Structure

Industry

CPC
H01L2224/3001

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/3001Structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming solder bumps
- Patent number 10,840,202
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,833,035
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,797,011
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and package
- Patent number 10,096,567
- Issue date Oct 9, 2018
- Winbond Electronics Corp.
- Yu-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and manufacturing method thereof and package
- Patent number 9,991,222
- Issue date Jun 5, 2018
- Winbound Electronics Corp.
- Yu-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked memory chips
- Patent number 9,214,441
- Issue date Dec 15, 2015
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection method, connection structure, insulating adhesive member...
- Patent number 9,190,381
- Issue date Nov 17, 2015
- Dexerials Corporation
- Ryoji Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages containing stacked microelectronic devices...
- Patent number 9,111,870
- Issue date Aug 18, 2015
- Freescale Semiconductor Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor chip assembly with metal pillar an...
- Patent number 7,811,863
- Issue date Oct 12, 2010
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SOLDER BUMPS
- Publication number 20180374812
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND PACKAGE
- Publication number 20180204817
- Publication date Jul 19, 2018
- WINBOND ELECTRONICS CORP.
- Yu-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SOLDER BUMPS
- Publication number 20180076164
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF AND PACKAGE
- Publication number 20180033763
- Publication date Feb 1, 2018
- WINBOND ELECTRONICS CORP.
- Yu-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES CONTAINING STACKED MICROELECTRONIC DEVICES...
- Publication number 20150108661
- Publication date Apr 23, 2015
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150048521
- Publication date Feb 19, 2015
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION METHOD, CONNECTION STRUCTURE, INSULATING ADHESIVE MEMBER...
- Publication number 20140346684
- Publication date Nov 27, 2014
- DEXERIALS CORPORATION
- Ryoji Kojima
- B28 - WORKING CEMENT, CLAY, OR STONE

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming solder bumps

Method of forming solder bumps

Method of forming solder bumps

Package substrate and package

Package substrate and manufacturing method thereof and package

Semiconductor package including stacked memory chips

Connection method, connection structure, insulating adhesive member...

Microelectronic packages containing stacked microelectronic devices...

Method of making a semiconductor chip assembly with metal pillar an...

Patents Applicationslast 30 patents

METHOD OF FORMING SOLDER BUMPS

PACKAGE SUBSTRATE AND PACKAGE

METHOD OF FORMING SOLDER BUMPS

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF AND PACKAGE

MICROELECTRONIC PACKAGES CONTAINING STACKED MICROELECTRONIC DEVICES...

SEMICONDUCTOR PACKAGE

CONNECTION METHOD, CONNECTION STRUCTURE, INSULATING ADHESIVE MEMBER...