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H01L2224/4901

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4901Structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,136,589
- Issue date Nov 5, 2024
- Rohm Co., Ltd.
- Yoshizo Osumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die, vertical-wire package-in-package apparatus, and methods...
- Patent number 11,749,653
- Issue date Sep 5, 2023
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multi-tier bonding wires and component...
- Patent number 11,257,780
- Issue date Feb 22, 2022
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multi-tier bonding wires and component...
- Patent number 10,847,488
- Issue date Nov 24, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,629,519
- Issue date Apr 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,791
- Issue date Dec 25, 2018
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378018
- Publication date Nov 23, 2023
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220068776
- Publication date Mar 3, 2022
- ROHM CO., LTD.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE, VERTICAL-WIRE PACKAGE-IN-PACKAGE APPARATUS, AND METHODS...
- Publication number 20210288034
- Publication date Sep 16, 2021
- Intel Corporation
- Hyoung IL Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTI-TIER BONDING WIRES AND COMPONENT...
- Publication number 20200235069
- Publication date Jul 23, 2020
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTI-TIER BONDING WIRES AND COMPONENT...
- Publication number 20180166414
- Publication date Jun 14, 2018
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180158771
- Publication date Jun 7, 2018
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180151478
- Publication date May 31, 2018
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Multi-die, vertical-wire package-in-package apparatus, and methods...

Semiconductor package having multi-tier bonding wires and component...

Semiconductor package having multi-tier bonding wires and component...

Semiconductor device package and method of manufacturing the same

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MULTI-DIE, VERTICAL-WIRE PACKAGE-IN-PACKAGE APPARATUS, AND METHODS...

SEMICONDUCTOR PACKAGE HAVING MULTI-TIER BONDING WIRES AND COMPONENT...

SEMICONDUCTOR PACKAGE HAVING MULTI-TIER BONDING WIRES AND COMPONENT...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME