep 18, 2003
- Ford B. Grigg
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Support ring for use with a contact pad and semiconductor device co...
- Publication number 20030173665
- Publication date Sep 18, 2003
- Ford B. Grigg
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods for forming semiconductor devices so as to stabilize the sa...
- Publication number 20030170921
- Publication date Sep 11, 2003
- Salman Akram
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Ring positionable about a periphery of a contact pad, semiconductor...
- Publication number 20030139030
- Publication date Jul 24, 2003
- Ford B. Grigg
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Ring positionable about a periphery of a contact pad, semiconductor...
- Publication number 20020024136
- Publication date Feb 28, 2002
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS

Stereolithography

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive bump, method for producing the same, and electronic comp...

Semiconductor device and manufacturing method therefor

Electronic component mounting structure and method for manufacturin...

Semiconductor device and manufacturing method therefor

Reinforced, self-aligning conductive structures for semiconductor d...

Repairable three-dimensional semiconductor subsystem

Support ring for use with a contact pad and semiconductor device co...

Structures for stabilizing semiconductor devices relative to test s...

Methods for providing support for conductive structures protruding...

Methods for forming semiconductor devices so as to stabilize the sa...

Ring positionable about a periphery of a contact pad, semiconductor...

Support ring for use with a contact pad and semiconductor device co...

Ring positionable about a periphery of a contact pad, semiconductor...

Ring positionable about a periphery of a contact pad, semiconductor...

Patents Applicationslast 30 patents

MANUFACTURE OF ELECTRONIC CHIPS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURIN...

CONDUCTIVE BUMP, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMP...

CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPON...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Methods for fabricating reinforced, self-aligning conductive struct...

Electrical connection methods employing corresponding, insulator-co...

Methods for fabricating semiconductor devices so as to stabilize th...

Semiconductor device and manufacturing method therefor

Repairable three-dimensional semiconductor subsystem

Methods for fabricating electronic components to include supports f...

Support ring for use with a contact pad and semiconductor device co...

Methods for providing support for conductive structures protruding...

Support ring for use with a contact pad and semiconductor device co...

Methods for forming semiconductor devices so as to stabilize the sa...

Ring positionable about a periphery of a contact pad, semiconductor...

Ring positionable about a periphery of a contact pad, semiconductor...