Structure, shape, material or disposition of the bump connectors after the connecting process

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H01L2224/15

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process

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Patents Grantslast 30 patents

Information Patent Grant
Electrode connection structure, lead frame, and method for forming...
- Patent number 10,903,146
- Issue date Jan 26, 2021
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Attachment structure for electronic component accommodation box
- Patent number 10,122,394
- Issue date Nov 6, 2018
- Yazaki Corporation
- Naoyuki Ikeda
- B60 - VEHICLES IN GENERAL
Information Patent Grant
IC structure with angled interconnect elements
- Patent number 9,754,911
- Issue date Sep 5, 2017
- GLOBALFOUNDRIES Inc.
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRODE CONNECTION STRUCTURE, LEAD FRAME, AND METHOD FOR FORMING...
- Publication number 20190103341
- Publication date Apr 4, 2019
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATTACHMENT STRUCTURE FOR ELECTRONIC COMPONENT ACCOMMODATION BOX
- Publication number 20170359093
- Publication date Dec 14, 2017
- YAZAKI CORPORATION
- Naoyuki Ikeda
- B60 - VEHICLES IN GENERAL