Structure, shape, material or disposition of the bump connectors after the connecting process

Industry

CPC
H01L24/15

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/15Structure, shape, material or disposition of the bump connectors after the connecting process

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 12,107,066
- Issue date Oct 1, 2024
- Innolux Corporation
- Tzu-Min Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component with conductive terminals of different...
- Patent number 12,074,066
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of semiconductor devices between stacked substrates
- Patent number 12,009,351
- Issue date Jun 11, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive patterns with mesh pattern a...
- Patent number 11,990,397
- Issue date May 21, 2024
- Renesas Electronics Corporation
- Wataru Shiroi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 11,749,605
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device
- Patent number 11,688,710
- Issue date Jun 27, 2023
- Innolux Corporation
- Tzu-Min Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive patterns with mesh pattern a...
- Patent number 11,605,581
- Issue date Mar 14, 2023
- Renesas Electronics Corporation
- Wataru Shiroi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having integrated circuit component with conducti...
- Patent number 11,417,569
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter and capacitor using redistribution layer and micro bump layer
- Patent number 11,410,952
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip transmitting sign...
- Patent number 11,049,806
- Issue date Jun 29, 2021
- Renesas Electronics Corporation
- Kazuyuki Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 10,937,735
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High bandwidth memory (HBM) bandwidth aggregation switch
- Patent number 10,916,516
- Issue date Feb 9, 2021
- Xilinx, Inc.
- Martin Newman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal pillar in a film-type seconductor package
- Patent number 10,867,948
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Jung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 10,770,366
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter and capacitor using redistribution layer and micro bump layer
- Patent number 10,714,441
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, method for manufacturing semiconductor chip, in...
- Patent number 10,658,321
- Issue date May 19, 2020
- Kabushiki Kaisha Toshiba
- Hidekazu Inoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 10,510,635
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid resonator based voltage controlled oscillator (VCO)
- Patent number 10,454,419
- Issue date Oct 22, 2019
- Chengdu Sicore Semiconductor Corp. Ltd.
- Cemin Zhang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 10,153,243
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 10,056,312
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace structures with high assembly yield
- Patent number 10,050,000
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter and capacitor using redistribution layer and micro bump layer
- Patent number 9,960,133
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant circuit including bump pads
- Patent number 9,929,123
- Issue date Mar 27, 2018
- Analog Devices, Inc.
- Cemin Zhang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor apparatus, method for manufacturing the same, electro...
- Patent number 9,786,616
- Issue date Oct 10, 2017
- Seiko Epson Corporation
- Kazunobu Kuwazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 9,780,009
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with angled interconnect elements
- Patent number 9,754,911
- Issue date Sep 5, 2017
- GLOBALFOUNDRIES Inc.
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and assembly thereof with dielectric removal for increase...
- Patent number 9,666,450
- Issue date May 30, 2017
- Tessera, Inc.
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 9,646,923
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser subassembly metallization for heat assisted magnetic recording
- Patent number 9,536,556
- Issue date Jan 3, 2017
- Seagate Technology LLC
- Jon Paul Hurley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20240363415
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230282606
- Publication date Sep 7, 2023
- InnoLux Corporation
- Tzu-Min YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE PATTERNS WITH MESH PATTERN A...
- Publication number 20230187330
- Publication date Jun 15, 2023
- RENESAS ELECTRONICS CORPORATION
- Wataru SHIROI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20220319925
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220223508
- Publication date Jul 14, 2022
- RENESAS ELECTRONICS CORPORATION
- Wataru SHIROI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDER-BUMP METALLIZATION COMPONENT
- Publication number 20210118808
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Filter and Capacitor Using Redistribution Layer and Micro Bump Layer
- Publication number 20200335465
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, THERMOSETTING SHEET, SEMICONDUCTOR...
- Publication number 20200172666
- Publication date Jun 4, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Yasuo FUKUHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20200091027
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20190088547
- Publication date Mar 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MEMORY (HBM) BANDWIDTH AGGREGATION SWITCH
- Publication number 20180358313
- Publication date Dec 13, 2018
- Xilinx, Inc.
- Martin Newman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20180308778
- Publication date Oct 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filter and Capacitor Using Redistribution Layer and Micro Bump Layer
- Publication number 20180233471
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20180025959
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Bumps and Methods of Making Contact Bumps on Flexible Elect...
- Publication number 20170365569
- Publication date Dec 21, 2017
- SMARTRAC TECHNOLOGY GmbH
- Frank Kriebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT CIRCUIT INCLUDING BUMP PADS
- Publication number 20160359456
- Publication date Dec 8, 2016
- Analog Devices, Inc.
- Cemin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20160086867
- Publication date Mar 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT
- Publication number 20150249060
- Publication date Sep 3, 2015
- MEDIATEK INC.
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure and Method of Forming Same
- Publication number 20140264842
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatment in Electroless Process for Adhesion Enhancement
- Publication number 20140264841
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filter and Capacitor Using Redistribution Layer and Micro Bump Layer
- Publication number 20140252548
- Publication date Sep 11, 2014
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...
- Publication number 20140167253
- Publication date Jun 19, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20130341800
- Publication date Dec 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Package on Package Devices
- Publication number 20130292831
- Publication date Nov 7, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER SUBASSEMBLY METALLIZATION FOR HEAT ASSISTED MAGNETIC RECORDING
- Publication number 20130279311
- Publication date Oct 24, 2013
- SEAGATE TECHNOLOGY LLC
- Jon Paul Hurley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SUBSTRATE AND ASSEMBLY THEREOF WITH DIELECTRIC REMOVAL FOR INCREASE...
- Publication number 20120313242
- Publication date Dec 13, 2012
- Tessera, Inc.
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Interconnect Method and Design For GaAs MMIC Applications
- Publication number 20110079925
- Publication date Apr 7, 2011
- NORTHROP GRUMMAN SYSTEMS CORPORATION
- Peter A. Stenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE...
- Publication number 20090137110
- Publication date May 28, 2009
- MEGICA CORPORATION
- Jin-Yuan Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20090115035
- Publication date May 7, 2009
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE TOP METAL FOR SILICON CARBIDE SEMICONDUCTOR DEVICES
- Publication number 20080286968
- Publication date Nov 20, 2008
- SILICONIX TECHNOLOGY C.V.
- Rossano Carta
- H01 - BASIC ELECTRIC ELEMENTS

