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H01L2224/75601

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75601Storing means

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Patents Grantslast 30 patents

Information Patent Grant
Ball jumping apparatus and ball absorption
- Patent number 11,511,363
- Issue date Nov 29, 2022
- Samsung Electronics Co., Ltd.
- Sangkeun Ahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for manufacturing plurality of electronic circ...
- Patent number 10,811,383
- Issue date Oct 20, 2020
- Pragmatic Printing Ltd.
- Neil Davies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
- Patent number 9,741,595
- Issue date Aug 22, 2017
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BALL BOX AND SOLDER BALL ATTACHMENT APPARATUS HAVING THE SAME
- Publication number 20170129032
- Publication date May 11, 2017
- Samsung Electronics Co., Ltd.
- Young-bok KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and Method for Placing and Mounting Solder Balls on an In...
- Publication number 20150228613
- Publication date Aug 13, 2015
- Zen Voce Corporation
- Tu-Chen Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR