Structure, shape, material or disposition of the wire connectors prior to the connecting process

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electro-optical package and method of fabrication
- Patent number 12,165,944
- Issue date Dec 10, 2024
- Rockley Photonics Limited
- Shuhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package with connection lug
- Patent number 12,125,772
- Issue date Oct 22, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacked fan-out packaging structure and method ma...
- Patent number 12,113,045
- Issue date Oct 8, 2024
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 11,004,821
- Issue date May 11, 2021
- Shinkawa Ltd.
- Yusuke Maruya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting apparatus and method of manufacturing light emitting...
- Patent number 10,727,144
- Issue date Jul 28, 2020
- SNY CORPORATION
- Masahiro Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires
- Patent number 10,490,528
- Issue date Nov 26, 2019
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having plate-shaped metal terminals facing one...
- Patent number 10,468,387
- Issue date Nov 5, 2019
- Kabushiki Kaisha Toshiba
- Wataru Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package module
- Patent number 10,403,562
- Issue date Sep 3, 2019
- Samsung Electronics Co., Ltd.
- Yong Ho Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a microelectronic device structure, and related...
- Patent number 10,136,520
- Issue date Nov 20, 2018
- Quartzdyne, Inc.
- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Binding wire and semiconductor package structure using the same
- Patent number 9,960,141
- Issue date May 1, 2018
- Beijing FUNATE Innovation Technology Co., Ltd.
- Yu-Quan Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL STACKED FAN-OUT PACKAGING STRUCTURE AND METHOD MA...
- Publication number 20220271003
- Publication date Aug 25, 2022
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OPTICAL PACKAGE AND METHOD OF FABRICATION
- Publication number 20220189841
- Publication date Jun 16, 2022
- ROCKLEY PHOTONICS LIMITED
- Shuhe LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PLATE-SHAPED METAL TERMINALS FACING ONE...
- Publication number 20190295991
- Publication date Sep 26, 2019
- Kabushiki Kaisha Toshiba
- Wataru Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING APPARATUS
- Publication number 20190287941
- Publication date Sep 19, 2019
- SHINKAWA LTD.
- Yusuke MARUYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE MODULE
- Publication number 20190131212
- Publication date May 2, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Ho BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD OF MANUFACTURING LIGHT EMITTING...
- Publication number 20190035700
- Publication date Jan 31, 2019
- SONY CORPORATION
- MASAHIRO MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH WETTABLE SIDES AND METHOD OF MANUFACTURING SAME
- Publication number 20150076675
- Publication date Mar 19, 2015
- STMicroelectronics, Inc.
- Rogelio Real
- H01 - BASIC ELECTRIC ELEMENTS

Structure, shape, material or disposition of the wire connectors prior to the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electro-optical package and method of fabrication

Method of forming a semiconductor package with connection lug

Three-dimensional stacked fan-out packaging structure and method ma...

Wire bonding method and wire bonding apparatus

Coated wire

Light emitting apparatus and method of manufacturing light emitting...

Embedded wire bond wires

Semiconductor device having plate-shaped metal terminals facing one...

Fan-out semiconductor package module

Methods of forming a microelectronic device structure, and related...

Binding wire and semiconductor package structure using the same

Patents Applicationslast 30 patents

THREE-DIMENSIONAL STACKED FAN-OUT PACKAGING STRUCTURE AND METHOD MA...

ELECTRO-OPTICAL PACKAGE AND METHOD OF FABRICATION

SEMICONDUCTOR DEVICE HAVING PLATE-SHAPED METAL TERMINALS FACING ONE...

WIRE BONDING METHOD AND WIRE BONDING APPARATUS

FAN-OUT SEMICONDUCTOR PACKAGE MODULE

LIGHT EMITTING APPARATUS AND METHOD OF MANUFACTURING LIGHT EMITTING...

LEADFRAME PACKAGE WITH WETTABLE SIDES AND METHOD OF MANUFACTURING SAME