Structure, shape, material or disposition of the bump connectors after the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Integrated circuit component with conductive terminals of different...

Plurality of semiconductor devices between stacked substrates

Semiconductor device having conductive patterns with mesh pattern a...

Hybrid under-bump metallization component

Electronic device

Semiconductor device having conductive patterns with mesh pattern a...

Package structure having integrated circuit component with conducti...

Filter and capacitor using redistribution layer and micro bump layer

Semiconductor device including semiconductor chip transmitting sign...

Hybrid under-bump metallization component

High bandwidth memory (HBM) bandwidth aggregation switch

Metal pillar in a film-type seconductor package

Integrated circuit packages and methods for forming the same

Filter and capacitor using redistribution layer and micro bump layer

Semiconductor chip, method for manufacturing semiconductor chip, in...

Integrated circuit packages and methods for forming the same

Hybrid resonator based voltage controlled oscillator (VCO)

Semiconductor devices, methods of manufacture thereof, and packaged...

Electronic device and method for producing an electronic device

Integrated circuit packages and methods for forming the same

Bump-on-trace structures with high assembly yield

Filter and capacitor using redistribution layer and micro bump layer

Resonant circuit including bump pads

Semiconductor apparatus, method for manufacturing the same, electro...

Integrated circuit packages and methods for forming the same

IC structure with angled interconnect elements

Substrate and assembly thereof with dielectric removal for increase...

Semiconductor devices, methods of manufacture thereof, and packaged...

Laser subassembly metallization for heat assisted magnetic recording

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE PATTERNS WITH MESH PATTERN A...

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

SEMICONDUCTOR DEVICE

HYBRID UNDER-BUMP METALLIZATION COMPONENT

Filter and Capacitor Using Redistribution Layer and Micro Bump Layer

THERMOSETTING RESIN COMPOSITION, THERMOSETTING SHEET, SEMICONDUCTOR...

Integrated Circuit Packages and Methods for Forming the Same

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

HIGH BANDWIDTH MEMORY (HBM) BANDWIDTH AGGREGATION SWITCH

Integrated Circuit Packages and Methods for Forming the Same

Filter and Capacitor Using Redistribution Layer and Micro Bump Layer

Integrated Circuit Packages and Methods for Forming the Same

Contact Bumps and Methods of Making Contact Bumps on Flexible Elect...

RESONANT CIRCUIT INCLUDING BUMP PADS

Integrated Circuit Packages and Methods for Forming the Same

ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT

Package-on-Package Structure and Method of Forming Same

Surface Treatment in Electroless Process for Adhesion Enhancement

Filter and Capacitor Using Redistribution Layer and Micro Bump Layer

Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...

Integrated Circuit Packages and Methods for Forming the Same

Methods and Apparatus for Package on Package Devices

LASER SUBASSEMBLY METALLIZATION FOR HEAT ASSISTED MAGNETIC RECORDING

SUBSTRATE AND ASSEMBLY THEREOF WITH DIELECTRIC REMOVAL FOR INCREASE...

Flip Chip Interconnect Method and Design For GaAs MMIC Applications

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE...

INTEGRATED CIRCUIT PACKAGE

SOLDERABLE TOP METAL FOR SILICON CARBIDE SEMICONDUCTOR DEVICES