Structures specially adapted for transferring the charges across the imager perpendicular to the imaging plane

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H01L27/14638

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14638Structures specially adapted for transferring the charges across the imager perpendicular to the imaging plane

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Imaging device including signal line and unit pixel cell including...
- Patent number 12,160,673
- Issue date Dec 3, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,132,067
- Issue date Oct 29, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Yuchao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package
- Patent number 12,113,087
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Ji-hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with tolerance optimizing interconnects
- Patent number 12,100,716
- Issue date Sep 24, 2024
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, semiconductor element preparing method, and...
- Patent number 12,094,898
- Issue date Sep 17, 2024
- Ningbo ABAX Sensing Electronic Technology Co., Ltd.
- Shuyu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element and imaging device
- Patent number 12,087,798
- Issue date Sep 10, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Katsumi Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,087,791
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Eunsub Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device that is provided with peripheral circuits to pr...
- Patent number 12,088,939
- Issue date Sep 10, 2024
- Canon Kabushiki Kaisha
- Takafumi Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating image sensor
- Patent number 12,080,746
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method of manufacturing same
- Patent number 12,074,189
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Sangsu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, with transfer transistor gate electrode...
- Patent number 12,068,352
- Issue date Aug 20, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takahiro Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive imaging devices and associated methods
- Patent number 12,057,464
- Issue date Aug 6, 2024
- SiOnyx, LLC
- Homayoon Haddad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element and imaging device
- Patent number 12,040,340
- Issue date Jul 16, 2024
- Sony Corporation
- Hideaki Togashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, method of manufacturing the same, and e...
- Patent number 12,015,040
- Issue date Jun 18, 2024
- Sony Corporation
- Shigehiro Ikehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging element and solid-state imaging apparatus
- Patent number 12,002,826
- Issue date Jun 4, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hiroaki Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical transfer structures
- Patent number 11,990,496
- Issue date May 21, 2024
- OmniVision Technologies, Inc.
- Qin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device having a semiconductor substrate wi...
- Patent number 11,990,485
- Issue date May 21, 2024
- Canon Kabushiki Kaisha
- Junya Tamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging element and electronic device
- Patent number 11,973,103
- Issue date Apr 30, 2024
- Sony Group Corporation
- Kyosuke Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for sub-column parallel digitizers for hybrid sta...
- Patent number 11,973,090
- Issue date Apr 30, 2024
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 11,961,865
- Issue date Apr 16, 2024
- Sony Group Corporation
- Hideaki Togashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge release layer to remove charge carriers from dielectric grid...
- Patent number 11,948,962
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Chung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, method for manufacturing the same, and...
- Patent number 11,942,502
- Issue date Mar 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kyohei Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors
- Patent number 11,935,906
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Jonghyun Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors
- Patent number 11,929,375
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jonghyun Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and imaging apparatus
- Patent number 11,929,376
- Issue date Mar 12, 2024
- Sony Group Corporation
- Tetsuji Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illuminated image sensor with reduced sidewall-induced le...
- Patent number 11,901,396
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and imaging apparatus
- Patent number 11,869,907
- Issue date Jan 9, 2024
- Sony Group Corporation
- Tetsuji Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,848,337
- Issue date Dec 19, 2023
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor having indented photodiode structure
- Patent number 11,843,007
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,843,020
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Changhwa Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...
- Publication number 20240421177
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240387594
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuichiro YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20240387593
- Publication date Nov 21, 2024
- Sony Semiconductor Solutions Corporation
- SHOTA MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING IMAGE SENSOR
- Publication number 20240371909
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240339478
- Publication date Oct 10, 2024
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Olivier Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS
- Publication number 20240339479
- Publication date Oct 10, 2024
- SiOnyx, LLC.
- Homayoon Haddad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...
- Publication number 20240266379
- Publication date Aug 8, 2024
- SONY GROUP CORPORATION
- Hideaki TOGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240258357
- Publication date Aug 1, 2024
- Sony Semiconductor Solutions Corporation
- Kodai KANEYASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL STRUCTURE WITH IMPROVED PHOTOELECTRIC CONVERSION EFFICIENCY I...
- Publication number 20240250096
- Publication date Jul 25, 2024
- PIXART IMAGING INC.
- Kazufumi SHIOZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS
- Publication number 20240234470
- Publication date Jul 11, 2024
- SiOnyx, LLC.
- Homayoon Haddad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSORS
- Publication number 20240186344
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jonghyun GO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSORS
- Publication number 20240186345
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jonghyun GO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT AND IMAGING DEVICE
- Publication number 20240113148
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Tetsushi Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
- Publication number 20240113145
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Hiroki TOJINBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240088191
- Publication date Mar 14, 2024
- Sony Semiconductor Solutions Corporation
- Kazuki NOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR HAVING INDENTED PHOTODIODE STRUCTURE
- Publication number 20240063234
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND...
- Publication number 20240047499
- Publication date Feb 8, 2024
- Sony Semiconductor Solutions Corporation
- Kyohei MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING SOLID-STAT...
- Publication number 20240047490
- Publication date Feb 8, 2024
- SONY GROUP CORPORATION
- Ryosuke NAKAMURA
- G01 - MEASURING TESTING
Information Patent Application
PHOTOELECTRIC CONVERSION ELEMENT, PHOTODETECTOR, PHOTODETECTION SYS...
- Publication number 20240006426
- Publication date Jan 4, 2024
- Sony Semiconductor Solutions Corporation
- Hideaki TOGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH A HIGH ABSORPTION LAYER
- Publication number 20230387150
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20230369374
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuichiro YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, LAMINATED IMAGING ELEMENT, AND SOLID-STATE IMAGING...
- Publication number 20230343807
- Publication date Oct 26, 2023
- Sony Semiconductor Solutions Corporation
- Nobuhiro KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS HAVING OVERLAPPED PARTS OF CHARG...
- Publication number 20230335570
- Publication date Oct 19, 2023
- Canon Kabushiki Kaisha
- Shinichiro Shimizu
- B60 - VEHICLES IN GENERAL
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING APPARATUS
- Publication number 20230326941
- Publication date Oct 12, 2023
- Sony Semiconductor Solutions Corporation
- HIROAKI MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
- Publication number 20230299113
- Publication date Sep 21, 2023
- Sony Semiconductor Solutions Corporation
- SATOKO IIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS
- Publication number 20230282658
- Publication date Sep 7, 2023
- SONY GROUP CORPORATION
- Tetsuji Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE INCLUDING SIGNAL LINE AND UNIT PIXEL CELL INCLUDING...
- Publication number 20230247320
- Publication date Aug 3, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- YOSHIHIRO SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20230238417
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Ji-hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT AND IMAGING DEVICE
- Publication number 20230215880
- Publication date Jul 6, 2023
- SONY GROUP CORPORATION
- Masahiro JOEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSFER STRUCTURES
- Publication number 20230215900
- Publication date Jul 6, 2023
- OMNIVISION TECHNOLOGIES, INC.
- Qin Wang
- H01 - BASIC ELECTRIC ELEMENTS

