Structural details of individual signal conductors

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CPC
H05K1/0242

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0242Structural details of individual signal conductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bend compensation for conductive traces on printed circuit boards
- Patent number 12,150,240
- Issue date Nov 19, 2024
- Amphenol Corporation
- Michael Rowlands
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission device for suppressing glass fiber effect
- Patent number 12,133,323
- Issue date Oct 29, 2024
- Unimicron Technology Corp.
- Chin-Hsun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing thereof
- Patent number 12,120,812
- Issue date Oct 15, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Hao-Yi Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line substrate and electronic device
- Patent number 12,046,792
- Issue date Jul 23, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 12,028,967
- Issue date Jul 2, 2024
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission line and electronic device
- Patent number 11,984,637
- Issue date May 14, 2024
- Murata Manufacturing Co., Ltd.
- Yushi Soeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for mounting a transmission line substrate having interla...
- Patent number 11,949,144
- Issue date Apr 2, 2024
- Murata Manufacturing Co., Ltd.
- Takahiro Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 11,950,361
- Issue date Apr 2, 2024
- VEEA INC.
- Shaun Joseph Greaney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board having conductive layer for shielding electronic component an...
- Patent number 11,943,862
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Bongchoon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit signal enhancement method of circuit board and structure th...
- Patent number 11,937,366
- Issue date Mar 19, 2024
- Unimicron Technology Corp.
- Tzu Hsuan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency circuit
- Patent number 11,812,546
- Issue date Nov 7, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-galvanic interconnect for planar RF devices
- Patent number 11,791,535
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Mikhail Nikolaevich Makurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 11,792,925
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Kyohei Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating graphene into the skin depth region of high speed commu...
- Patent number 11,751,322
- Issue date Sep 5, 2023
- Cisco Technology, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 11,696,391
- Issue date Jul 4, 2023
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bend compensation for conductive traces on printed circuit boards
- Patent number 11,665,814
- Issue date May 30, 2023
- Amphenol Corporation
- Michael Rowlands
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing personalized chipless radiofrequency ident...
- Patent number 11,645,490
- Issue date May 9, 2023
- MGI Digital Technology
- Edmond Abergel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Surface-treated copper foil, manufacturing method thereof, copper f...
- Patent number 11,622,445
- Issue date Apr 4, 2023
- Iljin Materials Co., Ltd.
- Sang Hwa Yoon
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board for transmitting signal in high-frequency ban...
- Patent number 11,617,257
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and electrical element
- Patent number 11,605,869
- Issue date Mar 14, 2023
- Murata Manufacturing Co., Ltd.
- Takahiro Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing printed circuit boards with routing conductors...
- Patent number 11,596,054
- Issue date Feb 28, 2023
- International Business Machines Corporation
- Yanyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and system of a printed circuit board (PCB) including a r...
- Patent number 11,596,055
- Issue date Feb 28, 2023
- Intel Corporation
- Ofer Markish
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board
- Patent number 11,582,860
- Issue date Feb 14, 2023
- JSR Corporation
- Isao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal transmission circuit and printed circuit board
- Patent number 11,540,383
- Issue date Dec 27, 2022
- Hitachi, Ltd.
- Takayuki Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,528,801
- Issue date Dec 13, 2022
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 11,523,502
- Issue date Dec 6, 2022
- VEEA INC.
- Shaun Joseph Greaney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,516,906
- Issue date Nov 29, 2022
- JSR Corporation
- Isao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass wiring board
- Patent number 11,516,907
- Issue date Nov 29, 2022
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Flexible resonant trap circuit
- Patent number 11,500,048
- Issue date Nov 15, 2022
- Inkspace Imaging, Inc.
- Joseph Russell Corea
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240365465
- Publication date Oct 31, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...
- Publication number 20240324106
- Publication date Sep 26, 2024
- Advanced Printed Electronic Solutions LLC
- Richard Neill
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
PACKAGE COMPONENT
- Publication number 20240215150
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION DEVICE FOR SUPPRESSING GLASS FIBER EFFECT
- Publication number 20240130038
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Chin-Hsun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...
- Publication number 20240121888
- Publication date Apr 11, 2024
- Vayyar Imaging Ltd.
- Rohi HALIMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20240098884
- Publication date Mar 21, 2024
- LG Innotek Co., Ltd.
- Do Hyuk YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RF CONNECTOR AND COMMUNICATION APPARATUS INCLUDING SAME
- Publication number 20240098885
- Publication date Mar 21, 2024
- KMW Inc.
- Bae Mook JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240008168
- Publication date Jan 4, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD FOR ANTENNA, ANTENNA PACKAGE INCLUDING THE SAME AND I...
- Publication number 20230422409
- Publication date Dec 28, 2023
- DONGWOO FINE-CHEM CO., LTD.
- Dae Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20230422393
- Publication date Dec 28, 2023
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED CIRCUIT BOARD
- Publication number 20230380075
- Publication date Nov 23, 2023
- Murata Manufacturing Co., Ltd.
- Kenji MATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATING GRAPHENE INTO THE SKIN DEPTH REGION OF HIGH SPEED COMMU...
- Publication number 20230354505
- Publication date Nov 2, 2023
- Cisco Technology, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20230345622
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEM OF A PRINTED CIRCUIT BOARD (PCB) INCLUDING A R...
- Publication number 20230276568
- Publication date Aug 31, 2023
- Intel Corporation
- Ofer Markish
- G01 - MEASURING TESTING
Information Patent Application
BEND COMPENSATION FOR CONDUCTIVE TRACES ON PRINTED CIRCUIT BOARDS
- Publication number 20230254966
- Publication date Aug 10, 2023
- Amphenol Corporation
- Michael Rowlands
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20230239996
- Publication date Jul 27, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SIGNAL ENHANCEMENT METHOD OF CIRCUIT BOARD AND STRUCTURE TH...
- Publication number 20230239997
- Publication date Jul 27, 2023
- Unimicron Technology Corp.
- Tzu Hsuan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20230239998
- Publication date Jul 27, 2023
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PCB RF CABLE
- Publication number 20230232529
- Publication date Jul 20, 2023
- AMOSENSE CO.,LTD
- Jeonggeun HEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230171877
- Publication date Jun 1, 2023
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Hao-Yi WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230156913
- Publication date May 18, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier for Microwave Applications With Stack Pieces Inte...
- Publication number 20230134610
- Publication date May 4, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian SATTLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230127697
- Publication date Apr 27, 2023
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH
- Publication number 20230121347
- Publication date Apr 20, 2023
- Raytheon Company
- Andrew R. Southworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CONDUCTOR AND RECTIFIER PACKAGE FOR POWER TRANSFER
- Publication number 20230067293
- Publication date Mar 2, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yanghe Liu
- B60 - VEHICLES IN GENERAL
Information Patent Application
SURFACE MOUNT RADIO FREQUENCY CROSSOVER DEVICE
- Publication number 20230037385
- Publication date Feb 9, 2023
- Knowles Cazenovia, Inc.
- Pierre Nadeau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AN...
- Publication number 20230035240
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Bongchoon PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE MODULE
- Publication number 20230036907
- Publication date Feb 2, 2023
- Murata Manufacturing Co., Ltd.
- Noriaki OKUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL TRANSMISSION LINE
- Publication number 20230022402
- Publication date Jan 26, 2023
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Structural details of individual signal conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bend compensation for conductive traces on printed circuit boards

