Structure

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CPC
H01L2224/0901

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0901Structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming high routing density int...
- Patent number 10,580,749
- Issue date Mar 3, 2020
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-resilient chip structure and dicing process
- Patent number 10,211,175
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with air-gap structure
- Patent number 9,960,142
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow-cavity flip-chip package with reinforced interconnects and p...
- Patent number 9,793,237
- Issue date Oct 17, 2017
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air trench in packages incorporating hybrid bonding
- Patent number 9,786,628
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air trench in packages incorporating hybrid bonding
- Patent number 9,502,396
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin semiconductor device and preparation method thereof
- Patent number 9,337,127
- Issue date May 10, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods of forming the same
- Patent number 9,324,668
- Issue date Apr 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Luan C. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with air-gap structure
- Patent number 9,312,229
- Issue date Apr 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic unit and package with positional reversal
- Patent number 9,219,050
- Issue date Dec 22, 2015
- Invensas Corporation
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stacked package
- Patent number 9,208,827
- Issue date Dec 8, 2015
- SK Hynix Inc.
- Ki Yong Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Ultra-thin semiconductor device and preparation method thereof
- Patent number 9,117,809
- Issue date Aug 25, 2015
- Alpha & Omega Semiconductor (Cayman), Ltd.
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING...
- Publication number 20230402416
- Publication date Dec 14, 2023
- Airoha Technology (HK) Limited
- Huan-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND P...
- Publication number 20170110434
- Publication date Apr 20, 2017
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH AIR-GAP STRUCTURE
- Publication number 20150364434
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150333024
- Publication date Nov 19, 2015
- Hitachi Ltd.
- Hisashi TANIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structures and Methods of Forming the Same
- Publication number 20150318250
- Publication date Nov 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Luan C. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACKED PACKAGE
- Publication number 20150302900
- Publication date Oct 22, 2015
- SK HYNIX INC.
- Ki Yong LEE
- G11 - INFORMATION STORAGE
Information Patent Application
ULTRA-THIN SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20150255377
- Publication date Sep 10, 2015
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC UNIT AND PACKAGE WITH POSITIONAL REVERSAL
- Publication number 20150214178
- Publication date Jul 30, 2015
- Invensas Corporation
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150130085
- Publication date May 14, 2015
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS
- Publication number 20150001714
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
- Publication number 20140319692
- Publication date Oct 30, 2014
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Trench in Packages Incorporating Hybrid Bonding
- Publication number 20140264948
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structures and Methods of Forming the Same
- Publication number 20140252635
- Publication date Sep 11, 2014
- Luan C. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC UNIT AND PACKAGE WITH POSITIONAL REVERSAL
- Publication number 20140239491
- Publication date Aug 28, 2014
- Invensas Corporation
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS
- Publication number 20140151879
- Publication date Jun 5, 2014
- Disco Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
- Publication number 20120241946
- Publication date Sep 27, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
- Publication number 20110248399
- Publication date Oct 13, 2011
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming high routing density int...

Stress-resilient chip structure and dicing process

Hybrid bonding with air-gap structure

Hollow-cavity flip-chip package with reinforced interconnects and p...

Air trench in packages incorporating hybrid bonding

Air trench in packages incorporating hybrid bonding

Ultra-thin semiconductor device and preparation method thereof

Bonding structures and methods of forming the same

Hybrid bonding with air-gap structure

Microelectronic unit and package with positional reversal

Semiconductor stacked package

Ultra-thin semiconductor device and preparation method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING...

HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND P...

HYBRID BONDING WITH AIR-GAP STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Bonding Structures and Methods of Forming the Same

SEMICONDUCTOR STACKED PACKAGE

ULTRA-THIN SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF

MICROELECTRONIC UNIT AND PACKAGE WITH POSITIONAL REVERSAL

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS

Semiconductor Device and Method of Forming High Routing Density Int...

Air Trench in Packages Incorporating Hybrid Bonding

Bonding Structures and Methods of Forming the Same

MICROELECTRONIC UNIT AND PACKAGE WITH POSITIONAL REVERSAL

STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS

Semiconductor Device and Method of Forming High Routing Density Int...

Semiconductor Device and Method of Forming High Routing Density Int...