Structure

Industry

CPC
H01L2224/0801

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0801Structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package with built-in electronic components and electronic device
- Patent number 12,148,724
- Issue date Nov 19, 2024
- Fujitsu Limited
- Yukiko Oshikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding method and semiconductor chip structure
- Patent number 12,119,315
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,107,060
- Issue date Oct 1, 2024
- Intel Corproation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,062,631
- Issue date Aug 13, 2024
- Intel Corporation
- Adel A Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid pocket post and tailored via dielectric for 3D-integrated el...
- Patent number 12,002,773
- Issue date Jun 4, 2024
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,948,881
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-on-wafer formed memory and logic for genomic annotations
- Patent number 11,915,742
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 11,776,923
- Issue date Oct 3, 2023
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structure and hybrid bonding method
- Patent number 11,756,922
- Issue date Sep 12, 2023
- Huawei Technologies Co., Ltd.
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through semiconductor via and method for...
- Patent number 11,664,364
- Issue date May 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding region of a carrier of light emitting package and manu...
- Patent number 11,456,405
- Issue date Sep 27, 2022
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Chen-Hsiu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern decomposition lithography techniques
- Patent number 11,107,786
- Issue date Aug 31, 2021
- Intel Corporation
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,069,614
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,950,637
- Issue date Mar 16, 2021
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress pad structure for packaged devices
- Patent number 10,937,750
- Issue date Mar 2, 2021
- NXP B.V.
- Paul Southworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulating resin
- Patent number 10,784,177
- Issue date Sep 22, 2020
- Shinko Electric Industries Co., Ltd.
- Seiji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor structure
- Patent number 10,692,809
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,615,210
- Issue date Apr 7, 2020
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,586,746
- Issue date Mar 10, 2020
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern decomposition lithography techniques
- Patent number 10,490,519
- Issue date Nov 26, 2019
- Intel Corporation
- Charles H. Wallace
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Releasable carrier method
- Patent number 10,354,907
- Issue date Jul 16, 2019
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,332,927
- Issue date Jun 25, 2019
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20250105181
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE
- Publication number 20250104761
- Publication date Mar 27, 2025
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY TILE WITH PROBE PAD ARRANGEMENT AND STACKED MEMORY DEVICE
- Publication number 20250105123
- Publication date Mar 27, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Takeo Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
- Publication number 20250079354
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Steven Sze Hang Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054891
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing warpage in a package of stacked integrated circuit dies
- Publication number 20250029948
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF
- Publication number 20250015007
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding structure
- Publication number 20250006684
- Publication date Jan 2, 2025
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006644
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...
- Publication number 20250006251
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20240355768
- Publication date Oct 24, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND CHIP THEREOF
- Publication number 20240347493
- Publication date Oct 17, 2024
- CHIPBOND TECHNOLOGY CORPORATION
- Wei-Hsin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
- Publication number 20240312874
- Publication date Sep 19, 2024
- SERIPHY TECHNOLOGY CORPORATION
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION AND FORMING METHOD THEREOF
- Publication number 20240234351
- Publication date Jul 11, 2024
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203861
- Publication date Jun 20, 2024
- ROHM CO., LTD.
- Tadayuki SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE WITH SECURITY DIE
- Publication number 20240186269
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20240178187
- Publication date May 30, 2024
- HUAWEI TECHNOLOGIES CO., LTD.
- Shanghsuan CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240170449
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- HYOUNGJOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
- Publication number 20240170442
- Publication date May 23, 2024
- ASMPT Singapore Pte. Ltd.
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...
- Publication number 20240170350
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Providing an Even Current Distribution and St...
- Publication number 20240170377
- Publication date May 23, 2024
- Infineon Technologies Austria AG
- Bernd Schmoelzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION AND FORMING METHOD THEREOF
- Publication number 20240136313
- Publication date Apr 25, 2024
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...
- Publication number 20240096840
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096831
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Enbin Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063160
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20240055379
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- HASEOB SEONG
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device, semiconductor package and method of manufactu...

Semiconductor package and method of fabricating the same

Signal routing between memory die and logic die

Package with built-in electronic components and electronic device

Semiconductor package

Bonded assembly containing different size opposing bonding pads and...

Chip bonding method and semiconductor chip structure

Memory device for wafer-on-wafer formed memory and logic

Signal routing between memory die and logic die for mode based oper...

Microelectronic assemblies with inductors in direct bonding regions

Microelectronic assemblies with inductors in direct bonding regions

Bonding structure and method thereof

Hybrid pocket post and tailored via dielectric for 3D-integrated el...

Semiconductor structure

Wafer-on-wafer formed memory and logic for genomic annotations

Semiconductor device, manufacturing method, solid state image senso...

Hybrid bonding structure and hybrid bonding method

Semiconductor device with through semiconductor via and method for...

Chip bonding region of a carrier of light emitting package and manu...

Pattern decomposition lithography techniques

Semiconductor package structure

Semiconductor device, manufacturing method, solid state image senso...

Low stress pad structure for packaged devices

Semiconductor device with encapsulating resin

Manufacturing method for semiconductor structure

Semiconductor device, manufacturing method, solid state image senso...

Semiconductor device and method

Pattern decomposition lithography techniques

Releasable carrier method

Semiconductor device, manufacturing method, solid state image senso...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE

MEMORY TILE WITH PROBE PAD ARRANGEMENT AND STACKED MEMORY DEVICE

LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Reducing warpage in a package of stacked integrated circuit dies

VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF

Bonding structure

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

SEMICONDUCTOR PACKAGE AND CHIP THEREOF

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...

BONDING STRUCTURE AND METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRICAL CONNECTION AND FORMING METHOD THEREOF

SEMICONDUCTOR DEVICE

BONDED STRUCTURE WITH SECURITY DIE

CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

HYBRID BONDING OF A THIN SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...

Semiconductor Package Providing an Even Current Distribution and St...

ELECTRICAL CONNECTION AND FORMING METHOD THEREOF

SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME