Structure, shape, material or disposition of the bump connectors prior to the connecting process

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 12,322,731
- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,283,556
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bumps and method forming same
- Patent number 12,230,595
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure with molding layer
- Patent number 12,218,104
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 12,218,099
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jungsoo Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose IO pads/bumps on semiconductor chips to maximize chip...
- Patent number 12,182,051
- Issue date Dec 31, 2024
- NuConcepts Holdings LLC
- Behzad Bahadori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 12,087,721
- Issue date Sep 10, 2024
- Kyocera Corporation
- Tomonao Kikuchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 12,033,868
- Issue date Jul 9, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of semiconductor devices between stacked substrates
- Patent number 12,009,351
- Issue date Jun 11, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming solder bumps
- Patent number 11,990,437
- Issue date May 21, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate having metal post offset from conductor pad and me...
- Patent number 11,935,822
- Issue date Mar 19, 2024
- Ibiden Co., Ltd.
- Isao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,916,028
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,869,879
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,824,027
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,746
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 11,749,605
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,728,178
- Issue date Aug 15, 2023
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,694,906
- Issue date Jul 4, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable resin film and first protective film forming sheet
- Patent number 11,594,458
- Issue date Feb 28, 2023
- Lintec Corporation
- Akinori Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 11,515,272
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,476,233
- Issue date Oct 18, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 11,393,783
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an optoelectronic component, and optoelectronic...
- Patent number 11,282,991
- Issue date Mar 22, 2022
- OSRAM OLED GmbH
- Siegfried Herrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with three-dimensional structures and support elements to i...
- Patent number 11,276,658
- Issue date Mar 15, 2022
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level low melting temperature interco...
- Patent number 11,222,813
- Issue date Jan 11, 2022
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 11,217,556
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250167145
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMPS AND METHOD FORMING SAME
- Publication number 20250149485
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250140755
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Jungsoo BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES
- Publication number 20250140757
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Channels in Encapsulant...
- Publication number 20240395647
- Publication date Nov 28, 2024
- STATS ChipPAC Pte Ltd.
- Jian Zuo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240369765
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20240321591
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Using A Coreless Signal Distribution Structure
- Publication number 20240186292
- Publication date Jun 6, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240170419
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096811
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Chung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230343603
- Publication date Oct 26, 2023
- Siliconware Precision Industries CO, Ltd
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230343607
- Publication date Oct 26, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE
- Publication number 20230178517
- Publication date Jun 8, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Using A Coreless Signal Distribution Structure
- Publication number 20230103298
- Publication date Apr 6, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20230085696
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MOLDING LAYER
- Publication number 20220384213
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Structure of Stacked and Bonded Semiconductor Device
- Publication number 20220320029
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...
- Publication number 20220246597
- Publication date Aug 4, 2022
- Showa Denko Materials Co., Ltd.
- Tomoaki SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE, PREPARATION METHOD, AND ELECTRONIC DEVICE
- Publication number 20220216171
- Publication date Jul 7, 2022
- Huawei Technologies Co., Ltd
- Chaojun DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20220122938
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20220115296
- Publication date Apr 14, 2022
- Advanced Interconnect Systems Limited
- Haruki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210366878
- Publication date Nov 25, 2021
- Samsung Electronics Co., Ltd.
- Jungsoo BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210343666
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A STEP-SHAPED...
- Publication number 20210287937
- Publication date Sep 16, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20210233815
- Publication date Jul 29, 2021
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Using A Coreless Signal Distribution Structure
- Publication number 20210217732
- Publication date Jul 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INORGANIC DIES WITH ORGANIC INTERCONNECT LAYERS AND RELATED STRUCTURES
- Publication number 20210193519
- Publication date Jun 24, 2021
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210183801
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Ae-nee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20210143021
- Publication date May 13, 2021
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDER-BUMP METALLIZATION COMPONENT
- Publication number 20210118808
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING

Structure, shape, material or disposition of the bump connectors prior to the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package using a coreless signal distribution structure

Package structure

Dummy structure of stacked and bonded semiconductor device

Metal bumps and method forming same

Method for forming chip package structure with molding layer

Interposer and semiconductor package including the same

Multi-purpose IO pads/bumps on semiconductor chips to maximize chip...

Electronic device and method for manufacturing electronic device

Semiconductor die contact structure and method

Electronic package and method for fabricating the same

Plurality of semiconductor devices between stacked substrates

System and method for forming solder bumps

Semiconductor device and method of making a wafer-level chip-scale...

Wiring substrate having metal post offset from conductor pad and me...

Package structure and method of forming the same

Printed circuit board and method of manufacturing the same

Semiconductor package using a coreless signal distribution structure

Semiconductor package

Semiconductor package

Hybrid under-bump metallization component

Method for fabricating electronic package

Semiconductor devices and methods of manufacturing semiconductor de...

Curable resin film and first protective film forming sheet

Semiconductor die contact structure and method

Semiconductor package using a coreless signal distribution structure

Dummy structure of stacked and bonded semiconductor device

Method of producing an optoelectronic component, and optoelectronic...

Devices with three-dimensional structures and support elements to i...

Method of manufacturing wafer level low melting temperature interco...

Packaged microelectronic devices having stacked interconnect elemen...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

METAL BUMPS AND METHOD FORMING SAME

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES

Semiconductor Device and Method of Forming Channels in Encapsulant...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

METHOD FOR FABRICATING ELECTRONIC PACKAGE

Semiconductor Package Using A Coreless Signal Distribution Structure

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

FAN-OUT PACKAGE STRUCTURE

Semiconductor Package Using A Coreless Signal Distribution Structure

Semiconductor Die Contact Structure and Method

METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MOLDING LAYER

Dummy Structure of Stacked and Bonded Semiconductor Device

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...

CHIP PACKAGE STRUCTURE, PREPARATION METHOD, AND ELECTRONIC DEVICE

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A STEP-SHAPED...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Package Using A Coreless Signal Distribution Structure

INORGANIC DIES WITH ORGANIC INTERCONNECT LAYERS AND RELATED STRUCTURES

SEMICONDUCTOR PACKAGE

METHOD FOR FABRICATING ELECTRONIC PACKAGE

HYBRID UNDER-BUMP METALLIZATION COMPONENT