Structure, shape, material or disposition of the bonding areas prior to the connecting process

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder stop feature for electronic devices
- Patent number 12,300,643
- Issue date May 13, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide profile control
- Patent number 12,288,758
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, apparatus, and chip
- Patent number 12,278,200
- Issue date Apr 15, 2025
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 12,278,199
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising via structure and redist...
- Patent number 12,255,166
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor component and method of fabrica...
- Patent number 12,255,162
- Issue date Mar 18, 2025
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package stress balance structures and related methods
- Patent number 12,230,502
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with polymer layer delamination prevention desi...
- Patent number 12,230,593
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a thermally and electrically conductiv...
- Patent number 12,224,222
- Issue date Feb 11, 2025
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display and manufacturing method therefor
- Patent number 12,218,295
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Byunghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 12,218,035
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 12,176,283
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode packages
- Patent number 12,176,472
- Issue date Dec 24, 2024
- CreeLED, Inc.
- Roshan Murthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level dicing method and semiconductor device
- Patent number 12,176,248
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joint structure, semiconductor device, and joining method
- Patent number 12,168,262
- Issue date Dec 17, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interconnectors of different density
- Patent number 12,148,689
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for wafer scale chip package
- Patent number 12,125,811
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Indumini W. Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite middle interconnectors
- Patent number 12,113,003
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 12,089,409
- Issue date Sep 10, 2024
- Kioxia Corporation
- Masayoshi Tagami
- G11 - INFORMATION STORAGE
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device module having vertical metallic contacts and a...
- Patent number 12,080,669
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall coatings and related methods
- Patent number 12,040,192
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and semiconductor die
- Patent number 12,021,057
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,014,975
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Jaegwon Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional packaging structure and method for fan-out of bon...
- Patent number 12,014,965
- Issue date Jun 18, 2024
- Xiamen Sky Semiconductor Technology Co. Ltd.
- Daquan Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250157958
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157908
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
- Publication number 20250157955
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ISOLATED DIES
- Publication number 20250140624
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hau NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140677
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Min Jeong SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132278
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250132220
- Publication date Apr 24, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Hyeon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CONTROLLER
- Publication number 20250118689
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20250105179
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Chikara INADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250087543
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...
- Publication number 20250087611
- Publication date Mar 13, 2025
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...
- Publication number 20250087612
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- JUNHYUN AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087636
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Inhee YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20250079376
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079389
- Publication date Mar 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Yoshiharu SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE, SEMICONDUCTOR DEVICE, AND JOINING METHOD
- Publication number 20250065440
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20250069954
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE
- Publication number 20250054886
- Publication date Feb 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Indumini W. Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046741
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Keita TSUCHIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional Stack Package Structure And Method Making The Same
- Publication number 20250006702
- Publication date Jan 2, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hongkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE UNDER-BUMP METALLIZATION (UBM) SIZES AND PATTERNING, AND R...
- Publication number 20240421119
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404969
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Channels in Encapsulant...
- Publication number 20240395647
- Publication date Nov 28, 2024
- STATS ChipPAC Pte Ltd.
- Jian Zuo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20240397722
- Publication date Nov 28, 2024
- KIOXIA Corporation
- Masayoshi TAGAMI
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT FLIP-CHIP AND LIGHT-EMITTING DEVICE
- Publication number 20240347486
- Publication date Oct 17, 2024
- Lite-On Technology Corporation
- CHEN-HSIU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240347503
- Publication date Oct 17, 2024
- United Microelectronics Corp.
- Shing-Ren SHEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging of Dies Including TSVs using Sacrificial Carrier
- Publication number 20240339370
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufactoring Co., Ltd.
- Chien-Fu Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Structure, shape, material or disposition of the bonding areas prior to the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder stop feature for electronic devices

Polyimide profile control

Semiconductor element, apparatus, and chip

Conductive bump of a semiconductor device and fabricating method th...

Semiconductor package structure comprising via structure and redist...

Semiconductor device, semiconductor component and method of fabrica...

Semiconductor package stress balance structures and related methods

Wafer level package with polymer layer delamination prevention desi...

Semiconductor package having a thermally and electrically conductiv...

Micro LED display and manufacturing method therefor

Barrier structures between external electrical connectors

Die package and method of forming a die package

Light-emitting diode packages

Wafer level dicing method and semiconductor device

Joint structure, semiconductor device, and joining method

Semiconductor device assembly with die support structures

Semiconductor device with interconnectors of different density

Semiconductor structure and method for wafer scale chip package

Semiconductor device with composite middle interconnectors

Semiconductor device assembly with surface-mount die support struct...

Semiconductor memory

Display device and method of manufacturing the same

Semiconductor device and method to minimize stress on stack via

Semiconductor device module having vertical metallic contacts and a...

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Die sidewall coatings and related methods

Semiconductor structure and semiconductor die

Semiconductor packages having a die, an encapsulant, and a redistri...

Semiconductor package

Three-dimensional packaging structure and method for fan-out of bon...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...

PACKAGES WITH ISOLATED DIES

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE HAVING A CONTROLLER

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGES AND METHODS

INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...

CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

JOINT STRUCTURE, SEMICONDUCTOR DEVICE, AND JOINING METHOD

WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE

SEMICONDUCTOR DEVICE

Three-dimensional Stack Package Structure And Method Making The Same

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

FLEXIBLE UNDER-BUMP METALLIZATION (UBM) SIZES AND PATTERNING, AND R...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Forming Channels in Encapsulant...

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

SEMICONDUCTOR MEMORY

INTEGRATED CIRCUIT FLIP-CHIP AND LIGHT-EMITTING DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

Packaging of Dies Including TSVs using Sacrificial Carrier