Structure, shape, material or disposition of the layer connectors after the connecting process

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H01L2224/31

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor component and device provided with heat dissipation m...
- Patent number 8,928,148
- Issue date Jan 6, 2015
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents