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  • H01L2224/45541
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45541Structure
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290743
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • G01 - MEASURING TESTING
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290745
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • G01 - MEASURING TESTING
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240266313
    • Publication date Aug 8, 2024
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tomohiro UNO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT
    • Publication number 20240258288
    • Publication date Aug 1, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Makoto Shibuya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE INCLUDING BONDING COVERS
    • Publication number 20230343739
    • Publication date Oct 26, 2023
    • Semiconductor Components Industries, LLC
    • Wuxing Xia
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230335528
    • Publication date Oct 19, 2023
    • NIPPON MICROMETAL COPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230215834
    • Publication date Jul 6, 2023
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COAXIAL WIRE
    • Publication number 20190385969
    • Publication date Dec 19, 2019
    • The Charles Stark Draper Laboratory, Inc.
    • Caprice Gray Haley
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20180133843
    • Publication date May 17, 2018
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170365576
    • Publication date Dec 21, 2017
    • NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
    • Tetsuya OYAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170216974
    • Publication date Aug 3, 2017
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170040281
    • Publication date Feb 9, 2017
    • NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
    • Tetsuya OYAMADA
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20160315063
    • Publication date Oct 27, 2016
    • NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
    • Tomohiro UNO
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BINDING WIRE AND SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME
    • Publication number 20150311174
    • Publication date Oct 29, 2015
    • BEIJING FUNATE INNOVATION TECHNOLOGY CO., LTD.
    • YU-QUAN WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ALUMINUM COATED COPPER BOND WIRE AND METHOD OF MAKING THE SAME
    • Publication number 20150155252
    • Publication date Jun 4, 2015
    • HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
    • Eugen Milke
    • B32 - LAYERED PRODUCTS