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H01L2224/78601
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/78601
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Patents Grants
last 30 patents
Information
Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
Patent number
10,283,482
Issue date
May 7, 2019
Lockheed Martin Corporation
Randall Mark Stoltenberg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire spool system for a wire bonding apparatus
Patent number
9,461,013
Issue date
Oct 4, 2016
ASM Technology Singapore Pte. Ltd.
Chi Wah Cheng
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Spool case for bonding wire, and method of handling spool using same
Patent number
6,866,148
Issue date
Mar 15, 2005
W. C. Heraeus GmbH & Co. KG
Chang Man You
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Patents Applications
last 30 patents
Information
Patent Application
WIRE SPOOL SYSTEM FOR A WIRE BONDING APPARATUS
Publication number
20160148898
Publication date
May 26, 2016
Chi Wah CHENG
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Application
WIRE BONDING APPARATUS
Publication number
20140332583
Publication date
Nov 13, 2014
SHINKAWA LTD.
Toru Maeda
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF DETECTING WIRE BONDING FAILURES
Publication number
20140131425
Publication date
May 15, 2014
ASM Technology Singapore Pte Ltd
Wei LIU
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Spool case for bonding wire, and method of handling spool using same
Publication number
20030080011
Publication date
May 1, 2003
W.C. Heraeus GmbH & Co.KG
Chang Man You
H01 - BASIC ELECTRIC ELEMENTS