Transmission device for suppressing glass fiber effect

Circuit board and method of manufacturing thereof

Transmission line substrate and electronic device

Method of manufacturing wiring substrate

Transmission line and electronic device

Structure for mounting a transmission line substrate having interla...

Method and procedure for miniaturing a multi-layer PCB

Board having conductive layer for shielding electronic component an...

Circuit signal enhancement method of circuit board and structure th...

Package component and forming method thereof

High-frequency circuit

Non-galvanic interconnect for planar RF devices

Printed wiring board

Integrating graphene into the skin depth region of high speed commu...

Wiring substrate and method of manufacturing the same

Bend compensation for conductive traces on printed circuit boards

Method for manufacturing personalized chipless radiofrequency ident...

Surface-treated copper foil, manufacturing method thereof, copper f...

Printed circuit board for transmitting signal in high-frequency ban...

Electronic apparatus and electrical element

Method of producing printed circuit boards with routing conductors...

Apparatus and system of a printed circuit board (PCB) including a r...

Circuit board

Signal transmission circuit and printed circuit board

Printed circuit board

Method and procedure for miniaturing a multi-layer PCB

Circuit board

Glass wiring board

Flexible resonant trap circuit

Patents Applicationslast 30 patents

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

WIRING SUBSTRATE

SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...

PACKAGE COMPONENT

TRANSMISSION DEVICE FOR SUPPRESSING GLASS FIBER EFFECT

SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

RF CONNECTOR AND COMMUNICATION APPARATUS INCLUDING SAME

CIRCUIT BOARD

CIRCUIT BOARD FOR ANTENNA, ANTENNA PACKAGE INCLUDING THE SAME AND I...

WIRING BOARD

CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED CIRCUIT BOARD

INTEGRATING GRAPHENE INTO THE SKIN DEPTH REGION OF HIGH SPEED COMMU...

PACKAGE COMPONENT AND FORMING METHOD THEREOF

APPARATUS AND SYSTEM OF A PRINTED CIRCUIT BOARD (PCB) INCLUDING A R...

BEND COMPENSATION FOR CONDUCTIVE TRACES ON PRINTED CIRCUIT BOARDS

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

CIRCUIT SIGNAL ENHANCEMENT METHOD OF CIRCUIT BOARD AND STRUCTURE TH...

METHOD OF MANUFACTURING WIRING SUBSTRATE

FLEXIBLE PCB RF CABLE

CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF

CIRCUIT BOARD

Component Carrier for Microwave Applications With Stack Pieces Inte...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH

PRINTED CONDUCTOR AND RECTIFIER PACKAGE FOR POWER TRANSFER

SURFACE MOUNT RADIO FREQUENCY CROSSOVER DEVICE

BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AN...

MULTILAYER SUBSTRATE MODULE

SIGNAL TRANSMISSION LINE