Structure of the redistribution layers

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H01L2224/0233

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0233Structure of the redistribution layers

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Patents Grantslast 30 patents

Information Patent Grant
Passivation layers with rounded corners
- Patent number 12,322,646
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
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- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
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- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and electronic device including the same
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- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Sun Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
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- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
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- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor redistribution structure with integrated test pad and...
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- Issue date Apr 29, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including re-distribution pads disposed at dif...
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- Issue date Apr 29, 2025
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
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- Issue date Apr 22, 2025
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated transformer module
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- Issue date Apr 8, 2025
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- Takayuki Tange
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Information Patent Grant
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- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with stacked semiconductor dies
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- Issue date Mar 18, 2025
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- Yi-Chao Mao
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Information Patent Grant
Chip package structure
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Information Patent Grant
Semiconductor package and method of manufacturing the same
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Information Patent Grant
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Information Patent Grant
High-speed die connections using a conductive insert
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- Rahul Agarwal
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Method of manufacturing a semiconductor device including a pluralit...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date Feb 4, 2025
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- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, resin sheet, cured film, method for producing cu...
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- Issue date Jan 28, 2025
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- Keika Hashimoto
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Information Patent Grant
Display substrate and preparation method thereof, and display appar...
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- Issue date Jan 14, 2025
- BOE Technology Group Co., Ltd.
- Wenqu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for improved wafer coating
- Patent number 12,199,054
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
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Information Patent Grant
Semiconductor device package and method of manufacture
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- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process control for package formation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
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- Yi-Wen Wu
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Information Patent Grant
Embedded metal insulator metal structure
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- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method
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- Issue date Dec 10, 2024
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- Yu-Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
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- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
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- Issue date Nov 19, 2024
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- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES
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- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR...
- Publication number 20250167144
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- Samsung Electronics Co., Ltd.
- Junho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250167145
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...
- Publication number 20250157922
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...
- Publication number 20250149527
- Publication date May 8, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250149475
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Min Seung JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250125208
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250112180
- Publication date Apr 3, 2025
- AOI ELECTRONICS CO., LTD.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND METHODS OF FORMATION
- Publication number 20250112183
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHERN-YOW HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHO...
- Publication number 20250096117
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Anshih TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Method of Manufacture
- Publication number 20250079368
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONTROL FOR PACKAGE FORMATION
- Publication number 20250079429
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Devices and Methods of Manufacturing
- Publication number 20250079428
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Wen Wu
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Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250054885
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Hsiang Wang
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SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE
- Publication number 20250054886
- Publication date Feb 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054915
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SYSTEM
- Publication number 20250054857
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
- Publication number 20250038087
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD FOR SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR ST...
- Publication number 20250015022
- Publication date Jan 9, 2025
- SiPLP Microelectronics (Chongqing) Limited
- Yan HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-INTERCONNECT
- Publication number 20250015031
- Publication date Jan 9, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
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BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240395752
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Channels in Encapsulant...
- Publication number 20240395647
- Publication date Nov 28, 2024
- STATS ChipPAC Pte Ltd.
- Jian Zuo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...
- Publication number 20240395674
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- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF
- Publication number 20240395741
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER COATING
- Publication number 20240395742
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Feng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387450
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYERS WITH ROUNDED CORNERS
- Publication number 20240387244
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Mingni CHANG
- H01 - BASIC ELECTRIC ELEMENTS
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Package with Organic Integrated Circuit Substrate Embedded in Inorg...
- Publication number 20240387456
- Publication date Nov 21, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Structure of the redistribution layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Passivation layers with rounded corners

Semiconductor package and manufacturing method thereof

Package structure and method of fabricating the same

Fan-out semiconductor package and electronic device including the same

Semiconductor device and method of manufacturing thereof

Semiconductor packages and methods of forming same

Semiconductor redistribution structure with integrated test pad and...

Semiconductor device including re-distribution pads disposed at dif...

Package structure

Integrated transformer module

Semiconductor device package with conductive pillars and reinforcin...

Package structure with stacked semiconductor dies

Chip package structure

Semiconductor package and method of manufacturing the same

Semiconductor device and method

High-speed die connections using a conductive insert

Method of manufacturing a semiconductor device including a pluralit...

Semiconductor packages

Resin composition, resin sheet, cured film, method for producing cu...

Display substrate and preparation method thereof, and display appar...

Method and apparatus for improved wafer coating

Package structure

Semiconductor device package and method of manufacture

Process control for package formation

Semiconductor devices and methods of manufacturing

Embedded metal insulator metal structure

Integrated circuit device and method

Semiconductor package and method of fabricating the same

Package structure and method of fabrcating the same

Semiconductor packages and methods of forming same

Patents Applicationslast 30 patents

PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR...

PACKAGE STRUCTURE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DIE AND METHODS OF FORMATION

INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHO...

METHOD FOR FORMING PACKAGE STRUCTURE

Semiconductor Device Package and Method of Manufacture

PROCESS CONTROL FOR PACKAGE FORMATION

Semiconductor Devices and Methods of Manufacturing

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUIT DEVICE AND SYSTEM

Heterogeneous Fan-Out Structure and Method of Manufacture

FABRICATION METHOD FOR SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR ST...

3D-INTERCONNECT

BONDING STRUCTURE AND METHOD OF FORMING SAME

Semiconductor Device and Method of Forming Channels in Encapsulant...

SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...

METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF

METHOD AND APPARATUS FOR IMPROVED WAFER COATING

REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME

PASSIVATION LAYERS WITH ROUNDED CORNERS

Package with Organic Integrated Circuit Substrate Embedded in Inorg...