Structural arrangements for testing

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CPC
H01L2225/06596

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06596Structural arrangements for testing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked DRAM device and method of manufacture
- Patent number 12,170,126
- Issue date Dec 17, 2024
- RAMBUS INC.
- Thomas Vogelsang
- G11 - INFORMATION STORAGE
Information Patent Grant
Scan testable through silicon VIAs
- Patent number 12,154,835
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,119,329
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through via extending through redistribution...
- Patent number 12,068,212
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and system with integrated self-test functiona...
- Patent number 12,032,016
- Issue date Jul 9, 2024
- Volkswagen Aktiengesellschaft
- Andreas Aal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member and display device including the same
- Patent number 12,015,007
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Hong Am Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer device structure and methods for making the same
- Patent number 11,961,826
- Issue date Apr 16, 2024
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interwafer connection structure for coupling wafers in a wafer stack
- Patent number 11,901,338
- Issue date Feb 13, 2024
- Xilinx, Inc.
- Myongseob Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked DRAM device and method of manufacture
- Patent number 11,894,093
- Issue date Feb 6, 2024
- RAMBUS INC.
- Thomas Vogelsang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and test method of semiconductor device
- Patent number 11,892,503
- Issue date Feb 6, 2024
- Toshiba Tec Kabushiki Kaisha
- Takuya Kusaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and preheating method thereof
- Patent number 11,862,223
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shuliang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,791,243
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,769,755
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with molding layer
- Patent number 11,756,931
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure for testing through silicon vias in three-dimensi...
- Patent number 11,749,648
- Issue date Sep 5, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test circuit for detecting parasitic capacitance of TSV
- Patent number 11,742,250
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Harutaka Makabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 11,735,567
- Issue date Aug 22, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including memory chip and peripheral memory chip and...
- Patent number 11,721,655
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Jooyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 11,710,691
- Issue date Jul 25, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package structure
- Patent number 11,699,694
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect retimer enhancements
- Patent number 11,675,003
- Issue date Jun 13, 2023
- Intel Corporation
- Daniel S. Froelich
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Secure integrated-circuit systems
- Patent number 11,670,602
- Issue date Jun 6, 2023
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for controlling operation using temperature devia...
- Patent number 11,640,955
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Min-Sang Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Anisotropic conductive film (ACF) for use in testing semiconductor...
- Patent number 11,637,045
- Issue date Apr 25, 2023
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer device structure and methods for making the same
- Patent number 11,621,248
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical overlay measurement methods and structures for wafer-to-...
- Patent number 11,621,202
- Issue date Apr 4, 2023
- Western Digital Technologies, Inc.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363464
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240304602
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Tomoya SANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290669
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Sunkyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PAD
- Publication number 20240272224
- Publication date Aug 15, 2024
- SK HYNIX INC.
- Hee Sun LEE
- G01 - MEASURING TESTING
Information Patent Application
STACKED DRAM DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240242741
- Publication date Jul 18, 2024
- Rambus Inc.
- Thomas Vogelsang
- G11 - INFORMATION STORAGE
Information Patent Application
BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME
- Publication number 20240222332
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, BASE-SIDE SEMICONDUCTOR CHIP, AND BONDING-SID...
- Publication number 20240113035
- Publication date Apr 4, 2024
- LAPIS Technology Co., Ltd.
- JUNICHI IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE HYBRID BONDED INTERCONNECT SYSTEMS
- Publication number 20240038702
- Publication date Feb 1, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240030074
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20240014178
- Publication date Jan 11, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230387083
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- EUNKYUL OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20230369170
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufaturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING MEMORY CHIP AND PERIPHERAL MEMORY CHIP AND...
- Publication number 20230317655
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Jooyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR DEVICE AND METHOD OF TESTING THE STACK TYP...
- Publication number 20230307420
- Publication date Sep 28, 2023
- SK HYNIX INC.
- Seong Hwi SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST ARCHITECTURE FOR 3D STACKED CIRCUITS
- Publication number 20230299050
- Publication date Sep 21, 2023
- QUALCOMM Incorporated
- Kunal Jain MANGILAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRECTION DIE FOR WAFER/DIE STACK
- Publication number 20230268320
- Publication date Aug 24, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME
- Publication number 20230223380
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME
- Publication number 20230176108
- Publication date Jun 8, 2023
- Samsung Electronics Co.,Ltd.
- SEUNGHYUN CHO
- G01 - MEASURING TESTING
Information Patent Application
BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230163102
- Publication date May 25, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERWAFER CONNECTION STRUCTURE FOR COUPLING WAFERS IN A WAFER STACK
- Publication number 20230140675
- Publication date May 4, 2023
- Xilinx, Inc.
- Myongseob KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuit Device
- Publication number 20230116320
- Publication date Apr 13, 2023
- Graphcore Limited
- Stephen FELIX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIR AND PERFORMANCE CHIPLET
- Publication number 20230100375
- Publication date Mar 30, 2023
- Intel Corporation
- Gerald PASDAST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230100980
- Publication date Mar 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hong Am KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE WITH ACTIVE INTERPOSER
- Publication number 20230100032
- Publication date Mar 30, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230080259
- Publication date Mar 16, 2023
- KIOXIA Corporation
- Tomoya SANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH STEPPED SIDEWALL, SEMICONDUCTOR PACKAGE INC...
- Publication number 20230076238
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Junhyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA (TSV) TEST DEVIC...
- Publication number 20230070785
- Publication date Mar 9, 2023
- Industry-Academic Cooperation Foundation, Yonsei University
- YOUNGKWANG LEE
- H01 - BASIC ELECTRIC ELEMENTS

Structural arrangements for testing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly with pillar array

Semiconductor package and method of fabricating the same

Stacked DRAM device and method of manufacture

Scan testable through silicon VIAs

Semiconductor package including test bumps

Through-substrate via structure and method of manufacture

Semiconductor package and method of fabricating the same

Package structure with through via extending through redistribution...

Electronic component and system with integrated self-test functiona...

Adhesive member and display device including the same

Bonded wafer device structure and methods for making the same

Interwafer connection structure for coupling wafers in a wafer stack

Stacked DRAM device and method of manufacture

Semiconductor device and test method of semiconductor device

Semiconductor structure and preheating method thereof

Semiconductor device and method of manufacture

Semiconductor package and method of fabricating the same

Chip package structure with molding layer

Circuit structure for testing through silicon vias in three-dimensi...

Test circuit for detecting parasitic capacitance of TSV

Wafer reconstitution and die-stitching

Memory device including memory chip and peripheral memory chip and...

Semiconductor device and method of forming micro interconnect struc...

Method of manufacturing semiconductor package structure

Interconnect retimer enhancements

Secure integrated-circuit systems

Method and device for controlling operation using temperature devia...

Anisotropic conductive film (ACF) for use in testing semiconductor...

Bonded wafer device structure and methods for making the same

Electrical overlay measurement methods and structures for wafer-to-...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR MEMORY DEVICE

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING BONDING PAD

STACKED DRAM DEVICE AND METHOD OF MANUFACTURE

BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME

SEMICONDUCTOR DEVICE, BASE-SIDE SEMICONDUCTOR CHIP, AND BONDING-SID...

HIGH-PERFORMANCE HYBRID BONDED INTERCONNECT SYSTEMS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WAFER RECONSTITUTION AND DIE-STITCHING

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor Device and Method of Manufacture

MEMORY DEVICE INCLUDING MEMORY CHIP AND PERIPHERAL MEMORY CHIP AND...

STACK TYPE SEMICONDUCTOR DEVICE AND METHOD OF TESTING THE STACK TYP...

TEST ARCHITECTURE FOR 3D STACKED CIRCUITS

CORRECTION DIE FOR WAFER/DIE STACK

BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME

BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR

INTERWAFER CONNECTION STRUCTURE FOR COUPLING WAFERS IN A WAFER STACK

Stacked Integrated Circuit Device

REPAIR AND PERFORMANCE CHIPLET

ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME

BONDED STRUCTURE WITH ACTIVE INTERPOSER

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR CHIP WITH STEPPED SIDEWALL, SEMICONDUCTOR PACKAGE INC...

SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA (TSV) TEST DEVIC...