Structure, shape, material or disposition of the bonding areas prior to the connecting process

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with low parasitic connection to passive device
- Patent number 11,973,063
- Issue date Apr 30, 2024
- Infineon Technologies AG
- Urban Medic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-layer stacked 3D fan-out packaging structure and method maki...
- Patent number 11,973,070
- Issue date Apr 30, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having polygonal bonding pad
- Patent number 11,935,851
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 11,923,338
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die including cavities
- Patent number 11,908,699
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding for semiconductor devices
- Patent number 11,901,327
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,345
- Issue date Feb 13, 2024
- SK hynix Inc.
- Jeong Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,901,342
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backmetal removal methods
- Patent number 11,901,184
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,901,298
- Issue date Feb 13, 2024
- Renesas Electronics Corporation
- Kenji Ikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor die and chip-on-plastic packagi...
- Patent number 11,901,322
- Issue date Feb 13, 2024
- MagnaChip Semiconductor, Ltd.
- Jin Won Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die support structure for thin die
- Patent number 11,894,234
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 11,887,933
- Issue date Jan 30, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,887,950
- Issue date Jan 30, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takuya Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite middle interconnectors
- Patent number 11,881,446
- Issue date Jan 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bond pad with fixing parts fixed ont...
- Patent number 11,876,061
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,876,065
- Issue date Jan 16, 2024
- Texas Instruments Incorporated
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated indium bump stacks for cryogenic electronics
- Patent number 11,862,593
- Issue date Jan 2, 2024
- Microsoft Technology Licensing, LLC
- Christopher Cantaloube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including sub-cell disposed at chip center
- Patent number 11,855,166
- Issue date Dec 26, 2023
- Hitachi Astemo, Ltd.
- Shinichirou Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide profile control
- Patent number 11,855,015
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic protection device and electrostatic protection circuit
- Patent number 11,854,938
- Issue date Dec 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure comprising via structure and redist...
- Patent number 11,817,413
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 11,791,255
- Issue date Oct 17, 2023
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,742,305
- Issue date Aug 29, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 11,729,973
- Issue date Aug 15, 2023
- Kioxia Corporation
- Masayoshi Tagami
- G11 - INFORMATION STORAGE
Information Patent Grant
Display apparatus
- Patent number 11,720,213
- Issue date Aug 8, 2023
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated device comprising pillar interconnect with cavity
- Patent number 11,721,656
- Issue date Aug 8, 2023
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240136201
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Yuseon HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240136309
- Publication date Apr 25, 2024
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240113159
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION NETWORK AND SEMICONDUCTOR DEVICE
- Publication number 20240105616
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Ki Bum KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS
- Publication number 20240088080
- Publication date Mar 14, 2024
- Microsoft Technology Licensing, LLC
- Christopher CANTALOUBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP OF A SEMICONDUCTOR DEVICE AND FABRICATING METHOD TH...
- Publication number 20240055377
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHANG-PIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS
- Publication number 20240055383
- Publication date Feb 15, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240047403
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES
- Publication number 20240033840
- Publication date Feb 1, 2024
- LASERSSEL CO., LTD.
- Jae Joon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...
- Publication number 20240038753
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE
- Publication number 20240021512
- Publication date Jan 18, 2024
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...
- Publication number 20240021552
- Publication date Jan 18, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240021548
- Publication date Jan 18, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Wei-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014193
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
- Publication number 20240014152
- Publication date Jan 11, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH A HIGH DENSITY OF PRIME INTEGRATED CIRCUIT...
- Publication number 20240006251
- Publication date Jan 4, 2024
- pSemi Corporation
- Tran KONONOVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PLATING FOR PACKAGED SEMICONDUCTOR DEVICES
- Publication number 20240006351
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE WIDTHS
- Publication number 20240006361
- Publication date Jan 4, 2024
- QUALCOMM Incorporated
- Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING
- Publication number 20230395538
- Publication date Dec 7, 2023
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING
- Publication number 20230395537
- Publication date Dec 7, 2023
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE PROFILE CONTROL
- Publication number 20230387050
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Chi HUANG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS
- Publication number 20230361013
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- PEI CHENG FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20230350524
- Publication date Nov 2, 2023
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20230345726
- Publication date Oct 26, 2023
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230335514
- Publication date Oct 19, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shifting Contact Pad for Reducing Stress
- Publication number 20230275047
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THERMALLY AND ELECTRICALLY CONDUCTIV...
- Publication number 20230223312
- Publication date Jul 13, 2023
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD
- Publication number 20230178503
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE
- Publication number 20230178517
- Publication date Jun 8, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS

Structure, shape, material or disposition of the bonding areas prior to the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package with low parasitic connection to passive device

Double-layer stacked 3D fan-out packaging structure and method maki...

Semiconductor structure having polygonal bonding pad

Stacked integrated circuits with redistribution lines

Semiconductor packages with die including cavities

Wire bonding for semiconductor devices

Semiconductor package

Discontinuous patterned bonds for semiconductor devices and associa...

Backmetal removal methods

Semiconductor device and method of manufacturing the same

Fabrication method of semiconductor die and chip-on-plastic packagi...

Semiconductor packages with die support structure for thin die

Manufacturing method of semiconductor device

Solid-state imaging device and electronic apparatus

Semiconductor device with composite middle interconnectors

Semiconductor device including bond pad with fixing parts fixed ont...

Flip chip package assembly

Electroplated indium bump stacks for cryogenic electronics

Semiconductor device including sub-cell disposed at chip center

Polyimide profile control

Electrostatic protection device and electrostatic protection circuit

Conductive bump of a semiconductor device and fabricating method th...

Laser bonding apparatus for three-dimensional molded sculptures

Semiconductor package structure comprising via structure and redist...

Die package and method of forming a die package

Semiconductor device and manufacturing method of semiconductor device

Semiconductor memory

Display apparatus

Integrated device comprising pillar interconnect with cavity

Additive manufacturing of a frontside or backside interconnect of a...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

POWER DISTRIBUTION NETWORK AND SEMICONDUCTOR DEVICE

ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS

CONDUCTIVE BUMP OF A SEMICONDUCTOR DEVICE AND FABRICATING METHOD TH...

BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS

SEMICONDUCTOR PACKAGE STRUCTURE

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES

DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE

CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR

SEMICONDUCTOR WAFER WITH A HIGH DENSITY OF PRIME INTEGRATED CIRCUIT...

SELECTIVE PLATING FOR PACKAGED SEMICONDUCTOR DEVICES

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE WIDTHS

CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING

BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING

POLYIMIDE PROFILE CONTROL

SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS

DISPLAY APPARATUS

SEMICONDUCTOR MEMORY

FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME

Shifting Contact Pad for Reducing Stress

SEMICONDUCTOR PACKAGE HAVING A THERMALLY AND ELECTRICALLY CONDUCTIV...

SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD

FAN-OUT PACKAGE STRUCTURE