TREA

Structure, shape, material or disposition of the bonding areas after the connecting process

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Industry

  • CPC
  • H01L24/07
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/07Structure, shape, material or disposition of the bonding areas after the connecting process
Industries