Structure, shape, material or disposition of the high density interconnect connectors after the connecting process

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/23Structure, shape, material or disposition of the high density interconnect connectors after the connecting process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor package structure
- Patent number 12,080,670
- Issue date Sep 3, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch translation architecture for semiconductor package including...
- Patent number 12,051,647
- Issue date Jul 30, 2024
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,855,066
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 11,798,909
- Issue date Oct 24, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch translation architecture for semiconductor package including...
- Patent number 11,705,398
- Issue date Jul 18, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with embedded component carrier
- Patent number 11,410,965
- Issue date Aug 9, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,404,341
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal through vias (TTV)
- Patent number 11,373,922
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,335,672
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch translation architecture for semiconductor package including...
- Patent number 11,270,942
- Issue date Mar 8, 2022
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having electronic component embedded therein
- Patent number 11,183,462
- Issue date Nov 23, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 10,756,054
- Issue date Aug 25, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,741,537
- Issue date Aug 11, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING COOMPANY LTD.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch translation architecture for semiconductor package including...
- Patent number 10,643,945
- Issue date May 5, 2020
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,402,620
- Issue date Sep 3, 2019
- Samsung Electronics Co., Ltd.
- Byung Ho Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resin multilayer substrate and component module
- Patent number 9,936,575
- Issue date Apr 3, 2018
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate interconnect formed through inkjet printing
- Patent number 9,741,664
- Issue date Aug 22, 2017
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out high-density packaging methods and structures
- Patent number 9,287,205
- Issue date Mar 15, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Lei Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in semiconductor element
- Patent number 8,766,440
- Issue date Jul 1, 2014
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20240347457
- Publication date Oct 17, 2024
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240006365
- Publication date Jan 4, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FAN-OUT MEMORY POP STRUCTURE AND PACKAGING METHOD...
- Publication number 20230352451
- Publication date Nov 2, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20230290728
- Publication date Sep 14, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...
- Publication number 20220285241
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20220148968
- Publication date May 12, 2022
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220045025
- Publication date Feb 10, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20200235051
- Publication date Jul 23, 2020
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20190206792
- Publication date Jul 4, 2019
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device With Embedded Component Carrier
- Publication number 20180199438
- Publication date Jul 12, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT HIGH-DENSITY PACKAGING METHODS AND STRUCTURES
- Publication number 20130313699
- Publication date Nov 28, 2013
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT
- Publication number 20120319254
- Publication date Dec 20, 2012
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS

Structure, shape, material or disposition of the high density interconnect connectors after the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor package structure

Package and package-on-package structure having elliptical columns...

Pitch translation architecture for semiconductor package including...

Semiconductor structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Package and package-on-package structure having elliptical columns...

Pitch translation architecture for semiconductor package including...

Electronic device with embedded component carrier

Package and package-on-package structure having elliptical columns...

Semiconductor packages having thermal through vias (TTV)

Semiconductor structure and manufacturing method thereof

Pitch translation architecture for semiconductor package including...

Substrate having electronic component embedded therein

Semiconductor package and method for manufacturing the same

Semiconductor structure and manufacturing method thereof

Pitch translation architecture for semiconductor package including...

Fan-out semiconductor package

Resin multilayer substrate and component module

High density substrate interconnect formed through inkjet printing

Fan-out high-density packaging methods and structures

Wiring board with built-in semiconductor element

Patents Applicationslast 30 patents

PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE

THREE-DIMENSIONAL FAN-OUT MEMORY POP STRUCTURE AND PACKAGING METHOD...

PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...

METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...

PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...

PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...

Electronic Device With Embedded Component Carrier

FAN-OUT HIGH-DENSITY PACKAGING METHODS AND STRUCTURES

WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT