Structure, shape, material or disposition of the strap connectors prior to the connecting process

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/36Structure, shape, material or disposition of the strap connectors prior to the connecting process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device and power conversion device
- Patent number 11,432,419
- Issue date Aug 30, 2022
- Hitachi Astemo, Ltd.
- Tokihito Suwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power module
- Patent number 11,195,778
- Issue date Dec 7, 2021
- Audi AG
- Andreas Apelsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground strap and method of grounding a plurality of electrically co...
- Patent number 10,993,355
- Issue date Apr 27, 2021
- Federal-Mogul Powertrain LLC
- Julien Deltor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power converter
- Patent number 10,593,609
- Issue date Mar 17, 2020
- Toyota Jidosha Kabushiki Kaisha
- Yuji Nishibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a porous metal layer and an electronic...
- Patent number 10,515,910
- Issue date Dec 24, 2019
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and power conversion device
- Patent number 10,512,181
- Issue date Dec 17, 2019
- Hitachi Automotive Systems, Ltd.
- Tokihito Suwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus, illumination apparatus and display apparatus
- Patent number 10,490,533
- Issue date Nov 26, 2019
- Sony Corporation
- Naoki Hirao
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device and an electronic device
- Patent number 10,453,946
- Issue date Oct 22, 2019
- Renesas Electronics Corporation
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered cooling structure including insulative layer and multiple m...
- Patent number 10,424,528
- Issue date Sep 24, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power module and fabrication method for the same
- Patent number 10,381,244
- Issue date Aug 13, 2019
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carriers and semiconductor devices including redistribution st...
- Patent number 10,366,924
- Issue date Jul 30, 2019
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low leakage ReRAM FPGA configuration cell
- Patent number 10,270,451
- Issue date Apr 23, 2019
- Microsemi SoC Corporation
- John L. McCollum
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Light emitting apparatus, illumination apparatus and display apparatus
- Patent number 10,249,600
- Issue date Apr 2, 2019
- Sony Corporation
- Naoki Hirao
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device
- Patent number 10,236,231
- Issue date Mar 19, 2019
- J-Devices Corporation
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 10,229,893
- Issue date Mar 12, 2019
- Vishay-Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,224,267
- Issue date Mar 5, 2019
- Mitsubishi Electric Corporation
- Shintaro Araki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 10,109,611
- Issue date Oct 23, 2018
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material, bonding method and semiconductor device for elect...
- Patent number 10,043,775
- Issue date Aug 7, 2018
- Mitsubishi Electric Corporation
- Koji Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device and power conversion device
- Patent number 10,034,401
- Issue date Jul 24, 2018
- Hitachi Automotive Systems, Ltd.
- Tokihito Suwa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Bonding structure and method
- Patent number 9,997,485
- Issue date Jun 12, 2018
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and an electronic device
- Patent number 9,997,620
- Issue date Jun 12, 2018
- Renesas Electronics Corporation
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack die package
- Patent number 9,966,330
- Issue date May 8, 2018
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and a method of manufacturing the same
- Patent number 9,961,798
- Issue date May 1, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and inspecting an el...
- Patent number 9,905,482
- Issue date Feb 27, 2018
- Renesas Electronics Corporation
- Toshitsugu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,899,336
- Issue date Feb 20, 2018
- Mitsubishi Electric Corporation
- Takanobu Kajihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode terminal, semiconductor device for electrical power, and...
- Patent number 9,899,345
- Issue date Feb 20, 2018
- MITSUBISHI ELECTRIC COOPERATION
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method for the same
- Patent number 9,881,812
- Issue date Jan 30, 2018
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having a conductor member for reducing thermal...
- Patent number 9,853,009
- Issue date Dec 26, 2017
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing semiconductor module
- Patent number 9,847,237
- Issue date Dec 19, 2017
- Toyota Jidosha Kabushiki Kaisha
- Youichiro Baba
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Power converter device having coolant flow paths
- Patent number 9,831,799
- Issue date Nov 28, 2017
- Hitachi Automotive Systems, Ltd.
- Shuichi Shinohara
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Power Semiconductor Device and Power Conversion Device
- Publication number 20200068735
- Publication date Feb 27, 2020
- Hitachi Automotive Systems, Ltd.
- Tokihito SUWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS, ILLUMINATION APPARATUS AND DISPLAY APPARATUS
- Publication number 20190221551
- Publication date Jul 18, 2019
- SONY CORPORATION
- Naoki Hirao
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
ELECTRONIC POWER MODULE
- Publication number 20180358282
- Publication date Dec 13, 2018
- Audi AG
- Andreas APELSMEIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Power Conversion Device
- Publication number 20180303001
- Publication date Oct 18, 2018
- Hitachi Automotive Systems, Ltd.
- Tokihito SUWA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND AN ELECTRONIC DEVICE
- Publication number 20180261690
- Publication date Sep 13, 2018
- RENESAS ELECTRONICS CORPORATION
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD FOR THE SAME
- Publication number 20180090338
- Publication date Mar 29, 2018
- ROHM CO., LTD.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180047698
- Publication date Feb 15, 2018
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
- Publication number 20180012859
- Publication date Jan 11, 2018
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD
- Publication number 20170352635
- Publication date Dec 7, 2017
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIERS AND SEMICONDUCTOR DEVICES INCLUDING REDISTRIBUTION ST...
- Publication number 20170345714
- Publication date Nov 30, 2017
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170338159
- Publication date Nov 23, 2017
- RENESAS ELECTRONICS CORPORATION
- Toshitsugu Ishii
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170301599
- Publication date Oct 19, 2017
- J-DEVICES CORPORATION
- Takeshi MIYAKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20170271304
- Publication date Sep 21, 2017
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR HIGH/LOW VOLTAGE INSULATION
- Publication number 20140374629
- Publication date Dec 25, 2014
- Industrial Technology Research Institute
- Shin-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20140370661
- Publication date Dec 18, 2014
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND AN ELECTRONIC DEVICE
- Publication number 20140367739
- Publication date Dec 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONTROL DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20140361419
- Publication date Dec 11, 2014
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND DRIVING DEVICE FOR SWITCHING ELEMENT
- Publication number 20140346635
- Publication date Nov 27, 2014
- DENSO CORPORATION
- Hideki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20140347838
- Publication date Nov 27, 2014
- DENSO CORPORATION
- Toshihiro NAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Semiconductor Package
- Publication number 20140346637
- Publication date Nov 27, 2014
- Alexander Komposch
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BONDING STRUCTURE AND METHOD
- Publication number 20140335660
- Publication date Nov 13, 2014
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SELF PROTECTION OF POWER DEVICE WITH EXPAN...
- Publication number 20140334052
- Publication date Nov 13, 2014
- Francois Hebert
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20140332939
- Publication date Nov 13, 2014
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power module with cooling structure on bonding substrate for coolin...
- Publication number 20140327127
- Publication date Nov 6, 2014
- Wolfram HABLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Power Device Having a Heat Sink
- Publication number 20140312360
- Publication date Oct 23, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating Multi-Output Power Converters Having Vertically Stacked...
- Publication number 20140306332
- Publication date Oct 16, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20140299979
- Publication date Oct 9, 2014
- RENESAS ELECTRONICS CORPORATION
- Tadatoshi DANNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING CONTACT WITH A SEMICONDUCTOR AND CONTACT ARRANGEM...
- Publication number 20140299998
- Publication date Oct 9, 2014
- Eckart Geinitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140301039
- Publication date Oct 9, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140284803
- Publication date Sep 25, 2014
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Structure, shape, material or disposition of the strap connectors prior to the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor device and power conversion device

Electronic power module

Ground strap and method of grounding a plurality of electrically co...

Semiconductor device and power converter

Semiconductor device having a porous metal layer and an electronic...

Power semiconductor device and power conversion device

Light emitting apparatus, illumination apparatus and display apparatus

Semiconductor device and an electronic device

Layered cooling structure including insulative layer and multiple m...

Power module and fabrication method for the same

Chip carriers and semiconductor devices including redistribution st...

Low leakage ReRAM FPGA configuration cell

Light emitting apparatus, illumination apparatus and display apparatus

Semiconductor device

Dual lead frame semiconductor package and method of manufacture

Semiconductor device

Semiconductor device

Bonding material, bonding method and semiconductor device for elect...

Power semiconductor device and power conversion device

Bonding structure and method

Semiconductor device and an electronic device

Stack die package

Package and a method of manufacturing the same

Method of manufacturing a semiconductor device and inspecting an el...

Semiconductor device

Electrode terminal, semiconductor device for electrical power, and...

Power module and fabrication method for the same

Semiconductor module having a conductor member for reducing thermal...

Method and apparatus for manufacturing semiconductor module

Power converter device having coolant flow paths

Patents Applicationslast 30 patents

Power Semiconductor Device and Power Conversion Device

LIGHT EMITTING APPARATUS, ILLUMINATION APPARATUS AND DISPLAY APPARATUS

ELECTRONIC POWER MODULE

Power Semiconductor Device and Power Conversion Device

SEMICONDUCTOR DEVICE AND AN ELECTRONIC DEVICE

POWER MODULE AND FABRICATION METHOD FOR THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP

BONDING STRUCTURE AND METHOD

CHIP CARRIERS AND SEMICONDUCTOR DEVICES INCLUDING REDISTRIBUTION ST...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Dual Lead Frame Semiconductor Package and Method of Manufacture

POWER MODULE FOR HIGH/LOW VOLTAGE INSULATION

Dual Lead Frame Semiconductor Package and Method of Manufacture

SEMICONDUCTOR DEVICE AND AN ELECTRONIC DEVICE

POWER CONTROL DEVICE AND PREPARATION METHOD THEREOF

SEMICONDUCTOR MODULE AND DRIVING DEVICE FOR SWITCHING ELEMENT

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

Hybrid Semiconductor Package

BONDING STRUCTURE AND METHOD

STRUCTURE AND METHOD FOR SELF PROTECTION OF POWER DEVICE WITH EXPAN...

Dual Lead Frame Semiconductor Package and Method of Manufacture

Power module with cooling structure on bonding substrate for coolin...

Semiconductor Power Device Having a Heat Sink

Integrating Multi-Output Power Converters Having Vertically Stacked...

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...

METHOD FOR MAKING CONTACT WITH A SEMICONDUCTOR AND CONTACT ARRANGEM...

PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF