Structural arrangements for testing

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H01L2225/06596

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06596Structural arrangements for testing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,261
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor device and method of testing the stack typ...
- Patent number 12,362,324
- Issue date Jul 15, 2025
- SK hynix Inc.
- Seong Hwi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including memory chip and peripheral memory chip and...
- Patent number 12,354,985
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Jooyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,315,844
- Issue date May 27, 2025
- Kioxia Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Correction die for wafer/die stack
- Patent number 12,237,306
- Issue date Feb 25, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for detecting placement of wafers in wafer cassette
- Patent number 12,217,988
- Issue date Feb 4, 2025
- Hon Hai Precision Industry Co., Ltd.
- Yu-Ting Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming chip package structure with molding layer
- Patent number 12,218,104
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a defect detector and data storage sys...
- Patent number 12,211,758
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Kyounghoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked DRAM device and method of manufacture
- Patent number 12,170,126
- Issue date Dec 17, 2024
- RAMBUS INC.
- Thomas Vogelsang
- G11 - INFORMATION STORAGE
Information Patent Grant
Scan testable through silicon VIAs
- Patent number 12,154,835
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,119,329
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through via extending through redistribution...
- Patent number 12,068,212
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and system with integrated self-test functiona...
- Patent number 12,032,016
- Issue date Jul 9, 2024
- Volkswagen Aktiengesellschaft
- Andreas Aal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member and display device including the same
- Patent number 12,015,007
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Hong Am Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer device structure and methods for making the same
- Patent number 11,961,826
- Issue date Apr 16, 2024
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interwafer connection structure for coupling wafers in a wafer stack
- Patent number 11,901,338
- Issue date Feb 13, 2024
- Xilinx, Inc.
- Myongseob Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked DRAM device and method of manufacture
- Patent number 11,894,093
- Issue date Feb 6, 2024
- RAMBUS INC.
- Thomas Vogelsang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and test method of semiconductor device
- Patent number 11,892,503
- Issue date Feb 6, 2024
- Toshiba Tec Kabushiki Kaisha
- Takuya Kusaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and preheating method thereof
- Patent number 11,862,223
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shuliang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,791,243
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,769,755
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with molding layer
- Patent number 11,756,931
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure for testing through silicon vias in three-dimensi...
- Patent number 11,749,648
- Issue date Sep 5, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED DRAM DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250210068
- Publication date Jun 26, 2025
- Rambus Inc.
- Thomas Vogelsang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SYSTEM TEST RING
- Publication number 20250174500
- Publication date May 29, 2025
- MEDIATEK INC.
- Cing-Yao Jhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174572
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hyun Ung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20250157991
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRECTION DIE FOR WAFER/DIE STACK
- Publication number 20250157992
- Publication date May 15, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING A PLURALITY OF DIES
- Publication number 20250159911
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- YOSEOP LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING CELL OVER PERIPHERY STRUCTURE AND SEMICONDUCTO...
- Publication number 20250140332
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Changyoung Lee
- G11 - INFORMATION STORAGE
Information Patent Application
CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES
- Publication number 20250140757
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250105182
- Publication date Mar 27, 2025
- SAMSUNG ELECTRONICS CO,. LTD.
- JAEYONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR TESTING INTERFACIAL ADHESION BETWEEN MOLD COMPOUND AN...
- Publication number 20250096046
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCAN TESTABLE THROUGH SILICON VIAS
- Publication number 20250087539
- Publication date Mar 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURITY CHIP FOR ENSURING THE PHYSICAL INTEGRITY OF AN INTEGRATED...
- Publication number 20250079344
- Publication date Mar 6, 2025
- NVIDIA Corporation
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054891
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029879
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Dongkuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363464
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240304602
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Tomoya SANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290669
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Sunkyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PAD
- Publication number 20240272224
- Publication date Aug 15, 2024
- SK HYNIX INC.
- Hee Sun LEE
- G01 - MEASURING TESTING
Information Patent Application
STACKED DRAM DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240242741
- Publication date Jul 18, 2024
- Rambus Inc.
- Thomas Vogelsang
- G11 - INFORMATION STORAGE
Information Patent Application
BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME
- Publication number 20240222332
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, BASE-SIDE SEMICONDUCTOR CHIP, AND BONDING-SID...
- Publication number 20240113035
- Publication date Apr 4, 2024
- LAPIS Technology Co., Ltd.
- JUNICHI IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE HYBRID BONDED INTERCONNECT SYSTEMS
- Publication number 20240038702
- Publication date Feb 1, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240030074
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20240014178
- Publication date Jan 11, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230387083
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- EUNKYUL OH
- H01 - BASIC ELECTRIC ELEMENTS

Structural arrangements for testing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacture

Stack type semiconductor device and method of testing the stack typ...

Memory device including memory chip and peripheral memory chip and...

Wafer reconstitution and die-stitching

Method of manufacturing die stack structure

Semiconductor memory device

Correction die for wafer/die stack

Semiconductor device and method of forming micro interconnect struc...

Method and device for detecting placement of wafers in wafer cassette

Method for forming chip package structure with molding layer

Semiconductor devices having a defect detector and data storage sys...

Semiconductor device assembly with pillar array

Semiconductor package and method of fabricating the same

Stacked DRAM device and method of manufacture

Scan testable through silicon VIAs

Semiconductor package including test bumps

Through-substrate via structure and method of manufacture

Semiconductor package and method of fabricating the same

Package structure with through via extending through redistribution...

Electronic component and system with integrated self-test functiona...

Adhesive member and display device including the same

Bonded wafer device structure and methods for making the same

Interwafer connection structure for coupling wafers in a wafer stack

Stacked DRAM device and method of manufacture

Semiconductor device and test method of semiconductor device

Semiconductor structure and preheating method thereof

Semiconductor device and method of manufacture

Semiconductor package and method of fabricating the same

Chip package structure with molding layer

Circuit structure for testing through silicon vias in three-dimensi...

Patents Applicationslast 30 patents

STACKED DRAM DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE WITH SYSTEM TEST RING

SEMICONDUCTOR PACKAGE

WAFER RECONSTITUTION AND DIE-STITCHING

CORRECTION DIE FOR WAFER/DIE STACK

MEMORY DEVICE INCLUDING A PLURALITY OF DIES

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

MEMORY DEVICE HAVING CELL OVER PERIPHERY STRUCTURE AND SEMICONDUCTO...

CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

STRUCTURE FOR TESTING INTERFACIAL ADHESION BETWEEN MOLD COMPOUND AN...

SCAN TESTABLE THROUGH SILICON VIAS

SECURITY CHIP FOR ENSURING THE PHYSICAL INTEGRITY OF AN INTEGRATED...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR MEMORY DEVICE

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING BONDING PAD

STACKED DRAM DEVICE AND METHOD OF MANUFACTURE

BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME

SEMICONDUCTOR DEVICE, BASE-SIDE SEMICONDUCTOR CHIP, AND BONDING-SID...

HIGH-PERFORMANCE HYBRID BONDED INTERCONNECT SYSTEMS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WAFER RECONSTITUTION AND DIE-STITCHING

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME