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H01L2224/29541

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29541Structure

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Patents Grantslast 30 patents

Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 11,837,568
- Issue date Dec 5, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical bonding method and joined structure
- Patent number 11,450,643
- Issue date Sep 20, 2022
- Tohoku University
- Takehito Shimatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220344298
- Publication date Oct 27, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...
- Publication number 20220310546
- Publication date Sep 29, 2022
- NAGASE CHEMTEX CORPORATION
- Daisuke MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL BONDING METHOD AND JOINED STRUCTURE
- Publication number 20220199569
- Publication date Jun 23, 2022
- TOHOKU UNIVERSITY
- Takehito SHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140106160
- Publication date Apr 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHANG-CHIN WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...