Structural electrical arrangements for semiconductor devices not otherwise provided for

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,990,386
- Issue date May 21, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including different type semiconductor chips...
- Patent number 11,823,975
- Issue date Nov 21, 2023
- SK hynix Inc.
- Hyun Chul Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,600,548
- Issue date Mar 7, 2023
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor chip by piezoelectricity
- Patent number 10,658,310
- Issue date May 19, 2020
- International Business Machines Corporation
- Kangguo Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Secure semiconductor chip by piezoelectricity
- Patent number 10,431,557
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Kangguo Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Packaging optoelectronic components and CMOS circuitry using silico...
- Patent number 10,229,898
- Issue date Mar 12, 2019
- International Business Machines Corporation
- Russell A. Budd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor modules with protective coating
- Patent number 10,177,057
- Issue date Jan 8, 2019
- Infineon Technologies AG
- Reinhold Bayerer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Carbon-coated thermal conductive material
- Patent number 10,121,717
- Issue date Nov 6, 2018
- Sekisui Chemical Co., Ltd.
- Ren-de Sun
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Packaging optoelectronic components and CMOS circuitry using silico...
- Patent number 10,090,286
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Russell A. Budd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device, light emitting device package comprising lig...
- Patent number 10,014,259
- Issue date Jul 3, 2018
- LG Innotek Co., Ltd
- Sung Kyoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging optoelectronic components and CMOS circuitry using silico...
- Patent number 9,935,088
- Issue date Apr 3, 2018
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Grant
Packaging optoelectronic components and CMOS circuitry using silico...
- Patent number 9,935,089
- Issue date Apr 3, 2018
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Grant
Integrated circuit device having defined gate spacing and method of...
- Patent number 9,431,500
- Issue date Aug 30, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of fabricating a semiconductor device having a defined minim...
- Patent number 8,635,573
- Issue date Jan 21, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hak-Lay Chuang
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20240347414
- Publication date Oct 17, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20230230896
- Publication date Jul 20, 2023
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL LTCC PACKAGE STRUCTURE
- Publication number 20230147337
- Publication date May 11, 2023
- ONANO INDUSTRIAL CORP.
- Chun-Hsia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING DIFFERENT TYPE SEMICONDUCTOR CHIPS...
- Publication number 20230009221
- Publication date Jan 12, 2023
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20210375715
- Publication date Dec 2, 2021
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR CHIP BY PIEZOELECTRICITY
- Publication number 20190326229
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR CHIP BY PIEZOELECTRICITY
- Publication number 20190273049
- Publication date Sep 5, 2019
- International Business Machines Corporation
- Kangguo Cheng
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICES WITH BACK-SIDE COILS FOR WIRELESS SIGNAL AND...
- Publication number 20180323133
- Publication date Nov 8, 2018
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Modules with Protective Coating
- Publication number 20180174936
- Publication date Jun 21, 2018
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING OPTOELECTRONIC COMPONENTS AND CMOS CIRCUITRY USING SILICO...
- Publication number 20180114785
- Publication date Apr 26, 2018
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE COMPRISING LIG...
- Publication number 20170229398
- Publication date Aug 10, 2017
- LG Innotek Co., Ltd.
- Sung Kyoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON COATED HEAT CONDUCTING MATERIAL
- Publication number 20170200663
- Publication date Jul 13, 2017
- Sekisui Chemical Co., Ltd
- Ren-de Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING OPTOELECTRONIC COMPONENTS AND CMOS CIRCUITRY USING SILICO...
- Publication number 20170186670
- Publication date Jun 29, 2017
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
Integrated Circuit Device Having Defined Gate Spacing And Method Of...
- Publication number 20140332893
- Publication date Nov 13, 2014
- Harry-Hak-Lay Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DEFINED GATE SPACING AND METHOD OF...
- Publication number 20130032884
- Publication date Feb 7, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd., ("TSMC")
- Hak-Lay Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20120048595
- Publication date Mar 1, 2012
- ELPIDA MEMORY, INC.
- Emi KASHIWAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Structural electrical arrangements for semiconductor devices not otherwise provided for

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and heat distribution devices for thermal management of chi...

Semiconductor packages including different type semiconductor chips...

Methods and heat distribution devices for thermal management of chi...

Secure semiconductor chip by piezoelectricity

Secure semiconductor chip by piezoelectricity

Packaging optoelectronic components and CMOS circuitry using silico...

Power semiconductor modules with protective coating

Carbon-coated thermal conductive material

Packaging optoelectronic components and CMOS circuitry using silico...

Light emitting device, light emitting device package comprising lig...

Packaging optoelectronic components and CMOS circuitry using silico...

Packaging optoelectronic components and CMOS circuitry using silico...

Integrated circuit device having defined gate spacing and method of...

Method of fabricating a semiconductor device having a defined minim...

Patents Applicationslast 30 patents

Methods And Heat Distribution Devices For Thermal Management Of Chi...

Methods And Heat Distribution Devices For Thermal Management Of Chi...

THREE-DIMENSIONAL LTCC PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGES INCLUDING DIFFERENT TYPE SEMICONDUCTOR CHIPS...

Methods And Heat Distribution Devices For Thermal Management Of Chi...

SECURE SEMICONDUCTOR CHIP BY PIEZOELECTRICITY

SECURE SEMICONDUCTOR CHIP BY PIEZOELECTRICITY

SEMICONDUCTOR DEVICES WITH BACK-SIDE COILS FOR WIRELESS SIGNAL AND...

Power Semiconductor Modules with Protective Coating

PACKAGING OPTOELECTRONIC COMPONENTS AND CMOS CIRCUITRY USING SILICO...

LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE COMPRISING LIG...

CARBON COATED HEAT CONDUCTING MATERIAL

PACKAGING OPTOELECTRONIC COMPONENTS AND CMOS CIRCUITRY USING SILICO...

Integrated Circuit Device Having Defined Gate Spacing And Method Of...

INTEGRATED CIRCUIT DEVICE HAVING DEFINED GATE SPACING AND METHOD OF...

WIRING BOARD AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE