Structure, shape, material or disposition of the bonding areas after the connecting process

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/07Structure, shape, material or disposition of the bonding areas after the connecting process

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package system and method
- Patent number 11,901,319
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 11,855,022
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 11,749,605
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Eutectic bonding with AlGe
- Patent number 11,724,933
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked die package including a first die coupled to a substrate th...
- Patent number 11,705,432
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Hiroki Fujisawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Integration of a passive component in a cavity of an integrated cir...
- Patent number 11,430,722
- Issue date Aug 30, 2022
- Texas Instruments Incorporated
- Jeffrey Morroni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing insulating film and semiconductor package
- Patent number 11,361,878
- Issue date Jun 14, 2022
- LG Chem, Ltd.
- Woo Jae Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 11,296,012
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting composition for use as underfill material, and semico...
- Patent number 11,195,769
- Issue date Dec 7, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package including a first die coupled to a substrate th...
- Patent number 11,081,468
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Hiroki Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip transmitting sign...
- Patent number 11,049,806
- Issue date Jun 29, 2021
- Renesas Electronics Corporation
- Kazuyuki Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 10,937,735
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High bandwidth memory (HBM) bandwidth aggregation switch
- Patent number 10,916,516
- Issue date Feb 9, 2021
- Xilinx, Inc.
- Martin Newman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Eutectic bonding with AlGe
- Patent number 10,793,427
- Issue date Oct 6, 2020
- Kionix, Inc.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic bonding with ALGe
- Patent number 10,766,767
- Issue date Sep 8, 2020
- Kionix, Inc.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated semiconductor assemblies and methods of manufacturing th...
- Patent number 10,748,872
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 10,347,563
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste-like adhesive composition, semiconductor device, method for m...
- Patent number 10,259,976
- Issue date Apr 16, 2019
- Sumitomo Bakelite Co., Ltd.
- Yasuo Shimobe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chip structure having redistribution layer
- Patent number 10,177,077
- Issue date Jan 8, 2019
- Powertech Technology Inc.
- Chi-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a microelectronic device structure, and related...
- Patent number 10,136,520
- Issue date Nov 20, 2018
- Quartzdyne, Inc.
- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus, method for manufacturing the same, electro...
- Patent number 9,786,616
- Issue date Oct 10, 2017
- Seiko Epson Corporation
- Kazunobu Kuwazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a microelectronic device structure, and related...
- Patent number 9,717,148
- Issue date Jul 25, 2017
- Quartzdyne, Inc.
- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and display panel using same
- Patent number 9,681,545
- Issue date Jun 13, 2017
- Innolux Corporation
- Chia-Cheng Liu
- G02 - OPTICS
Information Patent Grant
Substrate structure
- Patent number 9,398,690
- Issue date Jul 19, 2016
- Innolux Corporation
- Chia-Cheng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic device and electronic device
- Patent number 9,391,031
- Issue date Jul 12, 2016
- Fujitsu Limited
- Tetsuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOS device structure
- Patent number 9,356,137
- Issue date May 31, 2016
- CSMC TECHNOLOGIES FAB1 CO., LTD.
- Shu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power dielectric carrier with accurate die attach layer
- Patent number 9,196,602
- Issue date Nov 24, 2015
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yuxing Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor device
- Patent number 9,177,915
- Issue date Nov 3, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuhiro Kaibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,153,549
- Issue date Oct 6, 2015
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrically connecting wafers using butting contact str...
- Patent number 8,906,781
- Issue date Dec 9, 2014
- Siliconfile Technologies Inc.
- In Gyun Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATION OF A PASSIVE COMPONENT IN A CAVITY OF AN INTEGRATED CIR...
- Publication number 20220415768
- Publication date Dec 29, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey MORRONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20220230940
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE INCLUDING A FIRST DIE COUPLED TO A SUBSTRATE TH...
- Publication number 20210327856
- Publication date Oct 21, 2021
- Micron Technology, Inc.
- Hiroki Fujisawa
- G11 - INFORMATION STORAGE
Information Patent Application
EMBEDDED MOLDING FAN-OUT (EMFO) PACKAGING AND METHOD OF MANUFACTURI...
- Publication number 20210287953
- Publication date Sep 16, 2021
- DiDrew Technology (BVI) Limited
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDER-BUMP METALLIZATION COMPONENT
- Publication number 20210118808
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING TH...
- Publication number 20210091046
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE INCLUDING WIRE BONDING AND DIRECT CHIP ATTACHME...
- Publication number 20210066247
- Publication date Mar 4, 2021
- Micron Technology, Inc.
- Hiroki Fujisawa
- G11 - INFORMATION STORAGE
Information Patent Application
THERMOSETTING COMPOSITION FOR USE AS UNDERFILL MATERIAL, AND SEMICO...
- Publication number 20200381321
- Publication date Dec 3, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Shigeru YAMATSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING A LEAD FRAME, METHOD OF MANUFACTURING AN EL...
- Publication number 20200321228
- Publication date Oct 8, 2020
- SONY CORPORATION
- KOYO HOSOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20190333841
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INSULATING FILM AND SEMICONDUCTOR PACKAGE
- Publication number 20190189304
- Publication date Jun 20, 2019
- LG CHEM, LTD.
- Woo Jae JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING TH...
- Publication number 20190067245
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MEMORY (HBM) BANDWIDTH AGGREGATION SWITCH
- Publication number 20180358313
- Publication date Dec 13, 2018
- Xilinx, Inc.
- Martin Newman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PASTE-LIKE ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR M...
- Publication number 20180340101
- Publication date Nov 29, 2018
- SUMITOMO BAKELITE CO., LTD.
- Yasuo SHIMOBE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRATION OF A PASSIVE COMPONENT IN A CAVITY OF AN INTEGRATED CIR...
- Publication number 20180301403
- Publication date Oct 18, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey MORRONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE HAVING REDISTRIBUTION LAYER
- Publication number 20180301396
- Publication date Oct 18, 2018
- Powertech Technology Inc.
- Chi-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH SHORT-CIRCUIT FAILURE MODE
- Publication number 20170338193
- Publication date Nov 23, 2017
- DANFOSS SILICON POWER GMBH
- Josef Lutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED...
- Publication number 20170311451
- Publication date Oct 26, 2017
- QUARTZDYNE, INC.
- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT
- Publication number 20150249060
- Publication date Sep 3, 2015
- MEDIATEK INC.
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER DIELECTRIC CARRIER WITH ACCURATE DIE ATTACH LAYER
- Publication number 20140339709
- Publication date Nov 20, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yuxing Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power MOS Device Structure
- Publication number 20140159151
- Publication date Jun 12, 2014
- Shu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ELECTRICALLY CONNECTING WAFERS USING BUTTING CONTACT STR...
- Publication number 20140138847
- Publication date May 22, 2014
- SILICONFILE TECHNOLOGIES INC.
- In Gyun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20140103537
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kazuhiro KAIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20140084491
- Publication date Mar 27, 2014
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140070368
- Publication date Mar 13, 2014
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Material for Semiconductor Devices
- Publication number 20130134591
- Publication date May 30, 2013
- Yoshitsugu Sakamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Structure, shape, material or disposition of the bonding areas after the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package system and method

Shielding structures

Hybrid under-bump metallization component

Eutectic bonding with AlGe

Stacked die package including a first die coupled to a substrate th...

Integration of a passive component in a cavity of an integrated cir...

Method for manufacturing insulating film and semiconductor package

Barrier structures between external electrical connectors

Thermosetting composition for use as underfill material, and semico...

Stacked die package including a first die coupled to a substrate th...

Semiconductor device including semiconductor chip transmitting sign...

Hybrid under-bump metallization component

High bandwidth memory (HBM) bandwidth aggregation switch

Eutectic bonding with AlGe

Eutectic bonding with ALGe

Integrated semiconductor assemblies and methods of manufacturing th...

Barrier structures between external electrical connectors

Paste-like adhesive composition, semiconductor device, method for m...

Chip structure having redistribution layer

Methods of forming a microelectronic device structure, and related...

Semiconductor apparatus, method for manufacturing the same, electro...

Methods of forming a microelectronic device structure, and related...

Substrate structure and display panel using same

Substrate structure

Method for manufacturing electronic device and electronic device

Power MOS device structure

High power dielectric carrier with accurate die attach layer

Nitride semiconductor device

Semiconductor device

Method for electrically connecting wafers using butting contact str...

Patents Applicationslast 30 patents

INTEGRATION OF A PASSIVE COMPONENT IN A CAVITY OF AN INTEGRATED CIR...

Barrier Structures Between External Electrical Connectors

STACKED DIE PACKAGE INCLUDING A FIRST DIE COUPLED TO A SUBSTRATE TH...

EMBEDDED MOLDING FAN-OUT (EMFO) PACKAGING AND METHOD OF MANUFACTURI...

HYBRID UNDER-BUMP METALLIZATION COMPONENT

INTEGRATED SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING TH...

STACKED DIE PACKAGE INCLUDING WIRE BONDING AND DIRECT CHIP ATTACHME...

THERMOSETTING COMPOSITION FOR USE AS UNDERFILL MATERIAL, AND SEMICO...

METHOD OF MANUFACTURING A LEAD FRAME, METHOD OF MANUFACTURING AN EL...

Barrier Structures Between External Electrical Connectors

METHOD FOR MANUFACTURING INSULATING FILM AND SEMICONDUCTOR PACKAGE

INTEGRATED SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING TH...

HIGH BANDWIDTH MEMORY (HBM) BANDWIDTH AGGREGATION SWITCH

PASTE-LIKE ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR M...

INTEGRATION OF A PASSIVE COMPONENT IN A CAVITY OF AN INTEGRATED CIR...

CHIP STRUCTURE HAVING REDISTRIBUTION LAYER

POWER SEMICONDUCTOR MODULE WITH SHORT-CIRCUIT FAILURE MODE

METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED...

ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT

HIGH POWER DIELECTRIC CARRIER WITH ACCURATE DIE ATTACH LAYER

Power MOS Device Structure

METHOD FOR ELECTRICALLY CONNECTING WAFERS USING BUTTING CONTACT STR...

NITRIDE SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

Bonding Material for Semiconductor Devices