Structure, shape, material or disposition of the wire connectors after the connecting process

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including stacked dies with interleaved wire...
- Patent number 12,136,607
- Issue date Nov 5, 2024
- Micron Technology, Inc.
- Koichi Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic quantum computer assembly
- Patent number 11,892,693
- Issue date Feb 6, 2024
- PSIQUANTUM, CORP.
- Gabriel J. Mendoza
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,764,131
- Issue date Sep 19, 2023
- ABLIC Inc.
- Koji Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum computing die assembly with thru-silicon vias
- Patent number 11,550,108
- Issue date Jan 10, 2023
- PSIQUANTUM, CORP.
- Gabriel J. Mendoza
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for integrating current sensors in a power sem...
- Patent number 11,531,075
- Issue date Dec 20, 2022
- Wisconsin Alumni Research Foundation
- Robert D. Lorenz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic quantum computer assembly having dies with specific contac...
- Patent number 11,493,713
- Issue date Nov 8, 2022
- PSIQUANTUM, CORP.
- Gabriel J. Mendoza
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Quantum computing die assembly with thru-silicon vias and connected...
- Patent number 11,493,714
- Issue date Nov 8, 2022
- PSIQUANTUM, CORP.
- Gabriel J. Mendoza
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Module assembly
- Patent number 11,127,665
- Issue date Sep 21, 2021
- Qorvo US, Inc.
- Deep C. Dumka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for integrating current sensors in a power sem...
- Patent number 11,085,977
- Issue date Aug 10, 2021
- Wisconsin Alumni Research Foundation
- Robert D. Lorenz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module
- Patent number 10,950,561
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Hyung Mi Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage determination device
- Patent number 10,877,078
- Issue date Dec 29, 2020
- Keihin Corporation
- Yuzuru Takashima
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Isolator with symmetric multi-channel layout
- Patent number 10,699,995
- Issue date Jun 30, 2020
- Silicon Laboratories Inc.
- Michael R. May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including first and second metal oxide semicon...
- Patent number 10,636,906
- Issue date Apr 28, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomonari Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires
- Patent number 10,490,528
- Issue date Nov 26, 2019
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module assembly
- Patent number 10,403,568
- Issue date Sep 3, 2019
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED light-emitting assembly, LED light-emitting panel, and LED disp...
- Patent number 10,388,638
- Issue date Aug 20, 2019
- Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Binding wire and semiconductor package structure using the same
- Patent number 9,960,141
- Issue date May 1, 2018
- Beijing FUNATE Innovation Technology Co., Ltd.
- Yu-Quan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, method for manufacturing the same, electro...
- Patent number 9,786,616
- Issue date Oct 10, 2017
- Seiko Epson Corporation
- Kazunobu Kuwazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module
- Patent number 9,253,386
- Issue date Feb 2, 2016
- Taiyo Yuden Co., Ltd.
- Masashi Miyazaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring substrate and semiconductor package
- Patent number 9,192,049
- Issue date Nov 17, 2015
- Shinko Electric Industries Co., Ltd.
- Tatsuaki Denda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE...
- Publication number 20250029957
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Koichi Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE...
- Publication number 20230061258
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Koichi Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220238418
- Publication date Jul 28, 2022
- ABLIC Inc.
- Koji TSUKAGOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Integrating Current Sensors in a Power Sem...
- Publication number 20210364581
- Publication date Nov 25, 2021
- Wisconsin Alumni Research Foundation
- Robert D. Lorenz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE
- Publication number 20200091095
- Publication date Mar 19, 2020
- Samsung Electronics Co., Ltd.
- Hyung Mi JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR WITH SYMMETRIC MULTI-CHANNEL LAYOUT
- Publication number 20190348355
- Publication date Nov 14, 2019
- Silicon Laboratories Inc.
- Michael R. May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE ASSEMBLY
- Publication number 20190341343
- Publication date Nov 7, 2019
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING AN OPTOELECTRONIC...
- Publication number 20180254385
- Publication date Sep 6, 2018
- Osram Opto Semiconductors GmbH
- Thomas Kippes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE ASSEMBLY
- Publication number 20180122735
- Publication date May 3, 2018
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE
- Publication number 20140253794
- Publication date Sep 11, 2014
- Taiyo Yuden Co., Ltd.
- Masashi MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS

Structure, shape, material or disposition of the wire connectors after the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module and power conversion apparatus

Semiconductor devices including stacked dies with interleaved wire...

Photonic quantum computer assembly

Semiconductor device and manufacturing method thereof

Quantum computing die assembly with thru-silicon vias

Method and apparatus for integrating current sensors in a power sem...

Photonic quantum computer assembly having dies with specific contac...

Quantum computing die assembly with thru-silicon vias and connected...

Module assembly

Method and apparatus for integrating current sensors in a power sem...

Antenna module

Voltage determination device

Isolator with symmetric multi-channel layout

Semiconductor device including first and second metal oxide semicon...

Embedded wire bond wires

Module assembly

LED light-emitting assembly, LED light-emitting panel, and LED disp...

Binding wire and semiconductor package structure using the same

Semiconductor apparatus, method for manufacturing the same, electro...

Camera module

Wiring substrate and semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE...

SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Method and Apparatus for Integrating Current Sensors in a Power Sem...

ANTENNA MODULE

ISOLATOR WITH SYMMETRIC MULTI-CHANNEL LAYOUT

MODULE ASSEMBLY

OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING AN OPTOELECTRONIC...

MODULE ASSEMBLY

CAMERA MODULE