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H01L2224/3201

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/3201Structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fault tolerant memory systems and components with interconnected an...
- Patent number 12,216,543
- Issue date Feb 4, 2025
- RAMBUS INC.
- Kenneth L. Wright
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and related methods
- Patent number 12,211,771
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for preparing the same
- Patent number 12,205,912
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,183,866
- Issue date Dec 31, 2024
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,087,757
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive film adhesive
- Patent number 12,053,934
- Issue date Aug 6, 2024
- Ormet Circuits, Inc.
- Catherine A. Shearer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Display device including connection pad part and electronic compone...
- Patent number 12,057,430
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor arrangement
- Patent number 11,955,450
- Issue date Apr 9, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
- Patent number 11,948,913
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for preparing the same
- Patent number 11,876,063
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including adhesive film with conductive ball
- Patent number 11,824,034
- Issue date Nov 21, 2023
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure
- Patent number 11,817,437
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,735,576
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,728,327
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 11,710,719
- Issue date Jul 25, 2023
- Sumitomo Electric Device Innovations, Inc.
- Taketo Kawano
- G02 - OPTICS
Information Patent Grant
Fault tolerant memory systems and components with interconnected an...
- Patent number 11,709,736
- Issue date Jul 25, 2023
- RAMBUS INC.
- Kenneth L. Wright
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-cure and cure hybrid film-on-die for embedded controller die
- Patent number 11,699,685
- Issue date Jul 11, 2023
- Western Digital Technologies, Inc.
- Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing the same
- Patent number 11,688,712
- Issue date Jun 27, 2023
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 11,658,137
- Issue date May 23, 2023
- Chengwei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and related methods
- Patent number 11,652,030
- Issue date May 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device including RGB light emitting diodes and phosphor
- Patent number 11,605,762
- Issue date Mar 14, 2023
- Seoul Semiconductor Co., Ltd.
- Chung-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 11,532,594
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20250022770
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Fu-Yuan SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022842
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Ilbok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL
- Publication number 20250022829
- Publication date Jan 16, 2025
- AJINOMOTO CO., INC.
- Ichiro OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Packaging Stacking Flip Chip
- Publication number 20250006692
- Publication date Jan 2, 2025
- HEBEI BEIXIN SEMICONDUCTOR TECHNOLOGY CO., LTD
- Honglei RAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429116
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seoung Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTER BONDING SHEET
- Publication number 20240413116
- Publication date Dec 12, 2024
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...
- Publication number 20240404853
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Hau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...
- Publication number 20240376348
- Publication date Nov 14, 2024
- TORAY INDUSTRIES, INC.
- Yukari ARIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240371851
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE...
- Publication number 20240363567
- Publication date Oct 31, 2024
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321808
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kazuki MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A TERMINAL ELEMENT, TERMINAL ELEMENT, AND POWER...
- Publication number 20240266260
- Publication date Aug 8, 2024
- InfineonTechnologies AG
- Olaf Rüdiger Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258188
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Shoji SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...
- Publication number 20240258372
- Publication date Aug 1, 2024
- INFINEON TECHNOLOGIES AG
- Sebastian POLSTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240227089
- Publication date Jul 11, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING
- Publication number 20240222216
- Publication date Jul 4, 2024
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240203927
- Publication date Jun 20, 2024
- KIOXIA Corporation
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178082
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178083
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240131633
- Publication date Apr 25, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL TRANSMISSION DEVICE
- Publication number 20240128309
- Publication date Apr 18, 2024
- DENSO CORPORATION
- Shuji ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...
- Publication number 20240096845
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...
- Publication number 20240071963
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yun Ting Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240047394
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240047331
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240047333
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
- Publication number 20240038795
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fault tolerant memory systems and components with interconnected an...

Reliable semiconductor packages

Power module and related methods

Semiconductor package structure and method for preparing the same

Package structure

Display device using micro LED, and manufacturing method therefor

Integrated fan-out package and the methods of manufacturing

Connection structure and manufacturing method therefor

Integrated circuit packages

Conductive film adhesive

Display device including connection pad part and electronic compone...

Method for producing a semiconductor arrangement

Semiconductor package including a dummy pad

Semiconductor package structure and method for preparing the same

Display device including adhesive film with conductive ball

Method of forming package structure

Light emitting diode display with redundancy scheme

Integrated circuit package and method

Integrated circuit package and method

Method for manufacturing electronic device

Fault tolerant memory systems and components with interconnected an...

Thermocompression bond tips and related apparatus and methods

Non-cure and cure hybrid film-on-die for embedded controller die

Semiconductor arrangement and method for producing the same

Memory devices with controllers under memory packages and associate...

Semiconductor package

Power module and related methods

Semiconductor device and method for manufacturing the same

Light emitting device including RGB light emitting diodes and phosphor

Integrated fan-out package and the methods of manufacturing

Patents Applicationslast 30 patents

POWER MODULE STRUCTURE

SEMICONDUCTOR PACKAGE

UNDERFILL MATERIAL

Method for Packaging Stacking Flip Chip

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SINTER BONDING SHEET

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...

INTEGRATED CIRCUIT PACKAGES

RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE...

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING A TERMINAL ELEMENT, TERMINAL ELEMENT, AND POWER...

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

SIGNAL TRANSMISSION DEVICE

CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME

WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...

WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE