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H01L2224/2401

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2401Structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device structure with composite bottle-shaped through...
- Patent number 12,159,852
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Hui Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 12,148,732
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,113,022
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package structure
- Patent number 12,080,670
- Issue date Sep 3, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, endoscope, and method for manufacturing semic...
- Patent number 12,033,975
- Issue date Jul 9, 2024
- Olympus Corporation
- Keiichi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having plurality of light emitting elements between...
- Patent number 12,033,993
- Issue date Jul 9, 2024
- Samsung Display Co., Ltd.
- Yong Hoon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 11,978,714
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrodes for light emitting element of a display device
- Patent number 11,967,585
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Bum Soo Kam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,948,891
- Issue date Apr 2, 2024
- NEPES CO., LTD.
- Sang Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die and package structure
- Patent number 11,948,904
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,894,336
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric stackup structure for SoC package substrates
- Patent number 11,862,597
- Issue date Jan 2, 2024
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure using metal bridges to interconne...
- Patent number 11,810,895
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,810,883
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 11,798,909
- Issue date Oct 24, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,791,447
- Issue date Oct 17, 2023
- Samsung Display Co., Ltd.
- Hyun Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process including a re-etching process for forming a semiconductor...
- Patent number 11,742,317
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,735,555
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component-embedded substrate and method of making the same
- Patent number 11,735,560
- Issue date Aug 22, 2023
- Shinko Electric Industries Co., Ltd.
- Yoichi Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including electrical connections on an encapsulat...
- Patent number 11,676,928
- Issue date Jun 13, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel and display device including the same
- Patent number 11,626,428
- Issue date Apr 11, 2023
- Samsung Display Co., Ltd.
- Hae Ju Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,587,902
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly and method therefor
- Patent number 11,557,565
- Issue date Jan 17, 2023
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with different electrodes and light emitting elements
- Patent number 11,552,063
- Issue date Jan 10, 2023
- Samsung Display Co., Ltd.
- Kyung Bae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless transmission module and manufacturing method
- Patent number 11,538,774
- Issue date Dec 27, 2022
- Huawei Technologies Co., Ltd.
- Qijing He
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413115
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Ling YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387450
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240387434
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240371776
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332215
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...
- Publication number 20240282740
- Publication date Aug 22, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Matthew Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
- Publication date Aug 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...
- Publication number 20240258261
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BONDING STRUCTURES
- Publication number 20240203923
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND PACKAGE STRUCTURE
- Publication number 20240203924
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL POCKET FANOUT PACKAGE
- Publication number 20240194545
- Publication date Jun 13, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186283
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric Stackup Structure for SoC Package Substrates
- Publication number 20240162182
- Publication date May 16, 2024
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...
- Publication number 20240145363
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS
- Publication number 20240113063
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Udit RAWAT
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHO...
- Publication number 20240096849
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047288
- Publication date Feb 8, 2024
- InnoLux Corporation
- Sheng-Nan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240030186
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240006365
- Publication date Jan 4, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THRO...
- Publication number 20240006366
- Publication date Jan 4, 2024
- Intel Corporation
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230402358
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230369273
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
- Publication number 20230352442
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE BOTTLE-SHAPED THROUGH...
- Publication number 20230352433
- Publication date Nov 2, 2023
- NANYA TECHNOLOGY CORPORATION
- SHENG-HUI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE BOTTLE-SHAPED THROUGH...
- Publication number 20230352434
- Publication date Nov 2, 2023
- NANYA TECHNOLOGY CORPORATION
- SHENG-HUI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
- Publication number 20230343668
- Publication date Oct 26, 2023
- UTAC Headquarters Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH INTEGRATED OFF-DIE INDUCTOR
- Publication number 20230268306
- Publication date Aug 24, 2023
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME
- Publication number 20230245992
- Publication date Aug 3, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187402
- Publication date Jun 15, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Wen-Chang CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device structure with composite bottle-shaped through...

Package structure and method of fabrcating the same

Semiconductor package and manufacturing method of semiconductor pac...

Manufacturing method of semiconductor package structure

Package structure and method of forming the same

Package and package-on-package structure having elliptical columns...

Semiconductor device, endoscope, and method for manufacturing semic...

Display device having plurality of light emitting elements between...

Semiconductor packages using package in package systems and related...

Encapsulated package including device dies connected via interconne...

Electrodes for light emitting element of a display device

Semiconductor package and manufacturing method thereof

Die and package structure

Integrated fan-out package and manufacturing method thereof

Asymmetric stackup structure for SoC package substrates

Electrical interconnect structure using metal bridges to interconne...

Package structure

Semiconductor package structure and manufacturing method thereof

Display device

Light emitting diode display with redundancy scheme

Package and package-on-package structure having elliptical columns...

Process including a re-etching process for forming a semiconductor...

Manufacturing method of semiconductor structure

Electronic-component-embedded substrate and method of making the same

Electronic device including electrical connections on an encapsulat...

Pixel and display device including the same

Semiconductor structure and method of forming the same

Semiconductor device assembly and method therefor

Display device with different electrodes and light emitting elements

Wireless transmission module and manufacturing method

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...

METHODS OF FORMING BONDING STRUCTURES

DIE AND PACKAGE STRUCTURE

METAL POCKET FANOUT PACKAGE

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

Asymmetric Stackup Structure for SoC Package Substrates

FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...

RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS

SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHO...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE

MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THRO...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

Process Including a Re-etching Process for Forming a Semiconductor...

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE BOTTLE-SHAPED THROUGH...

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE BOTTLE-SHAPED THROUGH...

Semiconductor Packages and Methods of Forming RDL and Side and Back...

CHIP PACKAGE WITH INTEGRATED OFF-DIE INDUCTOR

INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF