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H01L2224/0601

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0601Structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,887,950
- Issue date Jan 30, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takuya Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure and method of fabricating the same
- Patent number 10,879,214
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual bond pad structure for photonics
- Patent number 10,476,227
- Issue date Nov 12, 2019
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing contact areas on a semiconductor substrate
- Patent number 10,332,850
- Issue date Jun 25, 2019
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,024,907
- Issue date Jul 17, 2018
- TOSHIBA MEMORY CORPORATION
- Shinya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for self-aligned solder reflow bonding and devices obtained...
- Patent number 9,978,710
- Issue date May 22, 2018
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with air-gap structure
- Patent number 9,960,142
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a TSV, a front-side bumping pad, and a...
- Patent number 9,806,004
- Issue date Oct 31, 2017
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air trench in packages incorporating hybrid bonding
- Patent number 9,786,628
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,577,032
- Issue date Feb 21, 2017
- Fuji Electric Co., Ltd.
- Kenichi Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air trench in packages incorporating hybrid bonding
- Patent number 9,502,396
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with air-gap structure
- Patent number 9,312,229
- Issue date Apr 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,117,879
- Issue date Aug 25, 2015
- Taiwan Semiconductor Manufacturing Company Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack arrest vias for IC devices
- Patent number 8,304,867
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Robert Fabian McCarthy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347487
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUI...
- Publication number 20240105643
- Publication date Mar 28, 2024
- Canon Kabushiki Kaisha
- Takeru Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006357
- Publication date Jan 4, 2024
- Rohm Co., Ltd.
- Takayuki OSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220328439
- Publication date Oct 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- Myong Soo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20220005776
- Publication date Jan 6, 2022
- Sony Semiconductor Solutions Corporation
- TAKUYA NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL BOND PAD STRUCTURE FOR PHOTONICS
- Publication number 20200014171
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Jeffrey P. GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELF-ALIGNED SOLDER REFLOW BONDING AND DEVICES OBTAINED...
- Publication number 20170194283
- Publication date Jul 6, 2017
- IMEC vzw
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL BOND PAD STRUCTURE FOR PHOTONICS
- Publication number 20170125974
- Publication date May 4, 2017
- International Business Machines Corporation
- Jeffrey P. GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding with Air-Gap Structure
- Publication number 20160197049
- Publication date Jul 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH AIR-GAP STRUCTURE
- Publication number 20150364434
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA UNDER THE INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20150228594
- Publication date Aug 13, 2015
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150214168
- Publication date Jul 30, 2015
- Siliconware Precision Industries Co., Ltd.
- Cheng-An Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150187636
- Publication date Jul 2, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- CHENG-YING HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150001688
- Publication date Jan 1, 2015
- Fuji Electric Co., Ltd.
- Kenichi IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Contact Areas on a Semiconductor Substrate
- Publication number 20140374919
- Publication date Dec 25, 2014
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Trench in Packages Incorporating Hybrid Bonding
- Publication number 20140264948
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK ARREST VIAS FOR IC DEVICES
- Publication number 20120104604
- Publication date May 3, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Robert Fabian McCarthy
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solid-state imaging device and electronic apparatus

Die stack structure and method of fabricating the same

Dual bond pad structure for photonics

Method for producing contact areas on a semiconductor substrate

Semiconductor device and manufacturing method of semiconductor device

Method for self-aligned solder reflow bonding and devices obtained...

Hybrid bonding with air-gap structure

Semiconductor devices having a TSV, a front-side bumping pad, and a...

Air trench in packages incorporating hybrid bonding

Semiconductor device

Air trench in packages incorporating hybrid bonding

Hybrid bonding with air-gap structure

Semiconductor device and manufacturing method thereof

Crack arrest vias for IC devices

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUI...

SEMICONDUCTOR DEVICE

DISPLAY DEVICE

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

DUAL BOND PAD STRUCTURE FOR PHOTONICS

METHOD FOR SELF-ALIGNED SOLDER REFLOW BONDING AND DEVICES OBTAINED...

DUAL BOND PAD STRUCTURE FOR PHOTONICS

Hybrid Bonding with Air-Gap Structure

HYBRID BONDING WITH AIR-GAP STRUCTURE

VIA UNDER THE INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES

SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

Method for Producing Contact Areas on a Semiconductor Substrate

Air Trench in Packages Incorporating Hybrid Bonding

CRACK ARREST VIAS FOR IC DEVICES