Structures specially adapted for transferring the charges across the imager perpendicular to the imaging plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Imaging device including signal line and unit pixel cell including...

Image sensor

Image sensor package

Image sensor with tolerance optimizing interconnects

Semiconductor element, semiconductor element preparing method, and...

Imaging element and imaging device

Image sensor

Image pickup device that is provided with peripheral circuits to pr...

Method for fabricating image sensor

Image sensor and method of manufacturing same

Solid-state imaging device, with transfer transistor gate electrode...

Photosensitive imaging devices and associated methods

Imaging element and imaging device

Solid-state imaging device, method of manufacturing the same, and e...

Solid-state imaging element and solid-state imaging apparatus

Vertical transfer structures

Photoelectric conversion device having a semiconductor substrate wi...

Solid-state imaging element and electronic device

System and method for sub-column parallel digitizers for hybrid sta...

Semiconductor device, method of manufacturing a semiconductor devic...

Charge release layer to remove charge carriers from dielectric grid...

Solid-state imaging device, method for manufacturing the same, and...

Image sensors

Image sensors

Solid-state imaging device and imaging apparatus

Back side illuminated image sensor with reduced sidewall-induced le...

Solid-state imaging device and imaging apparatus

Image sensor

CMOS image sensor having indented photodiode structure

Image sensor

Patents Applicationslast 30 patents

BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...

IMAGE SENSOR

SOLID-STATE IMAGING DEVICE

METHOD FOR FABRICATING IMAGE SENSOR

IMAGE SENSOR

PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

PIXEL STRUCTURE WITH IMPROVED PHOTOELECTRIC CONVERSION EFFICIENCY I...

PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS

IMAGE SENSORS

IMAGE SENSORS

IMAGING ELEMENT AND IMAGING DEVICE

SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE

PHOTOELECTRIC CONVERSION DEVICE AND ELECTRONIC APPARATUS

CMOS IMAGE SENSOR HAVING INDENTED PHOTODIODE STRUCTURE

SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND...

SOLID-STATE IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING SOLID-STAT...

PHOTOELECTRIC CONVERSION ELEMENT, PHOTODETECTOR, PHOTODETECTION SYS...

IMAGE SENSOR WITH A HIGH ABSORPTION LAYER

IMAGE SENSOR

IMAGING ELEMENT, LAMINATED IMAGING ELEMENT, AND SOLID-STATE IMAGING...

PHOTOELECTRIC CONVERSION APPARATUS HAVING OVERLAPPED PARTS OF CHARG...

SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE

SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS

IMAGING DEVICE INCLUDING SIGNAL LINE AND UNIT PIXEL CELL INCLUDING...

IMAGE SENSOR PACKAGE

IMAGING ELEMENT AND IMAGING DEVICE

VERTICAL TRANSFER STRUCTURES