Structure, shape, material or disposition of high density interconnect preforms

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/20Structure, shape, material or disposition of high density interconnect preforms

Industries

Patents Grantslast 30 patents

Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 12,087,738
- Issue date Sep 10, 2024
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and electronic module with new routing possibi...
- Patent number RE49970
- Issue date May 14, 2024
- IMBERATEK, LLC
- Antti Kivikero
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 11,594,525
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 11,398,457
- Issue date Jul 26, 2022
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal through vias (TTV)
- Patent number 11,373,922
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,233,027
- Issue date Jan 25, 2022
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with embedded stacked through-silicon via die
- Patent number 11,107,766
- Issue date Aug 31, 2021
- Intel Corporation
- Javier Soto Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,071,207
- Issue date Jul 20, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,031,310
- Issue date Jun 8, 2021
- QUALCOMM Incorporated
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,018,105
- Issue date May 25, 2021
- Cypress Semiconductor Corporation
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and electronic module with new routing possibi...
- Patent number RE48539
- Issue date Apr 27, 2021
- IMBERATEK, LLC
- Antti Kivikero
Information Patent Grant
Semiconductor structure with conductive structure
- Patent number 10,978,363
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with conductive structure
- Patent number 10,978,362
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked-chip package
- Patent number 10,971,417
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,770,418
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Da Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,679,959
- Issue date Jun 9, 2020
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming EMI shielding layer with...
- Patent number 10,643,952
- Issue date May 5, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 10,593,653
- Issue date Mar 17, 2020
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,573,613
- Issue date Feb 25, 2020
- Samsung Electronics Co., Ltd.
- Da Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,529,678
- Issue date Jan 7, 2020
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,515,916
- Issue date Dec 24, 2019
- Samsung Electronics Co., Ltd.
- Dae Jung Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical wire connections for integrated circuit package
- Patent number 10,490,527
- Issue date Nov 26, 2019
- Intel IP Corporation
- Christian Geissler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure with conductive structure
- Patent number 10,490,468
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Chun Tsai
- G01 - MEASURING TESTING
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,474,868
- Issue date Nov 12, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Ho Baek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic module with EMI protection
- Patent number 10,470,346
- Issue date Nov 5, 2019
- GE Embedded Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with embedded stacked through-silicon via die
- Patent number 10,461,032
- Issue date Oct 29, 2019
- Intel Corporation
- Javier Soto Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,396,049
- Issue date Aug 27, 2019
- Samsung Electronics Co., Ltd.
- Young Min Ban
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D stacked-chip package
- Patent number 10,373,885
- Issue date Aug 6, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,229,865
- Issue date Mar 12, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin Seol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming sacrificial protective l...
- Patent number 10,204,866
- Issue date Feb 12, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240014177
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Young Kun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20230197690
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220336399
- Publication date Oct 20, 2022
- Intel Deutschland GmbH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...
- Publication number 20220285241
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20220285325
- Publication date Sep 8, 2022
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220108966
- Publication date Apr 7, 2022
- Intel Deutschland GmbH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210321520
- Publication date Oct 14, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20200279834
- Publication date Sep 3, 2020
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200058610
- Publication date Feb 20, 2020
- CYPRESS SEMICONDUCTOR CORPORATION
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED-CHIP PACKAGE
- Publication number 20190355640
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20180158746
- Publication date Jun 7, 2018
- QUALCOMM Incorporated
- Mou-Shiung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR...
- Publication number 20180096924
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140367863
- Publication date Dec 18, 2014
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure a...
- Publication number 20140353846
- Publication date Dec 4, 2014
- STATS ChipPAC, Ltd.
- Linda Pei Ee Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...
- Publication number 20140332937
- Publication date Nov 13, 2014
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Adhesive Material to Sec...
- Publication number 20140332986
- Publication date Nov 13, 2014
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Semiconductor Device Fabrication Using a R...
- Publication number 20140335654
- Publication date Nov 13, 2014
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20140313676
- Publication date Oct 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...
- Publication number 20140287555
- Publication date Sep 25, 2014
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20140284792
- Publication date Sep 25, 2014
- Wei-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including RDL Along Sloped Side Surface of Sem...
- Publication number 20140264786
- Publication date Sep 18, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20140242751
- Publication date Aug 28, 2014
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20140239511
- Publication date Aug 28, 2014
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Embedding Bumps Formed on Semico...
- Publication number 20140231989
- Publication date Aug 21, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC
- Publication number 20140225271
- Publication date Aug 14, 2014
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing an electronic module and an electronic module
- Publication number 20140208588
- Publication date Jul 31, 2014
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Providing Z-Interconnect Conduct...
- Publication number 20140203443
- Publication date Jul 24, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extended Redistribution Layers Bumped Wafer
- Publication number 20140197540
- Publication date Jul 17, 2014
- STATS ChipPAC, Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Discontinuous ESD Protec...
- Publication number 20140175623
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT PRINTED CIRCUIT SEMICONDUCTOR PACKAGE
- Publication number 20140080258
- Publication date Mar 20, 2014
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS

Structure, shape, material or disposition of high density interconnect preforms

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packaged integrated circuit devices with through-body conductive vi...

Manufacturing method and electronic module with new routing possibi...

Packaged integrated circuit devices with through-body conductive vi...

Packaged integrated circuit devices with through-body conductive vi...

Semiconductor packages having thermal through vias (TTV)

Semiconductor device

Substrate with embedded stacked through-silicon via die

Electronic module

Chip package

Semiconductor device and method of manufacturing the same

Manufacturing method and electronic module with new routing possibi...

Semiconductor structure with conductive structure

Semiconductor structure with conductive structure

3D stacked-chip package

Fan-out semiconductor package

Semiconductor device

Semiconductor device and method of forming EMI shielding layer with...

Packaged integrated circuit devices with through-body conductive vi...

Fan-out semiconductor package

Semiconductor device

Fan-out semiconductor package

Vertical wire connections for integrated circuit package

Semiconductor structure with conductive structure

Fan-out semiconductor package

Electronic module with EMI protection

Substrate with embedded stacked through-silicon via die

Fan-out semiconductor package

3D stacked-chip package

Fan-out semiconductor package

Semiconductor device and method of forming sacrificial protective l...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

SEMICONDUCTOR DEVICE

METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

SEMICONDUCTOR DEVICE

ELECTRONIC MODULE

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

3D STACKED-CHIP PACKAGE

CHIP PACKAGE

CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR...

SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Interconnect Structure a...

WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...

Semiconductor Device and Method of Forming Adhesive Material to Sec...

Method and Apparatus for Semiconductor Device Fabrication Using a R...

ELECTRONIC COMPONENT PACKAGE

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...

ELECTRONIC DEVICE PACKAGE

Semiconductor Device Including RDL Along Sloped Side Surface of Sem...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

Semiconductor Device and Method of Embedding Bumps Formed on Semico...

PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC

Method for manufacturing an electronic module and an electronic module

Semiconductor Device and Method of Providing Z-Interconnect Conduct...

Extended Redistribution Layers Bumped Wafer

Semiconductor Device and Method of Forming Discontinuous ESD Protec...

COMPLIANT PRINTED CIRCUIT SEMICONDUCTOR PACKAGE